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Ferrite Beads and Chips

  • quality EMI suppression component Samsung Electro-Mechanics CIB05J100NC chip bead for electronic equipment factory

    EMI suppression component Samsung Electro-Mechanics CIB05J100NC chip bead for electronic equipment

    Product Overview Samsung Electro-Mechanics offers a range of electronic components, including chip beads and chip inductors, designed for EMI suppression and high-frequency applications. These components are manufactured in compliance with EU RoHS directives and are suitable for various electronic equipment such as computers, printers, VCRs, TVs, and mobile phones. Key product series include CIB/CIM for general EMI suppression, CIC/CIS for high current applications, and CIV

  • quality Chip Inductors and Beads Samsung Electro-Mechanics CIB32P600NE for Electronic Circuit Performance factory

    Chip Inductors and Beads Samsung Electro-Mechanics CIB32P600NE for Electronic Circuit Performance

    Samsung Chip Inductors and Beads Samsung Electro-Mechanics offers a comprehensive range of chip inductors and beads designed for various electronic applications. These components are manufactured in accordance with EU RoHS directives and are free from restricted materials and ozone-depleting substances. The product portfolio includes Chip Beads (CIB/CIM Series for EMI Suppression), Power Inductors (CIGT, CIG, CIH, CIL Series), High Current Chip Beads (CIC/CIS Series), GHz

  • quality High Impedance Chip Beads Samsung Electro-Mechanics CIV05J102NC for Noise Suppression in Electronic Devices factory

    High Impedance Chip Beads Samsung Electro-Mechanics CIV05J102NC for Noise Suppression in Electronic Devices

    Product Overview The CIV Series Chip Beads are designed for high-impedance applications in the GHz band, effectively suppressing noise generated by high-frequency electronic appliances, high-speed data, and mass storage. They offer excellent solderability and high heat resistance, suitable for both flow and reflow soldering processes. Constructed with monolithic inorganic material, these chip beads ensure high reliability and are ideal for high-frequency EMI prevention in

  • quality EMI Suppression Chip Bead Samsung Electro-Mechanics CIS10P260AC Suitable for High Current Circuits factory

    EMI Suppression Chip Bead Samsung Electro-Mechanics CIS10P260AC Suitable for High Current Circuits

    Product Overview The CIS10P Series is a line of small chip beads designed for high current applications, offering effective EMI suppression in power lines. These beads are suitable for use in compact electronic devices due to their small footprint (1608/EIA 0603 package size). They are engineered to handle currents up to approximately 6A, making them ideal for demanding power supply filtering requirements. Product Attributes Brand/Series: CIS10P Series Type: Chip Bead

  • quality Chip bead Samsung Electro-Mechanics CIM05U221NC with excellent solderability and high heat tolerance factory

    Chip bead Samsung Electro-Mechanics CIM05U221NC with excellent solderability and high heat tolerance

    Product Overview The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for high-frequency EMI suppression in electronic devices such as computers, printers, VCRs, TVs, and mobile phones. These monolithic inorganic material components offer high reliability with a closed magnetic circuit configuration that prevents crosstalk, making them suitable for high-density PCBs. Their perfect shape ensures automatic mounting without directionality, and they exhibit excellent

  • quality Samsung Electro Mechanics CIV05J182NC chip beads designed for high heat resistance and solderability factory

    Samsung Electro Mechanics CIV05J182NC chip beads designed for high heat resistance and solderability

    Product Overview The CIV Series Chip Beads are designed for high-frequency noise suppression in the GHz band, effectively mitigating EMI generated by high-speed data and electronic appliances. These monolithic inorganic components offer excellent solderability and high heat resistance, making them suitable for both flow and reflow soldering processes. Their construction ensures high reliability for demanding applications in computers, printers, VCRs, TVs, and mobile phones.

  • quality Noise Suppression Solutions Samsung Electro-Mechanics CIS21J121NE Chip Beads for Power Line Circuits factory

    Noise Suppression Solutions Samsung Electro-Mechanics CIS21J121NE Chip Beads for Power Line Circuits

    Product Overview The CIS series chip beads are designed for high current applications, with a rated current of approximately 6A. They are effective in noise suppression for power lines. This series offers various impedance and thickness options to suit different design requirements. Product Attributes Brand: CIS Series Type: Chip Beads Application: Noise Suppression in power line Technical Specifications Part No. Thickness (mm) Impedance () 25% @ 100MHz DC Resistance () Max.

  • quality High Heat Resistant Chip Beads Samsung Electro-Mechanics CIM10U601NC for High Density PCB and EMI Suppression factory

    High Heat Resistant Chip Beads Samsung Electro-Mechanics CIM10U601NC for High Density PCB and EMI Suppression

    Product Overview The CIB/CIM10 Series (1608/EIA 0603) are monolithic inorganic material chip beads designed for high-frequency EMI prevention. They are ideal for applications in computers, printers, VCRs, TVs, and mobile phones. These components feature a perfect shape for automatic mounting with no directionality, excellent solderability, and high heat resistance suitable for both flow and reflow soldering. Their closed magnetic circuit configuration effectively avoids

  • quality High Frequency EMI Suppression Chip Bead Samsung Electro-Mechanics CIM05J182NC 1005 EIA 0402 for PCB factory

    High Frequency EMI Suppression Chip Bead Samsung Electro-Mechanics CIM05J182NC 1005 EIA 0402 for PCB

    Product Overview The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for high-frequency EMI suppression. Featuring a monolithic inorganic material construction for high reliability and a closed magnetic circuit configuration to prevent crosstalk, these components are ideal for high-density PCBs. Their perfect shape ensures automatic mounting without directionality, and they offer excellent solderability and high heat resistance suitable for both flow and reflow

  • quality Automatic Mounting Compatible Chip Beads Samsung Electro-Mechanics CIM10F600NC for High Frequency EMI factory

    Automatic Mounting Compatible Chip Beads Samsung Electro-Mechanics CIM10F600NC for High Frequency EMI

    Product Overview The CIB/CIM10 Series (1608/EIA 0603) are monolithic inorganic material chip beads designed for high-frequency EMI prevention. These components offer perfect shape for automatic mounting with no directionality, excellent solderability, and high heat resistance suitable for flow or reflow soldering. Their closed magnetic circuit configuration effectively avoids crosstalk, making them ideal for high-density PCBs. Applications include computers, printers, VCRs,

  • quality Power Line Noise Suppression Component Samsung Electro-Mechanics CIC31P151NE Chip Bead for High Current factory

    Power Line Noise Suppression Component Samsung Electro-Mechanics CIC31P151NE Chip Bead for High Current

    Product Overview The CIC31 Series is a range of chip beads designed for high current applications, offering effective noise suppression in power lines. These components are suitable for currents up to approximately 3A and are available in the 3216/EIA 1206 package size. They are ideal for applications requiring reliable noise filtering in power circuits. Product Attributes Product Type: Chip Bead Series: CIC31 Series Standard Size: 3216/EIA 1206 Key Feature: For High Current

  • quality Automatic Mounting Compatible Chip Bead Samsung Electro-Mechanics CIM05J121NC for Electronic Devices factory

    Automatic Mounting Compatible Chip Bead Samsung Electro-Mechanics CIM05J121NC for Electronic Devices

    Product Overview The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for EMI suppression in high-frequency applications. These monolithic inorganic material construction components offer high reliability and excellent solderability for both flow and reflow soldering. Their closed magnetic circuit configuration prevents crosstalk, making them suitable for high-density PCBs. The perfect shape for automatic mounting ensures no directionality. Applications include