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quality Low impedance integrated molding inductor ZE ZEMS0420-100M with composite structure and EMI shielding factory
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quality Low impedance integrated molding inductor ZE ZEMS0420-100M with composite structure and EMI shielding factory
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Specifications
Current Rating:
1.6A
Inductance:
10uH
Tolerance:
±20%
DC Resistance(DCR):
282mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
2A
Mfr. Part #:
ZEMS0420-100M
Package:
SMD,4.4x4.2mm
Key Attributes
Model Number: ZEMS0420-100M
Product Description

Product Specification: ZEMS0420 Integrated Molding Inductor

This document outlines the specifications for the ZEMS0420 integrated molding inductor. It features a thin design with low DC resistance and ultra-high current capabilities, magnetic shielding for strong anti-electromagnetic interference, and high reliability with excellent vibration resistance due to its integral construction. The composite structure ensures ultra-low buzz noise, and it utilizes low-loss alloy powder for low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. It is suitable for high-density installation and operates at frequencies up to 3MHz with an absolute maximum voltage of 30VDC. This product complies with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: (ZEMS)
  • Origin: Dongguan, China
  • Material: Low-loss alloy powder
  • Certifications: RoHS, Halogen Free, REACH

Technical Specifications

Part No.Inductance (H)ToleranceDCR (m) TypicalSaturation Current (A) TypicalTemperature Rise Current (A) TypicalDimensions (LWH) (mm)
ZEMS0420-R10M0.1020%3.504.0025.004.4x4.2x1.8
ZEMS0420-R22M0.2220%6.006.6013.004.4x4.2x1.8
ZEMS0420-R33M0.3320%8.0011.0012.004.4x4.2x1.8
ZEMS0420-R47M0.4720%12.0014.009.504.4x4.2x1.8
ZEMS0420-R56M0.5620%14.0016.009.004.4x4.2x1.8
ZEMS0420-R68M0.6820%18.0021.009.004.4x4.2x1.8
ZEMS0420-1R0M1.0020%24.0027.007.004.4x4.2x1.8
ZEMS0420-1R2M1.2020%25.0027.006.504.4x4.2x1.8
ZEMS0420-1R5M1.5020%40.0046.006.004.4x4.2x1.8
ZEMS0420-2R2M2.2020%52.0058.005.004.4x4.2x1.8
ZEMS0420-3R3M3.3020%70.0087.004.004.4x4.2x1.8
ZEMS0420-4R7M4.7020%105.00126.003.004.4x4.2x1.8
ZEMS0420-6R8M6.8020%120.00175.002.404.4x4.2x1.8
ZEMS0420-100M10.0020%220.00282.001.604.4x4.2x1.8

Applications

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Environmental Data

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance: WK3260B LCR meter or equivalent
  • Saturation & Temperature Rise Current: WK3260B+WK3265B or equivalent
  • DCR: Chroma 16502 or equivalent

Reliability Data

ItemRequirementsTest Methods and Remarks
Operating Temperature Range-55+125 (Including self-heating temperature rise)
Solderability90% or more of electrode area shall be coated by new solder.Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for (51) seconds.
Resistance to Soldering HeatNo visible mechanical damage. Inductance change: Within 10%.Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds.
Low temperature storageNo visible mechanical damage. Inductance change: Within 10%.Store temperature -552 for total 1000hr.
High temperature storageNo visible mechanical damage. Inductance change: Within 10%.Store temperature 1252 for total 1000hr.
Static HumidityNo visible mechanical damage. Inductance change: Within 10%.Inductors shall be subjected to (933)%RH at 402 for 96 h2 h. Inductors are to be tested after having air dried for 2 hours.
Thermal shockNo visible mechanical damage. Inductance change: Within 10%.(-403) for (303) min (852) for (303) min, conversion time (2~3) min, cycle 5 times. Tested after 2 hours air drying at room temperature.
Mechanical ShockNo evidence of terminal peel off and wire broken.Soldering on 1.0mm thick PCB, fixed in a 15cm cube (1.4Kg weight), natural fall from 0.5m height (X,Y,Z three axes).
Adhesion of terminal electrodeStrong bond between the pad and the core, without come off.Soldering on base with 0.3mm solder paste at 2605 for 20s5s. Apply 10N pressure vertically to electrode for 101s.

2411220032_ZE-ZEMS0420-100M_C41413053.pdf

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