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Specifications
Current Rating:
2.8A
Inductance:
4.7uH
Tolerance:
±20%
DC Resistance(DCR):
126mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
3A
Mfr. Part #:
ZEMS0420-4R7M
Package:
SMD,4.4x4.2mm
Key Attributes
Model Number:
ZEMS0420-4R7M
Product Description
Product Overview
The ZEMS0420 is an integrated molding power inductor designed for high-density installation. It features low DC resistance, ultra-high current capability in a thin design, and magnetic shielding for strong anti-electromagnetic interference. Its composite structure ensures ultra-low buzz noise and high reliability with excellent vibration resistance. Suitable for various applications including PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: (ZEMS)
- Origin: Dongguan, China
- Material: Low loss alloy powder
- Certifications: RoHS, Halogen Free, REACH Compliant
Technical Specifications
| Part No | Inductance (H) | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Temperature Rise Current (A) Typical |
| ZEMS0420-R10M | 0.10 | 20% | 3.50 | 25.00 | 13.00 |
| ZEMS0420-R22M | 0.22 | 20% | 6.00 | 13.00 | 9.50 |
| ZEMS0420-R33M | 0.33 | 20% | 8.00 | 12.00 | 10.00 |
| ZEMS0420-R47M | 0.47 | 20% | 12.00 | 9.50 | 8.00 |
| ZEMS0420-R56M | 0.56 | 20% | 14.00 | 9.00 | 7.00 |
| ZEMS0420-R68M | 0.68 | 20% | 18.00 | 9.00 | 7.00 |
| ZEMS0420-1R0M | 1.00 | 20% | 24.00 | 7.00 | 6.00 |
| ZEMS0420-1R2M | 1.20 | 20% | 25.00 | 6.50 | 6.00 |
| ZEMS0420-1R5M | 1.50 | 20% | 40.00 | 6.00 | 5.00 |
| ZEMS0420-2R2M | 2.20 | 20% | 52.00 | 5.00 | 4.50 |
| ZEMS0420-3R3M | 3.30 | 20% | 70.00 | 4.00 | 3.30 |
| ZEMS0420-4R7M | 4.70 | 20% | 105.00 | 3.00 | 2.80 |
| ZEMS0420-6R8M | 6.80 | 20% | 120.00 | 2.40 | 10.00 |
| ZEMS0420-100M | 10.00 | 20% | 220.00 | 1.60 | 10.00 |
| Item | Test frequency/Voltage | Definition |
| Ls | 100kHz/1.0V | Inductance |
| Isat | N/A | Saturation Current: The DC current that causes a 30% inductance reduction from the initial value. |
| Irms | N/A | Temperature Rise Current: The DC current that causes the inductor surface temperature to rise by 40 (Reference ambient temperature 25). |
| Test | Requirement | Test Method and Remarks |
| Operating Temperature Range | -55+125 (Including self-heating temperature rise) | N/A |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 245 5 for (51) seconds. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. |
| Low temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature -552 for total 1000hr. |
| High temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature 1252 for total 1000hr. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Subjected to (933)%RH at 40 2 for 96 h2 h. Tested after 2 hours air drying at room temperature, within 48 hours. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | (-403) for (303) min (852) /(303) min, conversion time (2~3) min, 5 cycles. Tested after 2 hours air drying at room temperature, within 48 hours. |
| Mechanical Shock | No evidence of terminal peel off and wire broken. | Soldered on 1.0mm thick PCB and fixed in a 15cm cube (1.4Kg), fallen from 0.5m height (X,Y,Z three axes). |
| Adhesion of terminal electrode | Strong bond between the pad and the core, without come off. | Soldered at 260 5 for 20 s5 s on a base with 0.3mm solder paste. Apply 10 N pressure vertically to electrode surface for 10 1s. |
2411220032_ZE-ZEMS0420-4R7M_C41413052.pdf
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