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Specifications
Mfr. Part #:
CIV05J102NC
Key Attributes
Model Number:
CIV05J102NC
Product Description
Product Overview
The CIV Series Chip Beads are designed for high-impedance applications in the GHz band, effectively suppressing noise generated by high-frequency electronic appliances, high-speed data, and mass storage. They offer excellent solderability and high heat resistance, suitable for both flow and reflow soldering processes. Constructed with monolithic inorganic material, these chip beads ensure high reliability and are ideal for high-frequency EMI prevention in computers, printers, VCRs, TVs, and mobile phones.
Product Attributes
- Brand: CIV Series
- Type: Chip Beads
- Construction: Monolithic inorganic material
Technical Specifications
| Part No. | Impedance () 25% @ 100MHz | Impedance () 40% @ 1GHz | DC Resistance () Max. | Rated Current (mA) Max. | Dimension [mm] (L x W x t) | Recommended Land Pattern [mm] (L x W) |
| CIV05U601 | 600 | 1000 | 0.7 | 300 | 1.0 0.05 x 0.5 0.05 x 0.5 0.05 | 0.40~0.50 x 0.40~0.50 |
| CIV05U102 | 1000 | 1400 | 1.1 | 250 | 1.0 0.05 x 0.5 0.05 x 0.5 0.05 | 0.40~0.50 x 0.40~0.50 |
| CIV05J102 | 1000 | 2000 | 1.25 | 250 | 1.0 0.05 x 0.5 0.05 x 0.5 0.05 | 0.45~0.55 x 0.45~0.55 |
| CIV05J182 | 1800 | 2700 | 2.20 | 200 | 1.0 0.05 x 0.5 0.05 x 0.5 0.05 | 0.45~0.55 x 0.45~0.55 |
Product Identification Breakdown:
- (1) Chip Beads
- (2) Multi-layer type for GHz Noise suppression
- (3) Dimension (CIV05 Series: 1005/EIA 0402)
- (4) Material Code
- (5) Nominal impedance (601:600, 102:1000)
- (6) Thickness option (N: Standard, A: Thinner than standard, B: Thicker than standard)
- (7) Packaging (C: paper tape, E: embossed tape)
Packaging Information:
| Packaging Style | Quantity (pcs/reel) |
| Card Board Taping | 4000 |
Recommended Soldering Conditions:
- Reflow Soldering
- Flow Soldering
2410301834_Samsung-Electro-Mechanics-CIV05J102NC_C19732540.pdf
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