Product Overview
The FCM2012HF-152T04 is a Ferrite Chip Bead (Lead Free) designed for surface mounting. It features a monolithic inorganic material construction with a closed magnetic circuit to prevent crosstalk. This component is suitable for reflow soldering, adheres to EIA specifications for shape and dimensions, and offers excellent solderability and heat resistance. It is 100% Lead(Pb) & Halogen-Free and RoHS compliant, with an operating temperature range of -55~+125 (including self-temperature rise).
Product Attributes
- Brand: Gain ()
- Origin: Dongguan, China
- Material Type: Chip Bead ()
- Certifications: Lead Free, Halogen-Free, RoHS compliant
Technical Specifications
| Tai-Tech Part Number | Impedance () | Test Frequency (Hz) | DC Resistance () max. | Rated Current (mA) max. | Chip Size | Impedance-Frequency Characteristics | Part Numbering |
| FCM2012HF-152T04 | 150025% | 60mV/100M | 0.60 | 400 | 2.0 x 1.25 mm | Z, R, X | FCM 2012 HF - 152 T 04 |
Features
- Monolithic inorganic material construction.
- Closed magnetic circuit avoids crosstalk.
- S.M.T. type.
- Suitable for reflow soldering.
- Shapes and dimensions follow E.I.A. spec.
- Available in various sizes.
- Excellent solderability and heat resistance.
- High reliability.
- 100% Lead(Pb) & Halogen-Free and RoHS compliant.
- Operating Temperature-55~+125(Including self-temperature rise)
Part Numbering Explanation
- A: Series
- B: Dimension L x W
- C: Material (Lead Free Material)
- D: Impedance (152=1500)
- E: Packaging (T=Taping and Reel, B=Bulk(Bags))
- F: Rated Current (04=400mA)
Dimensions
| Chip Size | A (mm) | B (mm) | C (mm) | D (mm) |
| FCM2012HF-152T04 | 2.000.20 | 1.250.20 | 0.850.20 | 0.500.30 |
Reliability and Test Conditions
| Item | Performance | Test Condition |
| Operating Temperature | -55~+125 (Including self-temperature rise) | -- |
| Transportation Storage Temperature | -55~+125 (on board) | For long storage conditions, please see the Application Notice |
| Impedance (Z) | Refer to standard electrical characteristics list | Agilent4291, Agilent E4991, Agilent4287, Agilent16192 |
| DC Resistance | -- | Agilent 4338 |
| Rated Current | Temperature Rise Test | < 1A T 20Max; 1A T 40Max |
| Life test | Appearance: no damage. Impedance: within15%of initial value. RDCwithin 15% of initial value and shall not exceed the specification value | Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles). Temperature: 1252. Applied current: rated current. Duration: 100012hrs. Measured at room temperature after placing for 242 hrs. |
| Load Humidity | Appearance: no damage. Impedance: within15%of initial value. RDCwithin 15% of initial value and shall not exceed the specification value | Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles). Humidity: 852%R.H. Temperature: 852. Duration:1000hrsMin.Bead:with100%ratedcurr ent Inductance: with 10% rated current. Measured at room temperature after placing for 242 hrs. |
| Thermal shock | Appearance: no damage. Impedance: within15%of initial value. RDCwithin 15% of initial value and shall not exceed the specification value | Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles). Condition for 1 cycle: Step1: -552 305 min. Step2: 1252 0.5min. Step3: 1252 305min. Number of cycles: 500. Measured at room temperature after placing for 242 hrs. |
| Vibration | AppearanceNo damage. Impedancewithin15% of initial value. RDCwithin 15% of initial value and shall not exceed the specification value | Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles). Oscillation Frequency: 10Hz 2KHz10Hz for 20 minutes. Equipment Vibration checker. Total Amplitude:10g. Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations). |
| Bending | AppearanceNo damage. Impedancewithin10% of initial value. RDCwithin 15% of initial value and shall not exceed the specification value | Shall be mounted on a FR4 substrate of the following dimensions: >=0805inch(2012mm):40x100x1.2mm; <0805inch(2012mm):40x100x0.8mm. Bending depth: >=0805inch(2012mm):1.2mm; <0805inch(2012mm):0.8mm. Duration of 10 sec for a min. |
| Shock | AppearanceNo damage. Impedancewithin10% of initial value. RDCwithin 15% of initial value and shall not exceed the specification value | Test condition: SMD 50g 11ms Half-sine 11.3 ft/sec; Lead 50g 11ms Half-sine 11.3 ft/sec. |
| Solderability | More than 95% of the terminal electrode should be covered with solder. | a.Method B, 4 hrs @155C dry heat @235C5C Test time:5 +0/-0.5 seconds. b. Method D category 3. (steam aging 8hours 15 min)@ 260C5C Test time: 30 +0/-0.5 seconds. |
| Resistance to Soldering Heat | AppearanceNo damage. Impedancewithin15% of initial value. RDCwithin 15% of initial value and shall not exceed the specification value | Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles). Number of heat cycles: 1. Depth: completely cover the termination. |
| Terminal strength | AppearanceNo damage. Impedancewithin15% of initial value. RDCwithin 15% of initial value and shall not exceed the specification value | Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles). Component mounted on a PCB apply a force >0805inch(2012mm):1kg <=0805inch(2012mm):0.5kg to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to shock the component being tested. |
Recommended PC Board Pattern
For reflow soldering, please refer to the recommended land patterns for various chip sizes.
Soldering
IR Soldering Reflow
Recommended temperature profiles for lead free re-flow soldering are provided in Figure 1 and Table 1.1&1.2 (J-STD-020E). Reflow times: 3 times max.
Soldering Iron
If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Preheat circuit and products to 150. Never contact the ceramic with the iron tip. Use a 20 watt soldering iron with tip diameter of 1.0mm. 350 tip temperature (max). Limit soldering time to 4~5sec. Iron soldering times: 1 time max.
Packaging Information
Available in Tape & Reel packaging. Reel dimensions and tape dimensions are specified for 7"x8mm and 7"x12mm options.
2504101957_ZE-ZECB201209A152-0A400_C18734483.pdf
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