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Specifications
Current Rating:
4.4A
Inductance:
4.7uH
Tolerance:
±20%
DC Resistance(DCR):
60mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
5A
Mfr. Part #:
ZEPIM303020D-4R7M
Package:
SMD,3x3mm
Key Attributes
Model Number:
ZEPIM303020D-4R7M
Product Description
Product Overview
The ZEPIM303020D series is a Mini Molding Power Inductor designed for high current and low loss applications. Featuring a metal dust core for high performance (Isat) and low Rdc for reduced loss, this inductor offers a closed magnetic circuit design to minimize leakage flux. Its vinyl thermal spray provides enhanced surface compactness. This series is environmentally compliant with QESP-44 and meets RoHS2.0, Halogen, Reach, and other legal requirements, being 100% lead-free.
Product Attributes
- Brand: ZEPIM ()
- Origin: Dongguan, China
- Material: Metal dust core, Vinyl thermal spray
- Certifications: RoHS2.0, Halogen, Reach, AEC-Q200
Technical Specifications
| Part Number | Inductance (H) | Tolerance | Rdc (m) Max. | Isat (A) Typ. | Irms (A) Typ. | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|
| ZEPIM303020D-R15M | 0.15 | 20% | 9.00 | 7.50 | 10.20 | 3.0*3.0*2.0 |
| ZEPIM303020D-R33M | 0.33 | 20% | 12.00 | 9.00 | 9.20 | 3.0*3.0*2.0 |
| ZEPIM303020D-R50M | 0.50 | 20% | 12.00 | 13.00 | 8.20 | 3.0*3.0*2.0 |
| ZEPIM303020D-R68M | 0.68 | 20% | 16.00 | 13.00 | 8.00 | 3.0*3.0*2.0 |
| ZEPIM303020D-1R0M | 1.00 | 20% | 20.00 | 14.00 | 6.20 | 3.0*3.0*2.0 |
| ZEPIM303020D-1R5M | 1.50 | 20% | 25.00 | 19.00 | 6.00 | 3.0*3.0*2.0 |
| ZEPIM303020D-2R2M | 2.20 | 20% | 37.00 | 45.00 | 4.90 | 3.0*3.0*2.0 |
| ZEPIM303020D-3R3M | 3.30 | 20% | 63.00 | 52.00 | 4.20 | 3.0*3.0*2.0 |
| ZEPIM303020D-4R7M | 4.00 | 20% | 135.00 | 60.00 | 4.20 | 3.0*3.0*2.0 |
| ZEPIM303020D-6R8M | 6.80 | 20% | 107.00 | 73.00 | 4.20 | 3.0*3.0*2.0 |
| ZEPIM303020D-100M | 10.00 | 20% | 135.00 | 135.00 | 2.40 | 3.0*3.0*2.0 |
| ZEPIM303020D-150M | 15.00 | 20% | 260.00 | 160.00 | 1.70 | 3.0*3.0*2.0 |
Applications
DC/DC converters, Pad, Smartphone, Portable gaming devices, Smartwear, Wi-Fi module, Notebooks, VR, AR, LCD displays, HDDs, DVCs, DSCs, Baseband power supply, Amplifier, Power management, Module power supply, Camera power management.
