Product Overview
The ZEMS0530 is an integrated molding power inductor designed for high-density installation. It features a thin design with low DC resistance and ultra-high current capability, magnetic shielding for strong anti-electromagnetic interference, and high reliability with excellent vibration resistance due to its integral construction. Its composite structure results in ultra-low buzz noise, and it utilizes low-loss alloy powder for low impedance, small parasitic capacitance, and high efficiency. This inductor operates at frequencies up to 3MHz with a maximum voltage of 30VDC and complies with RoHS, Halogen Free, and REACH standards. It is suitable for various applications including PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: (Zengyi Industrial)
- Origin: Dongguan, China
- Material: Low-loss alloy powder
- Certifications: RoHS, Halogen Free, REACH Compliant
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Temperature Rise Current (A) Typical |
| ZEMS0530-R22M | 0.22 | 20% | 3.50 | 14.0 | 0.3 |
| ZEMS0530-R33M | 0.33 | 20% | 3.70 | 14.00 | 0.4 |
| ZEMS0530-R47M | 0.47 | 20% | 7.40 | 12.00 | 0.6 |
| ZEMS0530-R68M | 0.68 | 20% | 11.00 | 9.00 | 1.0 |
| ZEMS0530-1R0M | 1.0 | 20% | 12.00 | 8.50 | 1.2 |
| ZEMS0530-1R2M | 1.2 | 20% | 15.00 | 8.50 | 1.5 |
| ZEMS0530-1R5M | 1.5 | 20% | 20.00 | 8.20 | 2.2 |
| ZEMS0530-2R2M | 2.2 | 20% | 31.00 | 7.00 | 3.3 |
| ZEMS0530-3R3M | 3.3 | 20% | 35.00 | 5.50 | 4.7 |
| ZEMS0530-4R7M | 4.7 | 20% | 50.00 | 4.50 | 6.8 |
| ZEMS0530-6R8M | 6.8 | 20% | 102.00 | 3.50 | 10.0 |
| ZEMS0530-100M | 10.0 | 20% | 110.00 | 3.20 | 15.0 |
| ZEMS0530-150M | 15.0 | 20% | 175.00 | 2.20 | 22.0 |
| ZEMS0530-220M | 22.0 | 20% | 320.00 | 1.80 | 30.0 |
| ZEMS0530-330M | 33.0 | 20% | 350.00 | 2.00 | 30.0 |
| Item | Test Frequency/Voltage | Definition |
| Ls | 100kHz/1.0V | Inductance value |
| Isat | - | Saturation Current: The DC current that causes a 30% inductance reduction from the initial value. |
| IDC | - | Temperature Rise Current: The DC current that causes the inductor surface temperature to rise by 40 (Reference ambient temperature 25). |
| Requirement | Test Method and Remarks |
| Operating Temperature Range: -55 to +125 (Including coils self-temperature rise) | - |
| Solderability: 90% or more of electrode area shall be coated by new solder. Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for (51) seconds. | - |
| Resistance to Soldering Heat: No visible mechanical damage. Inductance change: Within 10%. Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. | - |
| Low temperature storage: No visible mechanical damage. Inductance change: Within 10%. Storage temperature -552 for total 1000hr. | - |
| High temperature storage: No visible mechanical damage. Inductance change: Within 10%. Storage temperature 1252 for total 1000hr. | - |
| Static Humidity: No visible mechanical damage. Inductance change: Within 10%. Inductors shall be subjected to (933)%RH at 402 for 96 h2 h. Inductors are to be tested after having air dried for 2 hours. | - |
| Thermal shock: No visible mechanical damage. Inductance change: Within 10%. (-403), time (303) min (852)/(303) min, conversion time (2~3) min, cycle 5 times; Tested after air dried for 2 hours. | - |
| Mechanical Shock: No evidence of terminal peel off and wire broken. Inductors shall be Soldered on the PCB with 1.0mm thick and fixed them in a 15cm big., 1.4Kg weight cube with brass base, let it nature fallen form 0.5m height (X,Y,Z three axes). | - |
| Adhesion of terminal electrode: Strong bond between the pad and the core, without come off PC board. Inductors shall be Subjected to 2605 for 20 s5s Soldering in the base with 0.3mm solder. And then aplomb electrode way plus tax 10 N for 101s seconds. | - |
2411220033_ZE-ZEMS0530-R47M_C41415548.pdf
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