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Specifications
Mfr. Part #:
MPP124J2JB050C3F0ZR
Package:
Through Hole,P=7.5mm
Key Attributes
Model Number:
MPP124J2JB050C3F0ZR
Product Description
Product Overview
The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation. These capacitors feature a non-inductive winding structure, good self-healing properties, low loss, and low internal temperature rise. They are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. The capacitors are manufactured by Dongguan Chengxi Electronics Co., Ltd. and are compliant with RoHS and REACH environmental standards.
Product Attributes
- Brand: CBB21/MPP
- Manufacturer: Dongguan Chengxi Electronics Co., Ltd.
- Encapsulation: Epoxy
- Construction: Non-inductive winding
- Material: Metallized polypropylene film
- Flame Retardant: UL94V-0
- Environmental Compliance: RoHS, REACH, Halogen-free (if specified)
Technical Specifications
| Model/Part Number | Capacitance (F) | Tolerance (%) | Rated Voltage (VDC) | Dissipation Factor (DF) (1KHz, 20C) | Dimensions (mm) (L x W x T) | Pitch (P) (mm) | Lead Length (L) (mm) | Lead Diameter (d) (mm) |
|---|---|---|---|---|---|---|---|---|
| MPP124J2JB050C3F0ZR | 0.12 | 5% | 630 | 0.0010 | 9.0 x 8.1 x 4.7 | 7.5 1.0 | 3.5 0.5 | 0.6 0.05 |
General Electrical Characteristics
| Parameter | Specification |
|---|---|
| Climate Category | 40/105/21 |
| Operating Temperature Range | -40C to +105C (Voltage derating applies for temperatures above 85C) |
| Rated Temperature | 85C |
| Capacitance Range | 0.001F to 6.8F |
| Rated Voltage (Available) | 100Vdc, 160Vdc, 250Vdc, 400Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600Vdc, 2000Vdc |
| Insulation Resistance | 30,000 M for C 0.33F (100VDC, 60s) 10,000 M*F for C > 0.33F (100VDC, 60s) |
| Withstand Voltage | 1.6 UR(VDC) for 5 seconds |
Maximum Effective Voltage vs. Frequency Curve
Note: The curve represents typical values under sinusoidal voltage, ambient temperature 85C, and internal temperature rise T=10C.
Product Structure and Main Materials
| No. | Main Material | Description | Remarks |
|---|---|---|---|
| 1 | Metallized Polypropylene Film | MPPZAH | -/- |
| 2 | Sprayed Tin Layer | Tin-zinc alloy wire | -/- |
| 3 | Lead Wire | Tinned copper-clad steel wire | -/- |
| 4 | Outer Encapsulation Material | Epoxy resin powder | Flame Retardant UL94V-0 |
| 5 | Inner Protective Material | Epoxy resin | - |
Note: All raw materials and finished products comply with RoHS environmental requirements.
Packaging Information
| Item | Dimensions (L x W x H) |
|---|---|
| Inner Carton | 34.5 x 23.5 x 24.5 cm |
| Outer Carton | 49 x 36 x 27 cm |
Packaging Details:
- Carton contents include: Manufacturer's part number, number of packages, quantity per package, Lot No.
- Capacitors are packaged in transparent PVC bags for moisture and dust protection.
- RoHS environmental mark is included.
- Other customer-specified markings are accommodated.
Storage Conditions
- Avoid prolonged exposure to air which can degrade lead wire solderability.
- Do not store in high temperature or high humidity environments.
- Recommended Storage Conditions (in original packaging):
- Temperature: Max 35C
- Relative Humidity: Max 80% - Storage Time: Maximum 12 months from the production date indicated on the packaging bag.
