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quality Low DC Resistance Ferrite Chip Bead ZE ZECB321609A500-3A000 for EMI Suppression and Reflow Soldering factory
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quality Low DC Resistance Ferrite Chip Bead ZE ZECB321609A500-3A000 for EMI Suppression and Reflow Soldering factory
>
Specifications
Current Rating:
3A
Number of Circuits:
1
DC Resistance(DCR):
100mΩ
Tolerance:
±25%
Impedance @ Frequency:
50Ω@100MHz
Mfr. Part #:
ZECB321609A500-3A000
Package:
1206
Key Attributes
Model Number: ZECB321609A500-3A000
Product Description

Product Overview

The HCB3216KF-SERIES is a High Current Ferrite Chip Bead designed for EMI suppression. It features a monolithic inorganic material construction with a closed magnetic circuit to avoid crosstalk. This product is suitable for reflow soldering, follows E.I.A. specifications, and offers excellent solderability, heat resistance, and high reliability. It is 100% Lead (Pb) & Halogen-Free and RoHS compliant, with a low DC resistance structure to prevent wasteful electric power consumption. The operating temperature range is -55 to +125 (including self-temperature rise).

Product Attributes

  • Brand: (Zengyi)
  • Origin: Dongguan, China
  • Material: High Current Ferrite Chip Bead (Lead Free)
  • Certifications: Pb-free, Halogen-free, RoHS compliant

Technical Specifications

Tai-Tech Part NumberImpedance ()Test Frequency (MHz)DC Resistance () max.Rated Current (mA) max.
HCB3216KF-300T303025%1000.043000
HCB3216KF-500T305025%1000.043000
HCB3216KF-800T308025%1000.043000
HCB3216KF-121T2012025%1000.102000
HCB3216KF-151T2015025%1000.102000
HCB3216KF-301T1030025%1000.201000
HCB3216KF-471T1047025%1000.201000
HCB3216KF-501T3050025%1000.043000
HCB3216KF-601T2060025%1000.102000

Dimensions (Units: mm)

Chip SizeA (mm)B (mm)C (mm)D (mm)
HCB3216KF-SERIES3.200.201.600.201.100.200.500.30

Part Numbering System

CodeDescription
HCBHigh Current Ferrite Chip Bead(Lead Free)
3216Dimension L x W
KFMaterial
300Impedance (30)
TPackaging (T=Taping and Reel, B=Bulk(Bags))
30Rated Current (3000mA)
ASeries

2405210913_ZE-ZECB321609A500-3A000_C22396524.pdf

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