Product Overview
The CIB/CIM10 Series (1608/EIA 0603) are monolithic inorganic material chip beads designed for high-frequency EMI prevention. These components offer perfect shape for automatic mounting with no directionality, excellent solderability, and high heat resistance suitable for flow or reflow soldering. Their closed magnetic circuit configuration effectively avoids crosstalk, making them ideal for high-density PCBs. Applications include computers, printers, VCRs, TVs, and mobile phones.
Product Attributes
- Series: CIB/CIM10 Series
- Type: Chip Beads (EMI Suppression)
- Construction: Monolithic inorganic material, Closed magnetic circuit
- Mounting: Suitable for automatic mounting, no directionality
- Soldering: Excellent solderability and high heat resistance for flow or reflow soldering
- PCB Density: Suitable for high density PCBs
Technical Specifications
Dimensions:
| Type | Dimension [mm] (L x W x t x d) |
|---|---|
| 10 | 1.60.15 x 0.80.15 x 0.80.15 x 0.30.2 |
Recommended Land Pattern: 0.6~0.8mm
Characteristic Data:
| Part no. | Thickness (mm) | Impedance ()25%@100MHz | DC Resistance () Max. | Rated Current (mA) Max. |
|---|---|---|---|---|
| CIB10P100 | 0.80.15 | 10 | 0.05 | 1000 |
| CIB10P220 | 0.80.15 | 22 | 0.05 | 1500 |
| CIB10P260 | 0.80.15 | 26 | 0.08 | 1000 |
| CIB10P300 | 0.80.15 | 30 | 0.08 | 1000 |
| CIB10P330 | 0.80.15 | 33 | 0.08 | 1000 |
| CIM10U600 | 0.80.15 | 60 | 0.15 | 600 |
| CIM10U800 | 0.80.15 | 80 | 0.10 | 600 |
| CIM10U121 | 0.80.15 | 120 | 0.15 | 500 |
| CIM10U221 | 0.80.15 | 220 | 0.25 | 400 |
| CIM10U241 | 0.80.15 | 240 | 0.25 | 400 |
| CIM10U301 | 0.80.15 | 300 | 0.30 | 400 |
| CIM10U471 | 0.80.15 | 470 | 0.35 | 300 |
| CIM10U601 | 0.80.15 | 600 | 0.38 | 500 |
| CIM10U102 | 0.80.15 | 1000 | 0.50 | 400 |
| CIM10U202 | 0.80.15 | 2000 (at 70MHz) | 1.20 | 200 |
| CIB10J300 | 0.80.15 | 30 | 0.10 | 1000 |
| CIM10J400 | 0.80.15 | 40 | 0.12 | 600 |
| CIM10J470 | 0.80.15 | 47 | 0.12 | 600 |
| CIM10J600 | 0.80.15 | 60 | 0.12 | 600 |
| CIM10J750 | 0.80.15 | 75 | 0.15 | 550 |
| CIM10J800 | 0.80.15 | 80 | 0.15 | 550 |
| CIM10J121 | 0.80.15 | 120 | 0.20 | 500 |
| CIM10J151 | 0.80.15 | 150 | 0.20 | 400 |
| CIM10J221 | 0.80.15 | 220 | 0.30 | 400 |
| CIM10J241 | 0.80.15 | 240 | 0.30 | 400 |
| CIM10J301 | 0.80.15 | 300 | 0.35 | 400 |
| CIM10J331 | 0.80.15 | 330 | 0.35 | 400 |
| CIM10J471 | 0.80.15 | 470 | 0.35 | 300 |
| CIM10J601 | 0.80.15 | 600 | 0.45 | 300 |
| CIM10J751 | 0.80.15 | 750 | 0.50 | 300 |
| CIM10J102 | 0.80.15 | 1000 | 0.60 | 250 |
| CIM10J152 | 0.80.15 | 1500 | 0.70 | 250 |
| CIM10J252 | 0.80.15 | 2500 | 1.50 | 200 |
| CIM10K152 | 0.80.15 | 1500 | 0.80 | 250 |
| CIM10K202 | 0.80.15 | 2000 | 1.00 | 200 |
| CIM10K252 | 0.80.15 | 2500 | 1.20 | 200 |
| CIM10N700 | 0.80.15 | 70 | 0.30 | 500 |
| CIM10N121 | 0.80.15 | 120 | 0.45 | 400 |
| CIM10N241 | 0.80.15 | 240 | 0.60 | 300 |
| CIM10F470 | 0.80.15 | 47 | 0.25 | 550 |
| CIM10F600 | 0.80.15 | 60 | 0.25 | 550 |
| CIM10F121 | 0.80.15 | 120 | 0.30 | 500 |
| CIM10F331 | 0.80.15 | 330 | 0.58 | 400 |
| CIM10F471 | 0.80.15 | 470 | 0.85 | 300 |
Product Identification Breakdown:
CIM 10 U 121 N C
- (1) Chip Beads
- (2) M: Multi-layer type, B: Mono-layer type
- (3) Dimension
- (4) Material Code
- (5) Nominal impedance (e.g., 121:120, 202:2000)
- (6) Thickness option (N: Standard, A: Thinner than standard, B: Thicker than standard)
- (7) Packaging (C: paper tape (7"), D: Paper tape (13"), E: embossed tape)
Packaging:
| Packaging Style | Quantity (pcs/reel) |
|---|---|
| Card Board Taping (7'') | 4,000 |
| Card Board Taping (13'') | 16,000 |
Recommended Soldering Condition:
(Details for Reflow Soldering and Flow Soldering are not provided in the source text.)
2410311334_Samsung-Electro-Mechanics-CIM10F600NC_C19731910.pdf
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