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quality Power Line Noise Suppression Component Samsung Electro-Mechanics CIC31P151NE Chip Bead for High Current factory
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quality Power Line Noise Suppression Component Samsung Electro-Mechanics CIC31P151NE Chip Bead for High Current factory
quality Power Line Noise Suppression Component Samsung Electro-Mechanics CIC31P151NE Chip Bead for High Current factory
quality Power Line Noise Suppression Component Samsung Electro-Mechanics CIC31P151NE Chip Bead for High Current factory
>
Specifications
Mfr. Part #:
CIC31P151NE
Key Attributes
Model Number: CIC31P151NE
Product Description

Product Overview

The CIC31 Series is a range of chip beads designed for high current applications, offering effective noise suppression in power lines. These components are suitable for currents up to approximately 3A and are available in the 3216/EIA 1206 package size. They are ideal for applications requiring reliable noise filtering in power circuits.

Product Attributes

  • Product Type: Chip Bead
  • Series: CIC31 Series
  • Standard Size: 3216/EIA 1206
  • Key Feature: For High Current Applications (~ up to 3A)
  • Function: Noise Suppression in Power Line
  • Packaging Style: Embossed Taping
  • Quantity per Reel: 3,000 pcs

Technical Specifications

Dimensions:

Type Dimension [mm] L W t d
CIC31 Series 3.2 0.2 1.6 0.2 1.1 0.2 0.5 +0.2 / -0.3 N/A

Recommended Land Pattern:

Dimension Width Length
CIC31 Series 0.6 ~ 1.5 mm 1.8 ~ 2.5 mm
CIC31 Series (for t=1.1mm) 1.2 ~ 2.0 mm N/A

Product Identification and Specifications:

Part No. Thickness (mm) Impedance () 25% @ 100MHz DC Resistance () Max. Rated Current (mA) Max.
CIC31P260 1.1 0.2 26 0.01 6000
CIC31P300 1.1 0.2 30 0.01 6000
CIC31P310 1.1 0.2 31 0.01 6000
CIC31P330 1.1 0.2 33 0.01 6000
CIC31P350 1.1 0.2 35 0.025 3000
CIC31P500 1.1 0.2 50 0.025 3000
CIC31P520 1.1 0.2 52 0.025 3000
CIC31P600 1.1 0.2 60 0.025 3000
CIC31P680 1.1 0.2 68 0.025 3000
CIC31P700 1.1 0.2 70 0.025 3000
CIC31P800 1.1 0.2 80 0.025 3000
CIC31P900 1.1 0.2 90 0.025 2000
CIC31P121 1.1 0.2 120 0.025 2000
CIC31P151 1.1 0.2 150 0.05 2000
CIC31P221 1.1 0.2 220 0.05 2000
CIC31P301 1.1 0.2 300 0.05 2000
CIC31P391 1.1 0.2 390 0.05 2000
CIC31P471 1.1 0.2 470 0.07 1500
CIC31P601 1.1 0.2 600 0.07 1500
CIC31J300 1.1 0.2 30 0.02 4000
CIC31J500 1.1 0.2 50 0.02 4000
CIC31J680 1.1 0.2 68 0.02 4000
CIC31J800 1.1 0.2 80 0.02 4000
CIC31J900 1.1 0.2 90 0.02 4000
CIC31J121 1.1 0.2 120 0.03 4000
CIC31J151 1.1 0.2 150 0.03 3000
CIC31J241 1.1 0.2 240 0.05 3000
CIC31J301 1.1 0.2 300 0.05 3000
CIC31J471 1.1 0.2 470 0.05 3000
CIC31J501 1.1 0.2 500 0.05 3000
CIC31J601 1.1 0.2 600 0.05 2500

Product Identification Code Structure:

Position Meaning
(1) Chip Beads
(2) For High current (C:~3A)
(3) Dimension (e.g., 31 for 3216/1206 size)
(4) Material Code
(5) Nominal Impedance (e.g., 300 for 30, 221 for 220)
(6) Thickness Option (N: Standard, A: Thinner, B: Thicker)
(7) Packaging (C: Paper Tape, E: Embossed Tape)

Soldering Conditions:

  • Reflow Soldering: Refer to typical conditions.
  • Flow Soldering: Refer to typical conditions.

2411010939_Samsung-Electro-Mechanics-CIC31P151NE_C19747529.pdf

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