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quality Low noise power inductor ZE ZEMS1040-330M featuring thin design and vibration resistant construction factory
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quality Low noise power inductor ZE ZEMS1040-330M featuring thin design and vibration resistant construction factory
>
Specifications
Current Rating:
4.4A
Inductance:
33uH
Tolerance:
±20%
DC Resistance(DCR):
92mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
5A
Mfr. Part #:
ZEMS1040-330M
Package:
SMD,11.5x10mm
Key Attributes
Model Number: ZEMS1040-330M
Product Description

Product Overview

The ZEMS1040 is an integrated molding power inductor designed for high-density installations. It features low DC resistance, ultra-high current capability, and a thin design with magnetic shielding for strong anti-electromagnetic interference. Its composite construction results in ultra-low buzz noise and high reliability with excellent vibration resistance. Suitable for various applications including PDAs, notebooks, servers, and DC/DC converters.

Product Attributes

  • Brand: (Zengyi Industry)
  • Origin: Dongguan, China
  • Material: Low loss alloy powder
  • Certifications: RoHS, Halogen Free, REACH Compliant

Technical Specifications

Part No.Inductance (H)ToleranceTest Frequency/VoltageDCR (m) TypicalSaturation Current (A) TypicalTemperature Rise Current (A) TypicalDimensions (LWH) (mm)
ZEMS1040-R15M0.1520%100kHz/1.0V0.6545.000.611.5x10x3.8
ZEMS1040-R22M0.2220%100kHz/1.0V1.4035.000.6511.5x10x3.8
ZEMS1040-R30M0.3020%100kHz/1.0V1.3035.000.7511.5x10x3.8
ZEMS1040-R36M0.3620%100kHz/1.0V1.9030.000.8511.5x10x3.8
ZEMS1040-R47M0.4720%100kHz/1.0V2.2030.000.9511.5x10x3.8
ZEMS1040-R56M0.5620%100kHz/1.0V2.4025.001.0011.5x10x3.8
ZEMS1040-R68M0.6820%100kHz/1.0V2.5023.001.1011.5x10x3.8
ZEMS1040-R80M0.8020%100kHz/1.0V2.7023.001.2011.5x10x3.8
ZEMS1040-1R0M1.0020%100kHz/1.0V3.3019.001.3011.5x10x3.8
ZEMS1040-1R5M1.5020%100kHz/1.0V4.2016.001.5011.5x10x3.8
ZEMS1040-2R2M2.2020%100kHz/1.0V7.5012.001.8011.5x10x3.8
ZEMS1040-3R3M3.3020%100kHz/1.0V11.8011.002.0011.5x10x3.8
ZEMS1040-4R7M4.7020%100kHz/1.0V20.009.002.2011.5x10x3.8
ZEMS1040-5R6M5.6020%100kHz/1.0V22.008.502.4011.5x10x3.8
ZEMS1040-6R8M6.8020%100kHz/1.0V25.008.502.5011.5x10x3.8
ZEMS1040-8R2M8.2020%100kHz/1.0V27.008.002.6011.5x10x3.8
ZEMS1040-100M10.0020%100kHz/1.0V37.007.802.7011.5x10x3.8
ZEMS1040-150M15.0020%100kHz/1.0V55.006.503.0011.5x10x3.8
ZEMS1040-220M22.0020%100kHz/1.0V66.005.003.2011.5x10x3.8
ZEMS1040-330M33.0020%100kHz/1.0V92.004.403.4011.5x10x3.8
ZEMS1040-470M47.0020%100kHz/1.0V155.003.303.6011.5x10x3.8
ZEMS1040-560M56.0020%100kHz/1.0V155.002.803.7011.5x10x3.8
ZEMS1040-680M68.0020%100kHz/1.0V220.002.503.8011.5x10x3.8
ZEMS1040-820M82.0020%100kHz/1.0V185.002.303.9011.5x10x3.8
ZEMS1040-101M100.0020%100kHz/1.0V290.002.004.0011.5x10x3.8

Environmental & Reliability

CategorySpecificationTest Method/Remarks
Operating Temperature-55 to +125 (Including self-heating temperature rise)
Solderability90% or more of electrode area shall be coated by new solder.Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 245 5 for (51) seconds.
Resistance to Soldering HeatAppearance: No visible mechanical damage. Inductance change: Within 10%.Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds.
Low temperature storageAppearance: No visible mechanical damage. Inductance change: Within 10%.Store at -552 for 1000 hours.
High temperature storageAppearance: No visible mechanical damage. Inductance change: Within 10%.Store at 1252 for 1000 hours.
Static HumidityAppearance: No visible mechanical damage. Inductance change: Within 10%.Store in (933)%RH at 40 2 for 96 h2 h. Test after 2 hours air drying at room temperature.
Thermal shockAppearance: No visible mechanical damage. Inductance change: Within 10%.(-403) for (303) min (852) /(303) min, conversion time (2~3) min, 5 cycles. Test after 2 hours air drying at room temperature.
Mechanical ShockNo evidence of terminal peel off and wire broken.Soldered on 1.0mm PCB, fixed in a 15cm cube (1.4Kg brass base), dropped from 0.5m height (X,Y,Z axes, one time each).
Adhesion of terminal electrodeStrong bond between the pad and the core, without come off.Soldered in base with 0.3mm solder at 260 5 for 20 s5 s. Apply 10 N perpendicular to electrode surface for 10 1s.

2411220032_ZE-ZEMS1040-330M_C41413144.pdf

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