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Specifications
Mfr. Part #:
CIM05J182NC
Key Attributes
Model Number:
CIM05J182NC
Product Description
Product Overview
The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for high-frequency EMI suppression. Featuring a monolithic inorganic material construction for high reliability and a closed magnetic circuit configuration to prevent crosstalk, these components are ideal for high-density PCBs. Their perfect shape ensures automatic mounting without directionality, and they offer excellent solderability and high heat resistance suitable for both flow and reflow soldering. Applications include EMI prevention in computers, printers, VCRs, TVs, and mobile phones.
Product Attributes
- Type: Chip Bead
- Series: CIB/CIM05
- Standard Size: 1005/EIA 0402
- Construction: Monolithic inorganic material
- Magnetic Circuit: Closed
Technical Specifications
| Part No. | Thickness (mm) | Impedance () 25% @ 100MHz | DC Resistance () Max. | Rated Current (mA) Max. |
|---|---|---|---|---|
| CIB05J100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U300 | 0.5 0.05 | 30 | 0.10 | 700 |
| CIM05U600 | 0.5 0.05 | 60 | 0.15 | 600 |
| CIM05U800 | 0.5 0.05 | 80 | 0.20 | 600 |
| CIM05U121 | 0.5 0.05 | 120 | 0.25 | 600 |
| CIM05U221 | 0.5 0.05 | 220 | 0.35 | 500 |
| CIM05U241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05U301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05U471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05U601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05U102 | 0.5 0.05 | 1000 | 0.80 | 300 |
| CIM05J300 | 0.5 0.05 | 30 | 0.20 | 700 |
| CIM05J600 | 0.5 0.05 | 60 | 0.20 | 650 |
| CIM05J800 | 0.5 0.05 | 80 | 0.25 | 600 |
| CIM05J121 | 0.5 0.05 | 120 | 0.25 | 500 |
| CIM05J221 | 0.5 0.05 | 220 | 0.35 | 400 |
| CIM05J241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05J301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05J471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05J601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05J102 | 0.5 0.05 | 1000 | 0.80 | 250 |
| CIM05J152 | 0.5 0.05 | 1500 | 1.00 | 250 |
| CIM05J182 | 0.5 0.05 | 1800 | 1.40 | 200 |
| CIM05N750 | 0.5 0.05 | 75 | 0.35 | 300 |
| CIM05N121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05N221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05F050 | 0.5 0.05 | 5 | 0.08 | 500 |
| CIM05F100 | 0.5 0.05 | 10 | 0.10 | 300 |
| CIM05F220 | 0.5 0.05 | 22 | 0.20 | 300 |
| CIM05F470 | 0.5 0.05 | 47 | 0.35 | 300 |
| CIM05F750 | 0.5 0.05 | 75 | 0.40 | 300 |
| CIM05F121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05F221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05H800 | 0.5 0.05 | 80 | 0.20 | 450 |
| CIM05H121 | 0.5 0.05 | 120 | 0.25 | 400 |
| CIM05H601 | 0.5 0.05 | 600 | 0.80 | 200 |
| DIMENSION (mm) | |||
|---|---|---|---|
| Type | L | W | t |
| Chip Bead | 1.0 0.05 | 0.5 0.05 | 0.5 0.05 |
| RECOMMENDED LAND PATTERN (mm) | |||
|---|---|---|---|
| 0.40~0.50 | 0.45~0.55 | ||
| 0.40~0.50 | 0.45~0.55 | ||
| PRODUCT IDENTIFICATION | (1) | (2) | (3) | (4) | (5) | (6) | (7) |
|---|---|---|---|---|---|---|---|
| CIM05U121N C | Chip Beads | M: Multi-layer type B: Mono-layer type | Dimension | Material Code | Nominal impedance (100:10, 121:120) | Thickness option (N:Standard, A:Thinner than standard, B:Thicker than standard) | Packaging (C:paper tape, E:embossed tape) |
| PACKAGING | Packaging Style | Quantity (pcs/reel) |
|---|---|---|
| Card Board Taping | 10,000 |
| RECOMMENDED SOLDERING CONDITION | REFLOW SOLDERING | FLOW SOLDERING |
|---|---|---|
2411051545_Samsung-Electro-Mechanics-CIM05J182NC_C20546003.pdf
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