Product Overview
The ZEMS1040 is an integrated molding power inductor designed for high-density installations. It features low DC resistance, ultra-high current capability, and a thin design with magnetic shielding for strong anti-electromagnetic interference. Its composite construction results in ultra-low buzz noise and high reliability with excellent vibration resistance. Suitable for various applications including PDAs, notebooks, servers, and DC/DC converters.
Product Attributes
- Brand: (Zengyi Industry)
- Origin: Dongguan, China
- Material: Low loss alloy powder
- Certifications: RoHS, Halogen Free, REACH Compliant
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency/Voltage | DCR (m) Typical | Saturation Current (A) Typical | Temperature Rise Current (A) Typical | Dimensions (LWH) (mm) |
| ZEMS1040-R15M | 0.15 | 20% | 100kHz/1.0V | 0.65 | 45.00 | 0.6 | 11.5x10x3.8 |
| ZEMS1040-R22M | 0.22 | 20% | 100kHz/1.0V | 1.40 | 35.00 | 0.65 | 11.5x10x3.8 |
| ZEMS1040-R30M | 0.30 | 20% | 100kHz/1.0V | 1.30 | 35.00 | 0.75 | 11.5x10x3.8 |
| ZEMS1040-R36M | 0.36 | 20% | 100kHz/1.0V | 1.90 | 30.00 | 0.85 | 11.5x10x3.8 |
| ZEMS1040-R47M | 0.47 | 20% | 100kHz/1.0V | 2.20 | 30.00 | 0.95 | 11.5x10x3.8 |
| ZEMS1040-R56M | 0.56 | 20% | 100kHz/1.0V | 2.40 | 25.00 | 1.00 | 11.5x10x3.8 |
| ZEMS1040-R68M | 0.68 | 20% | 100kHz/1.0V | 2.50 | 23.00 | 1.10 | 11.5x10x3.8 |
| ZEMS1040-R80M | 0.80 | 20% | 100kHz/1.0V | 2.70 | 23.00 | 1.20 | 11.5x10x3.8 |
| ZEMS1040-1R0M | 1.00 | 20% | 100kHz/1.0V | 3.30 | 19.00 | 1.30 | 11.5x10x3.8 |
| ZEMS1040-1R5M | 1.50 | 20% | 100kHz/1.0V | 4.20 | 16.00 | 1.50 | 11.5x10x3.8 |
| ZEMS1040-2R2M | 2.20 | 20% | 100kHz/1.0V | 7.50 | 12.00 | 1.80 | 11.5x10x3.8 |
| ZEMS1040-3R3M | 3.30 | 20% | 100kHz/1.0V | 11.80 | 11.00 | 2.00 | 11.5x10x3.8 |
| ZEMS1040-4R7M | 4.70 | 20% | 100kHz/1.0V | 20.00 | 9.00 | 2.20 | 11.5x10x3.8 |
| ZEMS1040-5R6M | 5.60 | 20% | 100kHz/1.0V | 22.00 | 8.50 | 2.40 | 11.5x10x3.8 |
| ZEMS1040-6R8M | 6.80 | 20% | 100kHz/1.0V | 25.00 | 8.50 | 2.50 | 11.5x10x3.8 |
| ZEMS1040-8R2M | 8.20 | 20% | 100kHz/1.0V | 27.00 | 8.00 | 2.60 | 11.5x10x3.8 |
| ZEMS1040-100M | 10.00 | 20% | 100kHz/1.0V | 37.00 | 7.80 | 2.70 | 11.5x10x3.8 |
| ZEMS1040-150M | 15.00 | 20% | 100kHz/1.0V | 55.00 | 6.50 | 3.00 | 11.5x10x3.8 |
| ZEMS1040-220M | 22.00 | 20% | 100kHz/1.0V | 66.00 | 5.00 | 3.20 | 11.5x10x3.8 |
| ZEMS1040-330M | 33.00 | 20% | 100kHz/1.0V | 92.00 | 4.40 | 3.40 | 11.5x10x3.8 |
| ZEMS1040-470M | 47.00 | 20% | 100kHz/1.0V | 155.00 | 3.30 | 3.60 | 11.5x10x3.8 |
| ZEMS1040-560M | 56.00 | 20% | 100kHz/1.0V | 155.00 | 2.80 | 3.70 | 11.5x10x3.8 |
| ZEMS1040-680M | 68.00 | 20% | 100kHz/1.0V | 220.00 | 2.50 | 3.80 | 11.5x10x3.8 |
| ZEMS1040-820M | 82.00 | 20% | 100kHz/1.0V | 185.00 | 2.30 | 3.90 | 11.5x10x3.8 |
| ZEMS1040-101M | 100.00 | 20% | 100kHz/1.0V | 290.00 | 2.00 | 4.00 | 11.5x10x3.8 |
Environmental & Reliability
| Category | Specification | Test Method/Remarks |
| Operating Temperature | -55 to +125 (Including self-heating temperature rise) | |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 245 5 for (51) seconds. |
| Resistance to Soldering Heat | Appearance: No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. |
| Low temperature storage | Appearance: No visible mechanical damage. Inductance change: Within 10%. | Store at -552 for 1000 hours. |
| High temperature storage | Appearance: No visible mechanical damage. Inductance change: Within 10%. | Store at 1252 for 1000 hours. |
| Static Humidity | Appearance: No visible mechanical damage. Inductance change: Within 10%. | Store in (933)%RH at 40 2 for 96 h2 h. Test after 2 hours air drying at room temperature. |
| Thermal shock | Appearance: No visible mechanical damage. Inductance change: Within 10%. | (-403) for (303) min (852) /(303) min, conversion time (2~3) min, 5 cycles. Test after 2 hours air drying at room temperature. |
| Mechanical Shock | No evidence of terminal peel off and wire broken. | Soldered on 1.0mm PCB, fixed in a 15cm cube (1.4Kg brass base), dropped from 0.5m height (X,Y,Z axes, one time each). |
| Adhesion of terminal electrode | Strong bond between the pad and the core, without come off. | Soldered in base with 0.3mm solder at 260 5 for 20 s5 s. Apply 10 N perpendicular to electrode surface for 10 1s. |
2411220032_ZE-ZEMS1040-330M_C41413144.pdf
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