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Specifications
Current Rating:
800mA
Number of Circuits:
1
DC Resistance(DCR):
150mΩ
Tolerance:
±25%
Impedance @ Frequency:
80Ω@100MHz
Mfr. Part #:
ZECB201209A800-0A800
Package:
0805
Key Attributes
Model Number:
ZECB201209A800-0A800
Product Description
Product Overview
This specification applies to the EBMS-2012 series Ferrite Chip EMI suppressors, designed for suppressing electromagnetic interference.
Product Attributes
- Brand: (Zengyi)
- Origin: China
- Material: Ferrite
- Type: (SMD Ferrite Bead)
- Certifications: RoHS Compliant, Pb Free
Technical Specifications
| PART NO | SPECIFICATION | IMPEDANCE () AT 100 MHz 500mV | DC RESISTANCE Max () | RATED CURRENT Max (mA) | OPERATING TEMP. RANGE | STORAGE TEMP. RANGE | DIMENSION L x W x T (mm) |
| EBMS201209A800 | Ferrite Chip EMI Suppressors | 8025% | 0.15 | 800 | -55 ~ +125 | -10 ~ +40 | 2.00.2 x 1.250.2 x 0.9+0.15/-0.2 |
| ITEM | TEST CONDITIONS | SPECIFICATION |
| Reflow soldering conditions | Preheating: temperature difference between solder and ferrite surface 150 max. Cooling into solvent 100 max. | - |
| Reflow soldering Temperature Profile | A: Slope of temp. rise 1 to 5 /sec B: Heat time 50 to 150 sec C: Heat temperature 120 to 180 D: Time over 230 90~120 sec E: Peak temperature 255~260 Peak hold time 10 max. sec No. of mounting 3 times | - |
| Reworking with soldering iron | Preheating 150, 1 minute Tip temperature 280 max Soldering time 3seconds max. Soldering iron output 30w max. End of soldering iron 3mm max. | Reworking limited to one time. |
| Solder Volume Upper Limit | - | - |
| EQUIPMENT - IMPEDANCE | HP4286A impedance analyzer or equivalent system | - |
| EQUIPMENT - DC RESISTANCE | HP 4338 digital miliohm meter with 4 terminal method | - |
| MECHANICAL CHARACTERISTICS - TERMINAL STRENGTH | Solder chip on PCB and applied 10N (1.02Kgf) for 10 sec | Without deformation cases, impedance shall be satisfied 30%, DC resistance shall be satisfied. |
| MECHANICAL CHARACTERISTICS - Substrate BENDING | Bend the substrate by 3mm hold for 10s and then return. Soldering in accordance with recommended PC board pattern and reflow soldering. | Without deformation cases, impedance shall be satisfied 30%, DC resistance shall be satisfied. |
| MECHANICAL CHARACTERISTICS - RESISTANCE TO SOLDER HEAT | Solder Temp. : 2653, Immersion time : 61 sec, Preheating : 100 to 150, 1 minute. Measurement after 242 hrs at room temp. Solder : Sn-3Ag-0.5Cu | No visible damage. Electrical characteristics and mechanical characteristics shall be satisfied. |
| MECHANICAL CHARACTERISTICS - SOLDERABILITY | Solder temp. : 2405, Immersion time : 31 sec. Solder : Sn-3Ag-0.5Cu | 95% min. coverage of all metabolised area. Consult standard J-STD-002. |
| RELIABILITY AND TEST CONDITIONS - HIGH TEMPERATURE RESISTANCE | Temperature: 1252, Applied current: Rated current, Testing time: 100812hrs. Measurement: After 24 hours at room ambient. | Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied. |
| RELIABILITY AND TEST CONDITIONS - HUMIDITY RESISTANCE | Humidity: 90 to 95% RH, Temperature: 602, Applied current: Rated current, Testing time: 100812hours. Measurement: After 24 hours at room ambient. | Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied. |
| RELIABILITY AND TEST CONDITIONS - TEMPERATURE CYCLE | -55,+125 stabilized for 30 minutes each, 100 cycles. Measurement: After 24 hours at room ambient. Step1: -55 temp3 303 minutes. Step2: Standard atmospheric conditions 5s. Step3: +125 temp2 303 minutes. Step4: Standard atmospheric conditions 5s. | Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied. |
| RELIABILITY AND TEST CONDITIONS - LOW TEMPERATURE STORAGE LIFE TEST | Temperature: -552, Testing time: 100812hours. Measurement: After 24 hours at room ambient. | Appearance: no mechanical damage. Impedance: 30% of initial. DC resistance: satisfied. |
| RELIABILITY AND TEST CONDITIONS - THERMAL SHOCK | -55,+125 stabilized for 30 minutes each, 100 cycles. Measurement: After 24 hours at room ambient. | Appearance: no mechanical damage. Impedance: 30% of initial. |
| RELIABILITY AND TEST CONDITIONS - VIBRATION TEST | Waveform: Sine wave, Frequency: 10~55~10 Hz, Sweep time: 1min, Amplitude: 1.5mm(peak-peak), Direction: X,Y,Z (3 axes), Duration: 2 hrs./axis, total 6 hrs. | Appearance: no mechanical damage. Impedance: 30% of initial. |
| PAPER CARRIER TAPE PACKAGING - Dimensions | - | A: 1.450.05, B: 2.250.05, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.550.05, T: 0.950.05 |
| PAPER CARRIER TAPE PACKAGING - LEADER AND TRAILER TAPE | - | - |
| PAPER CARRIER TAPE PACKAGING - DIRECTION | Seen from the top of cover tape | - |
| REELS PACKING | - | QTY. 4,000 PCS/REEL |
| PEELING STRENGTH OF COVER TAPE | Peel angle: 165~180 vs carrier tape, Peel speed: 300mm/min | Cover tape (10g~100g) |
| PACKAGING | Tape & Reel packaging in composite specification 6/8 | Reel and desiccant in Nylon/plastic bag. Max 5 bags per inner box. Max 6 inner boxes per outer box. |
| Reel Label | - | Indicate (1) Pb Free (2) RoHS Compliant |
| STORAGE | Store at 40 or less and 70% RH or less. Avoid dust, harmful gas, heat, and direct sunlight. | To prevent deterioration of solderability and packaging material deformation. Minimum packages opened just before use. Solderability specified for 6 months from delivery if stored as specified. |
2504101957_ZE-ZECB201209A800-0A800_C18734501.pdf
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