Product Overview
The ZEMS1265 is an integrated molded inductor designed for high-density installation. It features a thin design with low DC resistance and ultra-high current capabilities, offering magnetic shielding for strong anti-electromagnetic interference. Its composite construction ensures high reliability, excellent vibration resistance, and ultra-low buzz noise. This inductor is suitable for various applications including PDAs, notebooks, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: (ZEMS)
- Origin: Dongguan, China
- Material: Low loss alloy powder
- Certifications: RoHS, Halogen Free, REACH Compliant
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) MAX. | Isat (A) TYP. | Irms (A) TYP. |
| ZEMS1265-R47M | 0.47 | 20% | 1.1 | 45.0 | 36.0 |
| ZEMS1265-R68M | 0.68 | 20% | 1.2 | 44.0 | 33.0 |
| ZEMS1265-1R0M | 1.0 | 20% | 2.1 | 36.0 | 25.0 |
| ZEMS1265-1R5M | 1.5 | 20% | 2.9 | 32.0 | 24.0 |
| ZEMS1265-2R2M | 2.2 | 20% | 4.8 | 27.0 | 20.0 |
| ZEMS1265-3R3M | 3.3 | 20% | 6.5 | 26.0 | 17.0 |
| ZEMS1265-4R7M | 4.7 | 20% | 8.5 | 25.0 | 17.0 |
| ZEMS1265-5R6M | 5.6 | 20% | 10.5 | 23.5 | 13.0 |
| ZEMS1265-6R8M | 6.8 | 20% | 14.0 | 20.0 | 12.5 |
| ZEMS1265-8R2M | 8.2 | 20% | 15.0 | 13.8 | 11.0 |
| ZEMS1265-100M | 10.0 | 20% | 17.0 | 12.8 | 10.5 |
| ZEMS1265-120M | 12.0 | 20% | 23.0 | 10.5 | 9.5 |
| ZEMS1265-150M | 15.0 | 20% | 33.0 | 11.5 | 8.8 |
| ZEMS1265-180M | 18.0 | 20% | 35.0 | 8.5 | 8.0 |
| ZEMS1265-220M | 22.0 | 20% | 45.0 | 9.5 | 7.2 |
| ZEMS1265-270M | 27.0 | 20% | 56.0 | 7.0 | 6.5 |
| ZEMS1265-330M | 33.0 | 20% | 65.0 | 7.0 | 6.0 |
| ZEMS1265-470M | 47.0 | 20% | 90.0 | 6.5 | 5.0 |
| ZEMS1265-680M | 68.0 | 20% | 125.0 | 5.0 | 4.5 |
| ZEMS1265-101M | 100.0 | 20% | 145.0 | 4.5 | 3.3 |
| ZEMS1265-121M | 120.0 | 20% | 235.0 | 3.5 | 2.2 |
| ZEMS1265-151M | 150.0 | 20% | 250.0 | 2.7 | 1.5 |
Environmental and Reliability Data
| Parameter | Specification | Test Method/Remarks |
| Operating Temperature | -55 to +125 (Including self-heating temperature rise) | |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for (51) seconds. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. |
| Low temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature -552 for total 1000hr. |
| High temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature 1252 for total 1000hr. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Subjected to (933)%RH at 402 for 96 h2 h. Tested after 2 hours air drying at room temperature. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | (-403) for (303) min (852) for (303) min, conversion time (2~3) min, 5 cycles. Tested after 2 hours air drying at room temperature. |
| Mechanical Shock | No evidence of terminal peel off and wire broken. | Soldered on 1.0mm thick PCB, fixed in a 15cm cube (1.4Kg brass base), natural fall from 0.5m height (X,Y,Z axes). |
| Adhesion of terminal electrode | Strong bond between the pad and the core, without come off. | Soldered at 2605 for 20s5s on a substrate with 0.3mm solder paste. Apply 10N perpendicular to electrode surface for 101s. |
2411220033_ZE-ZEMS1265-100M_C41415656.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible