Fixed Inductors
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High q factor inductors Johanson Dielectrics LRW0603WG16NGG001E designed for high frequency circuits
Product Overview Johanson Technology's High-Q Chip Inductors are designed for high-frequency applications, featuring a monolithic ceramic or ferrite core wound with wire for optimal performance. These compact, RF wirewound chip inductors are ideal for high-volume RF applications due to their tape and reel packaging. They offer a nickel barrier with gold plating for ceramic core types and 100% tin plating for ferrite core types. Available inductance values between those listed
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High conductivity metal electrode chip inductor Johanson Dielectrics L-07C15NJV6T for RF transceivers
Product Overview Johanson Technology's high-frequency multi-layer chip inductors are engineered with a monolithic body constructed from low-loss ceramic and high-conductivity metal electrodes to deliver optimal high-frequency performance. These compact RF chip inductors are designed for small-size, high-volume wireless applications, featuring lead-free tin-plated nickel barrier terminations and tape and reel packaging. They are suitable for a variety of applications including
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Tape and reel packaged inductors Johanson Dielectrics L 15W30NKV4E for cordless phone applications
Johanson Technology RF Wirewound Chip Inductors These high-frequency, High-Q chip inductors feature a monolithic ceramic body wound with wire for optimal high-frequency performance. Their compact size and tape-and-reel packaging make them ideal for high-volume RF applications. Ceramic core types (0402, 0603, and most 0805) feature a nickel barrier with gold plating, while ferrite core types (0805 size, 470 nH and higher) have 100% tin plating. Most inductance values between
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Lead free tin plated nickel barrier chip inductor Johanson Dielectrics L 07C2N7SV6T for wireless lan
Product Overview Johanson Technology's high-frequency multi-layer chip inductors are engineered with a monolithic body constructed from low-loss ceramic and high-conductivity metal electrodes, ensuring optimal high-frequency performance. These compact RF chip inductors are designed for small-size, high-volume wireless applications, featuring lead-free tin-plated nickel barrier terminations and tape and reel packaging. They are ideal for use in CELL/PCS Modules, Wireless LAN,
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Compact wireless LAN chip inductors Johanson Dielectrics L-07C3N3SV6T with multi layer low loss ceramic construction
Product Overview Johanson Technology's High Frequency Multi-Layer Chip Inductors are engineered for optimal high frequency performance, featuring a monolithic body constructed from low-loss ceramic and high-conductivity metal electrodes. These compact RF chip inductors are designed for small size and high volume wireless applications, offering lead-free tin-plated nickel barrier terminations and tape and reel packaging. They are suitable for a wide range of applications
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High frequency multilayer chip inductor Johanson Dielectrics L-05B6N8JV6T with low loss ceramic and metal electrodes
Product Overview Johanson Technology's High Frequency Multi-Layer Chip Inductors are designed for optimal high-frequency performance, featuring a monolithic body constructed from low-loss ceramic and high-conductivity metal electrodes. These compact RF chip inductors are ideal for small-size, high-volume wireless applications, offering lead-free tin-plated nickel barrier terminations and tape and reel packaging. They are suitable for a wide range of applications including
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Tape and Reel Packaging Johanson Dielectrics LRW0603WK16NGG001E High Frequency Wirewound Chip Inductors
Product Overview Johanson Technology's High Frequency High-Q Chip Inductors are designed for optimal performance in high-frequency RF applications. Featuring a monolithic ceramic or ferrite body wound with wire, these compact inductors offer high Q factors and are ideal for demanding applications such as cellular modules, wireless LAN, RFID, and RF transceivers. They are available in tape and reel packaging for high-volume manufacturing. Most inductance values between those
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Tape and reel packaged inductors Johanson Dielectrics LRW0603WK43NGG001E suitable for high volume rf
Product Overview These high-frequency, high-Q chip inductors feature a monolithic ceramic or ferrite core wound with wire for optimal high-frequency performance. Their compact size and tape-and-reel packaging make them ideal for high-volume RF applications. They are designed with a nickel barrier and gold plating for ceramic core types (0402, 0603, and most 0805) or 100% tin plating for ferrite core types (0805 size, 470 nH and higher). Most inductance values between those
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High Frequency RF Wirewound Chip Inductors Johanson Dielectrics L-14W6N2JV4E Tape and Reel Packaging
Product Overview Johanson Technology's RF Wirewound Chip Inductors are designed for high-frequency applications, featuring a monolithic ceramic or ferrite core wound with wire for optimal performance. These compact inductors are ideal for high-volume RF applications due to their tape and reel packaging. They offer excellent high-frequency characteristics and are suitable for a wide range of wireless communication and data transmission systems. Product Attributes Brand:
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RF wirewound chip inductors Johanson Dielectrics LRW0603WJ43NGG001E featuring low loss ceramic or ferrite core materials
Product Overview Johanson Technology's High-Q RF Wirewound Chip Inductors are designed for optimal high-frequency performance, featuring a monolithic ceramic or ferrite core wound with wire. These compact inductors are ideal for high-volume RF applications due to their tape and reel packaging. They offer excellent Q factors and high Self-Resonant Frequencies (SRF). Available in various sizes (0402, 0603, 0805), they cater to a wide range of applications including cellular
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High Frequency Compact Inductors Johanson Dielectrics LRW0603WG30NGG001E With Tape and Reel Packaging for Assembly
Product Overview Johanson Technology's High Frequency High-Q Chip Inductors are designed for optimal high-frequency performance, featuring a monolithic ceramic or ferrite body wound with wire. These compact RF chip inductors are ideal for high-volume RF applications due to their tape and reel packaging. They offer a nickel barrier with gold plating for ceramic core types and 100% tin plating for ferrite core types. Available in various sizes (0402, 0603, 0805) and inductance
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chip inductors Johanson Dielectrics LRW0603WK30NGG001E designed for rf modules and cordless phone applications
Product Overview Johanson Technology's High Frequency High-Q Chip Inductors are designed for optimal performance in high-frequency applications. These inductors feature a monolithic ceramic or ferrite body wound with wire, offering compact size and tape-and-reel packaging for high-volume production. They are ideal for RF applications including CELL/PCS Modules, Wireless LAN, Broadband Components, RFID, RF Transceivers, Cordless Phones, Cable Modems, Computer Peripherals,
