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quality EMI Suppression Chip Bead Samsung Electro-Mechanics CIS10P260AC Suitable for High Current Circuits factory
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quality EMI Suppression Chip Bead Samsung Electro-Mechanics CIS10P260AC Suitable for High Current Circuits factory
quality EMI Suppression Chip Bead Samsung Electro-Mechanics CIS10P260AC Suitable for High Current Circuits factory
>
Specifications
Mfr. Part #:
CIS10P260AC
Key Attributes
Model Number: CIS10P260AC
Product Description

Product Overview

The CIS10P Series is a line of small chip beads designed for high current applications, offering effective EMI suppression in power lines. These beads are suitable for use in compact electronic devices due to their small footprint (1608/EIA 0603 package size). They are engineered to handle currents up to approximately 6A, making them ideal for demanding power supply filtering requirements.

Product Attributes

  • Brand/Series: CIS10P Series
  • Type: Chip Bead
  • Dimension Standard: 1608/EIA 0603
  • Packaging Options: Paper tape (C), Embossed tape (E)

Technical Specifications

Part No. Thickness (mm) Impedance () 25% @ 100MHz DC Resistance () Max. Rated Current (mA) Max.
CIS10P260AC 0.6 0.15 26 0.007 6000
CIS10P300AC 0.6 0.15 30 0.01 6000
CIS10P700AC 0.6 0.15 70 0.02 4000
CIS10P101AC 0.6 0.15 100 0.03 3000
CIS10P121AC 0.6 0.15 120 0.03 3000
CIS10P181AC 0.6 0.15 180 0.04 2500
CIS10P221NC 0.8 0.15 220 0.05 2500
CIS10P301NC 0.8 0.15 300 0.07 2000
CIS10P331NC 0.8 0.15 330 0.07 1700
CIS10P391NC 0.8 0.15 390 0.10 1200
CIS10P471NC 0.8 0.15 470 0.13 1500
CIS10P601NC 0.8 0.15 600 0.15 1300

Packaging

Packaging Style Quantity (pcs/reel)
Card Board Taping 4000

2411041619_Samsung-Electro-Mechanics-CIS10P260AC_C19748960.pdf

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