Product Electrical Characteristics and Test Conditions
General Test Conditions (unless otherwise specified):
- Ambient Temperature: 15C to 35C
- Relative Humidity: 25% to 75%
- For disputed test results:
- Ambient Temperature: 20 2C
- Relative Humidity: 60% to 70%
Detailed Electrical Characteristics and Test Methods
| No. | Item | Characteristic | Test Method |
|---|---|---|---|
| 1 | Terminal Strength | Tensile Strength | No visible mechanical damage. Load: 10N, Time: 10 seconds. (Wire diameter: 0.6 & 0.8mm) |
| Bending Strength | 5N force, 90 2 times. (Wire diameter: 0.6 & 0.8mm) | ||
| 2 | Solderability | Tinning rate on lead wire 95% | Flux temperature: 245 5C, Immersion time: 2.5 0.5 seconds |
| 3 | Soldering Heat Resistance | Appearance | No visible damage. Solder temperature: 260 5C, Immersion time: 10 1 seconds. Recovery time: 1-2 hours. |
| Increase in DF | 0.004 (C 1.0F, 10kHz) 0.004 (C > 1.0F, 1kHz) | - | |
| Capacitance Change | C/C 3% | - | |
| 4 | Temperature Cycling & Vibration & Shock | Initial Measurement: Capacitance (1KHz), DF | CR 1F: Test frequency 10kHz; CR > 1F: Test frequency 1kHz |
| Rapid Temperature Change | Appearance: No visible damage. Cycles: 5 times (-40C to +105C, t=30min each) | - | |
| Vibration | Appearance: No visible damage. Amplitude 0.75mm or acceleration 98m/s (whichever is more severe), Frequency 10-500Hz, 2h per direction (3 directions total 6h) | - | |
| Shock | Appearance: No visible damage. 4000 cycles, acceleration 390m/s, pulse duration: 6ms | - | |
| 5 | Climatic Sequence | Final Measurement: Appearance, Capacitance Change, DF, Insulation Resistance | Appearance: No visible damage. Capacitance Change: C/C 5% DF Increase: 0.004 Insulation Resistance: IR/IR 50% |
| Dry Heat | +105C, 16 hours | - | |
| Cyclic Damp Heat (Test Db) | First cycle, then remaining cycles. Low Temperature: -40C, 2 hours. Low Pressure: 8.5kPa, 1 hour (no permanent breakdown, arcing, or harmful deformation). | - | |
| 6 | Steady State Damp Heat | Appearance | No visible damage. Relative Humidity: 90-95%RH, Temperature: 402C, Duration: 21 days. Recovery time: 1-2 hours. |
| Capacitance Change | C/C 5% | - | |
| DF Increase & Insulation Resistance | DF Increase: 0.002 (C 1.0F, 10kHz), 0.004 (C > 1.0F, 1kHz) Insulation Resistance: IR/IR 50% | - | |
| 7 | Endurance | Appearance | No visible damage. Test at 85C for 1000 hours with applied voltage 1.25UR. |
| Capacitance Change | C/C 8% | - | |
| DF Increase & Insulation Resistance | DF Increase: 0.004 Insulation Resistance: IR/IR 50% | - | |
| 8 | Charge/Discharge Test | Capacitance Change | C/C 5% |
| DF Increase | 0.005 (10KHz, CR 1.0uF) 0.005 (1KHz, CR > 1.0uF) | - | |
| Insulation Resistance | IR/IR 50% | - |
Usage Rules
Usage Scope:
- Do not exceed the upper category temperature limit.
- Avoid overload operation.
- Do not exceed the maximum pulse current.
Operation Precautions:
- Avoid repeated squeezing at the base of the lead wires.
- Be cautious of the lead wire tips.
Soldering:
- Soldering heat can transfer through lead terminals and encapsulation to the capacitor core. Be aware of potential degradation or damage from high temperatures and prolonged soldering.
- Solder Temperature Ranges:
- Wave Soldering (MPP Polypropylene Film Capacitors):
- TP 110C for 120 seconds; Ts 120C for 45 seconds.
- For P 7.5mm, T 4mm: Wave soldering time < 4 seconds.
- Soldering Iron: Tip temperature not exceeding 350C, time not exceeding 3 seconds.
- Lead film capacitors are not suitable for reflow soldering.
Definitions:
Ts: Maximum temperature the capacitor body can withstand during wave soldering preheating.
Tp: Maximum temperature the capacitor body can withstand during wave soldering preheating.
2512031620_DGCX-MPP124J2JB050C3F0ZR_C53070545.pdf
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