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quality High current inductor ZE ZEMS1265-100M with low loss alloy powder construction and RoHS Halogen Free certification factory
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quality High current inductor ZE ZEMS1265-100M with low loss alloy powder construction and RoHS Halogen Free certification factory
>
Specifications
Current Rating:
10.5A
Inductance:
10uH
Tolerance:
±20%
DC Resistance(DCR):
17mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
12.8A
Mfr. Part #:
ZEMS1265-100M
Package:
SMD,13.5x12.8mm
Key Attributes
Model Number: ZEMS1265-100M
Product Description

Product Overview

The ZEMS1265 is an integrated molded inductor designed for high-density installation. It features a thin design with low DC resistance and ultra-high current capabilities, offering magnetic shielding for strong anti-electromagnetic interference. Its composite construction ensures high reliability, excellent vibration resistance, and ultra-low buzz noise. This inductor is suitable for various applications including PDAs, notebooks, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: (ZEMS)
  • Origin: Dongguan, China
  • Material: Low loss alloy powder
  • Certifications: RoHS, Halogen Free, REACH Compliant

Technical Specifications

Part No.Inductance (H)ToleranceDCR (m) MAX.Isat (A) TYP.Irms (A) TYP.
ZEMS1265-R47M0.4720%1.145.036.0
ZEMS1265-R68M0.6820%1.244.033.0
ZEMS1265-1R0M1.020%2.136.025.0
ZEMS1265-1R5M1.520%2.932.024.0
ZEMS1265-2R2M2.220%4.827.020.0
ZEMS1265-3R3M3.320%6.526.017.0
ZEMS1265-4R7M4.720%8.525.017.0
ZEMS1265-5R6M5.620%10.523.513.0
ZEMS1265-6R8M6.820%14.020.012.5
ZEMS1265-8R2M8.220%15.013.811.0
ZEMS1265-100M10.020%17.012.810.5
ZEMS1265-120M12.020%23.010.59.5
ZEMS1265-150M15.020%33.011.58.8
ZEMS1265-180M18.020%35.08.58.0
ZEMS1265-220M22.020%45.09.57.2
ZEMS1265-270M27.020%56.07.06.5
ZEMS1265-330M33.020%65.07.06.0
ZEMS1265-470M47.020%90.06.55.0
ZEMS1265-680M68.020%125.05.04.5
ZEMS1265-101M100.020%145.04.53.3
ZEMS1265-121M120.020%235.03.52.2
ZEMS1265-151M150.020%250.02.71.5

Environmental and Reliability Data

ParameterSpecificationTest Method/Remarks
Operating Temperature-55 to +125 (Including self-heating temperature rise)
Solderability90% or more of electrode area shall be coated by new solder.Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for (51) seconds.
Resistance to Soldering HeatNo visible mechanical damage. Inductance change: Within 10%.Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds.
Low temperature storageNo visible mechanical damage. Inductance change: Within 10%.Store temperature -552 for total 1000hr.
High temperature storageNo visible mechanical damage. Inductance change: Within 10%.Store temperature 1252 for total 1000hr.
Static HumidityNo visible mechanical damage. Inductance change: Within 10%.Subjected to (933)%RH at 402 for 96 h2 h. Tested after 2 hours air drying at room temperature.
Thermal shockNo visible mechanical damage. Inductance change: Within 10%.(-403) for (303) min (852) for (303) min, conversion time (2~3) min, 5 cycles. Tested after 2 hours air drying at room temperature.
Mechanical ShockNo evidence of terminal peel off and wire broken.Soldered on 1.0mm thick PCB, fixed in a 15cm cube (1.4Kg brass base), natural fall from 0.5m height (X,Y,Z axes).
Adhesion of terminal electrodeStrong bond between the pad and the core, without come off.Soldered at 2605 for 20s5s on a substrate with 0.3mm solder paste. Apply 10N perpendicular to electrode surface for 101s.

2411220033_ZE-ZEMS1265-100M_C41415656.pdf

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