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Specifications
Mfr. Part #:
CIM10U601NC
Key Attributes
Model Number:
CIM10U601NC
Product Description
Product Overview
The CIB/CIM10 Series (1608/EIA 0603) are monolithic inorganic material chip beads designed for high-frequency EMI prevention. They are ideal for applications in computers, printers, VCRs, TVs, and mobile phones. These components feature a perfect shape for automatic mounting with no directionality, excellent solderability, and high heat resistance suitable for both flow and reflow soldering. Their closed magnetic circuit configuration effectively avoids crosstalk, making them suitable for high-density PCBs.
Product Attributes
- Type: Chip Beads
- Construction: Monolithic inorganic material
- Magnetic Circuit: Closed
- Mounting: Perfect shape for automatic mounting, no directionality
- Soldering: Excellent solderability and high heat resistance for flow or reflow soldering
Technical Specifications
| Part No. | Type | Thickness (mm) | Impedance () 25% @100MHz | DC Resistance () Max. | Rated Current (mA) Max. | Application |
|---|---|---|---|---|---|---|
| CIB10P100 | Chip | 0.8 0.15 | 10 | 0.05 | 1000 | EMI Suppression |
| CIB10P220 | Chip | 0.8 0.15 | 22 | 0.05 | 1500 | EMI Suppression |
| CIB10P260 | Chip | 0.8 0.15 | 26 | 0.08 | 1000 | EMI Suppression |
| CIB10P300 | Chip | 0.8 0.15 | 30 | 0.08 | 1000 | EMI Suppression |
| CIB10P330 | Chip | 0.8 0.15 | 33 | 0.08 | 1000 | EMI Suppression |
| CIM10U600 | Bead | 0.8 0.15 | 60 | 0.15 | 600 | EMI Suppression |
| CIM10U800 | Bead | 0.8 0.15 | 80 | 0.10 | 600 | EMI Suppression |
| CIM10U121 | Bead | 0.8 0.15 | 120 | 0.15 | 500 | EMI Suppression |
| CIM10U221 | Bead | 0.8 0.15 | 220 | 0.25 | 400 | EMI Suppression |
| CIM10U241 | Bead | 0.8 0.15 | 240 | 0.25 | 400 | EMI Suppression |
| CIM10U301 | Bead | 0.8 0.15 | 300 | 0.30 | 400 | EMI Suppression |
| CIM10U471 | Bead | 0.8 0.15 | 470 | 0.35 | 300 | EMI Suppression |
| CIM10U601 | Bead | 0.8 0.15 | 600 | 0.38 | 500 | EMI Suppression |
| CIM10U102 | Bead | 0.8 0.15 | 1000 | 0.50 | 400 | EMI Suppression |
| CIM10U202 | Bead | 0.8 0.15 | 2000 (at 70MHz) | 1.20 | 200 | EMI Suppression |
| CIB10J300 | Chip | 0.8 0.15 | 30 | 0.10 | 1000 | EMI Suppression |
| CIM10J400 | Bead | 0.8 0.15 | 40 | 0.12 | 600 | EMI Suppression |
| CIM10J470 | Bead | 0.8 0.15 | 47 | 0.12 | 600 | EMI Suppression |
| CIM10J600 | Bead | 0.8 0.15 | 60 | 0.12 | 600 | EMI Suppression |
| CIM10J750 | Bead | 0.8 0.15 | 75 | 0.15 | 550 | EMI Suppression |
| CIM10J800 | Bead | 0.8 0.15 | 80 | 0.15 | 550 | EMI Suppression |
| CIM10J121 | Bead | 0.8 0.15 | 120 | 0.20 | 500 | EMI Suppression |
| CIM10J151 | Bead | 0.8 0.15 | 150 | 0.20 | 400 | EMI Suppression |
| CIM10J221 | Bead | 0.8 0.15 | 220 | 0.30 | 400 | EMI Suppression |
| CIM10J241 | Bead | 0.8 0.15 | 240 | 0.30 | 400 | EMI Suppression |
| CIM10J301 | Bead | 0.8 0.15 | 300 | 0.35 | 400 | EMI Suppression |
| CIM10J331 | Bead | 0.8 0.15 | 330 | 0.35 | 400 | EMI Suppression |
| CIM10J471 | Bead | 0.8 0.15 | 470 | 0.35 | 300 | EMI Suppression |
| CIM10J601 | Bead | 0.8 0.15 | 600 | 0.45 | 300 | EMI Suppression |
| CIM10J751 | Bead | 0.8 0.15 | 750 | 0.50 | 300 | EMI Suppression |
| CIM10J102 | Bead | 0.8 0.15 | 1000 | 0.60 | 250 | EMI Suppression |
| CIM10J152 | Bead | 0.8 0.15 | 1500 | 0.70 | 250 | EMI Suppression |
| CIM10J252 | Bead | 0.8 0.15 | 2500 | 1.50 | 200 | EMI Suppression |
| CIM10K152 | Bead | 0.8 0.15 | 1500 | 0.80 | 250 | EMI Suppression |
| CIM10K202 | Bead | 0.8 0.15 | 2000 | 1.00 | 200 | EMI Suppression |
| CIM10K252 | Bead | 0.8 0.15 | 2500 | 1.20 | 200 | EMI Suppression |
| CIM10N700 | Bead | 0.8 0.15 | 70 | 0.30 | 500 | EMI Suppression |
| CIM10N121 | Bead | 0.8 0.15 | 120 | 0.45 | 400 | EMI Suppression |
| CIM10N241 | Bead | 0.8 0.15 | 240 | 0.60 | 300 | EMI Suppression |
| CIM10F470 | Bead | 0.8 0.15 | 47 | 0.25 | 550 | EMI Suppression |
| CIM10F600 | Bead | 0.8 0.15 | 60 | 0.25 | 550 | EMI Suppression |
| CIM10F121 | Bead | 0.8 0.15 | 120 | 0.30 | 500 | EMI Suppression |
| CIM10F331 | Bead | 0.8 0.15 | 330 | 0.58 | 400 | EMI Suppression |
| CIM10F471 | Bead | 0.8 0.15 | 470 | 0.85 | 300 | EMI Suppression |
Product Identification Key
- (1) Type: Chip Beads
- (2) Construction: M: Multi-layer type, B: Mono-layer type
- (3) Dimension
- (4) Material Code
- (5) Nominal impedance (e.g., 121:120, 202:2000)
- (6) Thickness option: N: Standard, A: Thinner than standard, B: Thicker than standard
- (7) Packaging: C: Paper tape (7"), D: Paper tape (13"), E: Embossed tape
Recommended Soldering Conditions
Reflow Soldering
Refer to datasheet for specific conditions.
Flow Soldering
Refer to datasheet for specific conditions.
Packaging
| Packaging Style | Quantity (pcs/reel) |
|---|---|
| Card Board Taping (7") | 4,000 |
| Card Board Taping (13") | 16,000 |
2412111104_Samsung-Electro-Mechanics-CIM10U601NC_C20429235.pdf
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