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Specifications
Mfr. Part #:
CIM05J121NC
Key Attributes
Model Number:
CIM05J121NC
Product Description
Product Overview
The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for EMI suppression in high-frequency applications. These monolithic inorganic material construction components offer high reliability and excellent solderability for both flow and reflow soldering. Their closed magnetic circuit configuration prevents crosstalk, making them suitable for high-density PCBs. The perfect shape for automatic mounting ensures no directionality. Applications include computers, printers, VCRs, TVs, and mobile phones.
Product Attributes
- Series: CIB/CIM05
- Type: Chip Bead
- Construction: Monolithic inorganic material
- Magnetic Circuit: Closed
- Mounting: Suitable for automatic mounting
- Solderability: Excellent
- Heat Resistance: High
Technical Specifications
| Part No. | Thickness (mm) | Impedance () 25% @ 100MHz | DC Resistance () Max. | Rated Current (mA) Max. |
|---|---|---|---|---|
| CIB05J100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U300 | 0.5 0.05 | 30 | 0.10 | 700 |
| CIM05U600 | 0.5 0.05 | 60 | 0.15 | 600 |
| CIM05U800 | 0.5 0.05 | 80 | 0.20 | 600 |
| CIM05U121 | 0.5 0.05 | 120 | 0.25 | 600 |
| CIM05U221 | 0.5 0.05 | 220 | 0.35 | 500 |
| CIM05U241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05U301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05U471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05U601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05U102 | 0.5 0.05 | 1000 | 0.80 | 300 |
| CIM05J300 | 0.5 0.05 | 30 | 0.20 | 700 |
| CIM05J600 | 0.5 0.05 | 60 | 0.20 | 650 |
| CIM05J800 | 0.5 0.05 | 80 | 0.25 | 600 |
| CIM05J121 | 0.5 0.05 | 120 | 0.25 | 500 |
| CIM05J221 | 0.5 0.05 | 220 | 0.35 | 400 |
| CIM05J241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05J301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05J471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05J601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05J102 | 0.5 0.05 | 1000 | 0.80 | 250 |
| CIM05J152 | 0.5 0.05 | 1500 | 1.00 | 250 |
| CIM05J182 | 0.5 0.05 | 1800 | 1.40 | 200 |
| CIM05N750 | 0.5 0.05 | 75 | 0.35 | 300 |
| CIM05N121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05N221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05F050 | 0.5 0.05 | 5 | 0.08 | 500 |
| CIM05F100 | 0.5 0.05 | 10 | 0.10 | 300 |
| CIM05F220 | 0.5 0.05 | 22 | 0.20 | 300 |
| CIM05F470 | 0.5 0.05 | 47 | 0.35 | 300 |
| CIM05F750 | 0.5 0.05 | 75 | 0.40 | 300 |
| CIM05F121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05F221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05H800 | 0.5 0.05 | 80 | 0.20 | 450 |
| CIM05H121 | 0.5 0.05 | 120 | 0.25 | 400 |
| CIM05H601 | 0.5 0.05 | 600 | 0.80 | 200 |
Packaging
| Packaging Style | Quantity (pcs/reel) |
|---|---|
| Card Board Taping | 10,000 |
Recommended Soldering Conditions
Reflow Soldering
| Dimension [mm] | L | W | t | d |
|---|---|---|---|---|
| 05 | 1.0 0.05 | 0.5 0.05 | 0.5 0.05 | 0.25 0.1 |
Recommended Land Pattern:
| 0.40~0.50mm | 0.40~0.50mm | 0.45~0.55mm | 0.45~0.55mm |
|---|
Flow Soldering
| Dimension [mm] | L | W | t | d |
|---|---|---|---|---|
| 05 | 1.0 0.05 | 0.5 0.05 | 0.5 0.05 | 0.25 0.1 |
Recommended Land Pattern:
| 0.40~0.50mm | 0.40~0.50mm | 0.45~0.55mm | 0.45~0.55mm |
|---|
2411011116_Samsung-Electro-Mechanics-CIM05J121NC_C20521934.pdf
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