Product Overview
High Current Ferrite Chip Bead (Lead Free) with monolithic inorganic material construction. Features low DC resistance for efficient power consumption, a closed magnetic circuit to prevent crosstalk, and suitability for flow and reflow soldering. Compliant with RoHS legislation and supports lead-free soldering.
Product Attributes
- Brand: Gain ()
- Origin: Dongguan, China
- Material: Monolithic inorganic material, Lead Free Material
- Certifications: RoHS
Technical Specifications
| Part Number | Impedance () | Test Frequency (Hz) | DC Resistance () max. | Rated Current (mA) | Series | Dimension L x W (mm) | Impedance Code | Packaging | Rated Current Code |
| HCB2012KF-401T20 | 40025% | 60mV/100M | 0.10 | 3000 | HCB | 2012 | 401 | T (Taping and Reel) | 30 (3000mA) |
Features
- Monolithic inorganic material construction.
- Low DC resistance structure of electrode to prevent wasteful electric power consumption.
- Closed magnetic circuit avoids crosstalk.
- Suitable for flow and reflow soldering.
- Shapes and dimensions follow E.I.A. spec.
- Available in various sizes.
- Excellent solderability and heat resistance.
- High reliability.
- This component is compliant with RoHS legislation and also support lead-free soldering.
Dimensions
| Chip Size | A (mm) | B (mm) | C (mm) | D (mm) |
| HCB2012KF | 2.000.20 | 1.250.20 | 0.850.20 | 0.500.30 |
Part Numbering
| Code | Description |
| HCB | Series |
| 2012 | Dimension L x W |
| KF | Material (Lead Free Material) |
| 401 | Impedance (400) |
| T | Packaging (Taping and Reel) |
| 20 | Rated Current (2000mA - Note: Datasheet shows 3000mA for HCB2012KF-401T20, this code might be a typo or different convention) |
Specification
| Item | Performance | Test Condition |
| Operating Temperature | -55~+125 | -- |
| Storage Temperature | -55~+125 | -- |
| Impedance (Z) | Refer to standard electrical characteristics list | HP4291A, HP4287A+16092A |
| Inductance (Ls) | -- | HP4338B |
| Q Factor | -- | HP4338B |
| DC Resistance | -- | HP4338B |
| Rated Current | Temperature Rise Test 30max. (T) | 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. |
| Solder heat Resistance | Appearance: No significant abnormality. Impedance change: Within 30%. No mechanical damage. | Preheat: 150,60sec. Solder: Sn-Ag3.0-Cu0.5 Solder temperature: 2605 Flux for lead free: rosin Dip time: 100.5sec. |
| Solderability | More than 90% of the terminal electrode should be covered with solder. | Preheat: 150,60sec. Solder: Sn-Ag3.0-Cu0.5 Solder temperature: 2305 Flux for lead free: rosin Dip time: 41sec. |
| Terminal strength | The terminal electrode and the dielectric must not be damaged by the forces applied on the right conditions. | For HCB: Size 2012, Force (Kfg) 0.6, Time(sec) >25 |
| Flexture strength | The terminal electrode and the dielectric must not be damaged by the forces applied on the right conditions. | Solder a chip on a test substrate, bend the substrate by 2mm (0.079in)and return. |
| Bending Strength | The ferrite should not be damaged by Forces applied on the right condition. | -- |
| Random Vibration Test | Appearance: Cracking, shipping and any other defects harmful to the characteristics should not be allowed. Impedance: within30% | Frequency: 10-55-10Hz for 1 min. Amplitude: 1.52mm Directions and times: X,Y,Z directions for 2 hours. |
| Drop | a: No mechanical damage b: Impedance change: 30% | Drop 10 times on a concrete floor from a height of 75cm |
| Loading at High Temperature | Appearance: no damage. Impedance: within30%of initial value. Inductance: within10%of initial value. Q: within30%of initial value. | Temperature: 1255(bead),855(inductor). Applied current: rated current. Duration: 50012hrs. Measured at room temperature after placing for 2 to 3hrs. |
| Humidity | Appearance: no damage. Impedance: within30%of initial value. Inductance: within10%of initial value. Q: within30%of initial value. | Humidity: 90~95%RH. Temperature: 402. Duration: 50012hrs. Measured at room temperature after placing for 2 to 3hrs. |
| Thermal shock | Appearance: no damage. Impedance: within30%of initial value. Inductance: within10%of initial value. Q: within30%of initial value. | Condition for 1 cycle: Step1: -552 303 min. Step2: +1255 303 min. Number of cycles: 5. Measured at room temperature after placing for 2 to 3 hrs. |
| Low temperature storage test | Appearance: no damage. Impedance: within30%of initial value. Inductance: within10%of initial value. Q: within30%of initial value. | Temperature: -552. Duration: 50012hrs. Measured at room temperature after placing for 2 to 3hrs. |
Soldering and Mounting
Recommended PC Board Pattern
| Series Type | Chip Size | A (mm) | B (mm) | C (mm) | D (mm) | L (mm) | G (mm) | H (mm) |
| HCB | 2012 | 2.00.20 | 1.250.20 | 0.850.20 | 0.500.30 | 3.00 | 1.00 | 1.00 |
Soldering
Lead Free Solder re-flow
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
Solder Wave
Recommended temperature profile for wave soldering is shown in Figure 2. Wave soldering of large size products is discouraged.
Soldering Iron
Recommended precautions: Preheat circuit and products to 150. Never contact the ceramic with the iron tip. Use a 20 watt soldering iron with tip diameter of 1.0mm. 350 tip temperature for Ferrite chip bead (max). Limit soldering time to 3 sec.
Solder Volume
Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in the figure.
Packaging Information
Reel Dimension
| Type | A (mm) | B (mm) | C (mm) | D (mm) |
| 7x8mm | 9.00.5 | 602 | 13.50.5 | 1782 |
| 7x12mm | 13.50.5 | 602 | 13.50.5 | 1782 |
Tape Dimension / 8mm
| Series Size | Bo(mm) | Ao(mm) | Ko(mm) | P(mm) | t(mm) | D1(mm) | |
| HCB | 160808 | 1.800.10 | 1.010.10 | 1.020.10 | 4.00.1 | 0.220.05 | none |
Tape Dimension / 12mm
| Series Size | Bo(mm) | Ao(mm) | Ko(mm) | P(mm) | t(mm) | D1(mm) | |
| HCB | 160808 | 1.800.10 | 1.010.10 | 1.020.10 | 4.00.1 | 0.220.05 | none |
Packaging Quantity
Not specified in the provided text.
Tearing Off Force Application Notice
Storage Conditions
To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: -10~ 40and 30~70% RH. 2. Recommended products should be used within 6 months from the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air.
Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling
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