Environmental Data
Operating Temperature: -55 to +125 (Including coil self-temperature rise)
Reliability Testing
| No. | Item | Requirements | Test Methods and Remarks | Reference | Sample Size |
|---|---|---|---|---|---|
| 1 | Solderability | (1) No case deformation or change in appearance. (2) Terminal area must have 95% min. Solder coverage. | Temperature:245 5. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Sample immersion tin furnace 5 0.5s. | AEC-Q200 (J-STD 002) | 32 |
| 2 | Adhesion of teral electrode | (1)Strong bond between the pad and the core, without come off PCB. | Preconditioning245Reflow 3 times Inductors shall be subjected to (260+0/-5.) for (105)s Soldering in the base whit 0.3mm solder. Aplombelectrode way plus tax 12 N for (101) seconds. | AEC-Q200 (AEC-Q200- 006) | 32 |
| 3 | Reflow test | (1) No physical damage. (2)L0/L010% | The peak temperature: 260+0/-5. Reflow:3times. Temperature curve is as below | AEC-Q200 (MIL-STD-202 Method 210) | 32 |
| 4 | High temperature | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion | AEC-Q200 (MIL-STD -202 Method 108) | 77 |
| 5 | Low temperature | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion | JESD22-A119A | 77 |
| 6 | Thermal shock | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Repeat 500 cycle as follow : (-552 ,303minutes) (Room temperature, 5 minutes)(+1252 ,303minutes)(Room temperature, 5 minutes) Measurement at 244 hours after test conclusion | MIL-STD -202 Method 107 | 77 |
| 7 | Resistance to Soldering Heat | (1) No physical damage. (2)L0/L010% | Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. | AEC-Q200 MIL-STD- 202 Method 210 | 32 |
| 8 | Static Humidity | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times 1000 hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion | AEC-Q200 (MIL-STD-202 Method 103) | 77 |
| 9 | Board Flex | (1) No physical damage. (2)L0/L010% | Preconditioning245Reflow 3 times Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds. | AEC-Q200 (AEC-Q200- 005) | 30 |
| 10 | Vibration | (1) No physical damage. (2)L0/L010% | Preconditioning245Reflow 3 times Frequency range : 10~2000Hz. Amplitude: 1.5mm or 20g. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours in X,Y,Z direction, 12hours in total. | AEC-Q200 (MIL-STD-202 Method 204) | 32 |
| 11 | Mechanical Shock | (1) No physical damage. (2)L0/L010% | Preconditioning245Reflow 3 times Peak acceleration:100G/S Duration of pulse:6ms 3times in each of 6(X, Y, Z) axes. | AEC-Q200 (MIL-STD-202 Method 213) | 32 |
| 12 | Loading at High Temperature | (1) No physical damage. (2)L0/L010% | Preconditioning: Bake at 125+5 for 240.5H 245Reflow 3 times Temperature: 852. Time : 1000 hours. Applied Current : Rated current. Measurement at 244 hours after test conclusion | AEC-Q200 (MIL-STD-202 Method 108) | 77 |
Recommended Reflow Soldering Profile
Solder: Sn96.5 / Ag3 / Cu0.5 (Lead (Pb)-Free)
| Profile Feature | Min | Max | Time | Unit |
|---|---|---|---|---|
| Preheat (Tsmin to Tsmax) | 150 | 200 | 60 -120 | seconds |
| Average ramp-up rate (Ts max to Tp) | 3 / second max. | |||
| Time maintained above TL (217) | 217 | 60-150 | seconds | |
| Peak Temperature (Tp) | 260 | |||
| Time within +0 5 of actual peak Temperature (tp) | 2 10 seconds | |||
| Ramp-down Rate | 6/second max. | |||
| Time 25 to Peak Temperature | 8 minutes max. | |||
Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.
Allowed Re-flow times: 2 times
Packaging Dimensions
Plastic Taping Dimensions (Unit: mm)
| Series | W | A0 | B0 | D0 | D1 | E | Tolerance |
|---|---|---|---|---|---|---|---|
| 303020 | 3.4 | 12.0 | 0 | 3.45 | 1.5 | 1.5 | 0.30 |
| 1.75 | +0.10/+0.10 | ||||||
| Series | F | K0 | P0 | P2 | P1 | T | |
| 303020 | 5.5 | 2.20 | 4.0 | 2.0 | 8.0 | 0.30 | 3K |
| Tolerance | 0.10 | 0.10 | 0.10 | 0.10 | 0.10 | 0.05 |
Reel Dimensions (Unit: mm)
| Type | A | B | C | All |
|---|---|---|---|---|
| 2.0 | 2.0 | 2.0 | 330 | |
| 100 |
2505301710_ZE-ZEPIM303020D-4R7M_C49009083.pdf
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