Product Overview
The ZEMS1050 is an integrated molded power inductor featuring a thin design with low DC resistance and ultra-high current capability. It offers magnetic shielding for strong anti-electromagnetic interference, making it suitable for high-density installations. This inductor boasts high reliability, excellent vibration resistance due to its integral construction, and ultra-low buzz noise from its composite structure. It is manufactured using low-loss alloy powder for low impedance, small parasitic capacitance, high efficiency, and reduced winding and core eddy-current loss. It operates at frequencies up to 3MHz with a maximum voltage of 30VDC and complies with RoHS, Halogen Free, and REACH standards. Applications include PDA, notebook, desktop, server, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: (RSH)
- Origin: Dongguan, China
- Material: Low-loss alloy powder, composite structure
- Certifications: RoHS, Halogen Free, REACH Compliant
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Max | Saturation Current (A) Typ | Temperature Rise Current (A) Typ |
| ZEMS1050-R82M | 0.82 | 20% | 39.00 | 24.00 | 1.0 |
| ZEMS1050-1R0M | 1.0 | 20% | 30.00 | 23.00 | 1.2 |
| ZEMS1050-1R2M | 1.2 | 20% | 28.00 | 21.00 | 1.5 |
| ZEMS1050-1R5M | 1.5 | 20% | 25.00 | 21.00 | 2.2 |
| ZEMS1050-2R2M | 2.2 | 20% | 20.00 | 15.00 | 3.3 |
| ZEMS1050-3R3M | 3.3 | 20% | 18.00 | 13.00 | 4.7 |
| ZEMS1050-4R7M | 4.7 | 20% | 15.00 | 11.00 | 5.6 |
| ZEMS1050-5R6M | 5.6 | 20% | 14.00 | 9.50 | 6.8 |
| ZEMS1050-6R8M | 6.8 | 20% | 14.00 | 9.00 | 8.2 |
| ZEMS1050-8R2M | 8.2 | 20% | 10.00 | 7.00 | 10.0 |
| ZEMS1050-100M | 10.0 | 20% | 8.00 | 10.00 | 15.0 |
| ZEMS1050-150M | 15.0 | 20% | 6.50 | 7.50 | 22.0 |
| ZEMS1050-220M | 22.0 | 20% | 5.50 | 6.00 | 33.0 |
| ZEMS1050-330M | 33.0 | 20% | 4.80 | 47.00 | 4.70 |
| ZEMS1050-470M | 47.0 | 20% | 3.70 | 68.00 | 4.50 |
| ZEMS1050-680M | 68.0 | 20% | 2.70 | 190.00 | 3.50 |
| ZEMS1050-R22M | 0.22 | 20% | 290.00 | 2.10 | 0.8 |
| ZEMS1050-101M | 100.0 | 20% | 270.00 | 2.80 | 0.75 |
Environmental and Reliability Data
| Category | Specification | Test Method/Remarks |
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) | |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for (51) seconds. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. |
| Low temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature -552 for total 1000hr. |
| High temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature 1252 for total 1000hr. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be subjected to (933)%RH at 402 for 96h2h. Inductors are to be tested after having air dried for 2 hours. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | (-403), (303) min (852)/(303) min, conversion time (2~3) min, 5 cycles. Tested after 2 hours at room temperature, within 48 hours. |
| Mechanical Shock | No evidence of terminal peel off and wire broken. | Soldered on 1.0mm thick PCB, fixed in a 15cm, 1.4Kg brass cube, natural fall from 0.5m height (X,Y,Z axes, one time each). |
| Adhesion of terminal electrode | Strong bond between the pad and the core, without come off. | Soldered at 2605 for 20s5s on a substrate with 0.3mm solder paste. Apply 10N vertically to the electrode for 10s1s. |
2410081659_ZE-ZEMS1050-330M_C41415648.pdf
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