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Specifications
Mfr. Part #:
CIV05J182NC
Key Attributes
Model Number:
CIV05J182NC
Product Description
Product Overview
The CIV Series Chip Beads are designed for high-frequency noise suppression in the GHz band, effectively mitigating EMI generated by high-speed data and electronic appliances. These monolithic inorganic components offer excellent solderability and high heat resistance, making them suitable for both flow and reflow soldering processes. Their construction ensures high reliability for demanding applications in computers, printers, VCRs, TVs, and mobile phones.
Product Attributes
- Product Type: Chip Beads
- Construction: Monolithic inorganic material
- Series: CIV Series (1005/ EIA 0402)
- Material: Not specified
- Origin: Not specified
Technical Specifications
| Part No. | Impedance () 25% @100MHz | Impedance () 40% @1GHz | DC Resistance () Max. | Rated Current (mA) Max. |
|---|---|---|---|---|
| CIV05U601 | 600 | 1000 | 0.7 | 300 |
| CIV05U102 | 1000 | 1400 | 1.1 | 250 |
| CIV05J102 | 1000 | 2000 | 1.25 | 250 |
| CIV05J182 | 1800 | 2700 | 2.20 | 200 |
Dimensions
| Type | Dimension [mm] (L) | Dimension [mm] (W) | Dimension [mm] (t) | Dimension [mm] (d) |
|---|---|---|---|---|
| Chip Bead | 1.0 0.05 | 0.5 0.05 | 0.5 0.05 | 0.25 0.1 |
Recommended Land Pattern
| L | 0.40~0.50mm |
| W | 0.40~0.50mm |
| t | 0.45~0.55mm |
| d | 0.45~0.55mm |
Recommended Soldering Conditions
Reflow Soldering
Data not specified.
Flow Soldering
Data not specified.
Packaging
| Packaging Style | Quantity (pcs/reel) |
|---|---|
| Card Board Taping | 4000 |
Product Identification Key
CIV05U102NC
- (1) Chip Beads
- (2) Multi-layer type for GHz Noise suppression
- (3) Dimension
- (4) Material Code
- (5) Nominal impedance (601:600, 102:1000)
- (6) Thickness option (N: Standard, A: Thinner than standard, B: Thicker than standard)
- (7) Packaging (C: paper tape, E: embossed tape)
2411010939_Samsung-Electro-Mechanics-CIV05J182NC_C19734064.pdf
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