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quality integrated molded inductor ZE ZEMS0420-2R2M with low eddy current loss and RoHS Halogen Free REACH compliance factory
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quality integrated molded inductor ZE ZEMS0420-2R2M with low eddy current loss and RoHS Halogen Free REACH compliance factory
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Specifications
Current Rating:
4.5A
Inductance:
2.2uH
Tolerance:
±20%
DC Resistance(DCR):
58mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
5A
Mfr. Part #:
ZEMS0420-2R2M
Package:
SMD,4.4x4.2mm
Key Attributes
Model Number: ZEMS0420-2R2M
Product Description

Product Overview

The ZEMS0420 is an integrated molded inductor designed for high-density installation. It features a thin design with low DC resistance and ultra-high current capabilities, magnetic shielding for strong anti-electromagnetic interference, and high reliability with excellent vibration resistance due to its integral construction. The composite structure results in ultra-low buzz noise, and it utilizes low-loss alloy powder for low impedance, small parasitic capacitance, high efficiency, and low eddy-current loss. It operates at frequencies up to 3MHz with an absolute maximum voltage of 30VDC and is compliant with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: (ZEMS)
  • Origin: Dongguan, China
  • Material: Low-loss alloy powder
  • Certifications: RoHS, Halogen Free, REACH

Technical Specifications

Part No.Inductance (H)ToleranceDCR (m) TypicalSaturation Current (A) TypicalTemperature Rise Current (A) Typical
ZEMS0420-R10M0.1020%3.5025.0013.00
ZEMS0420-R22M0.2220%6.0013.009.50
ZEMS0420-R33M0.3320%8.0012.0010.00
ZEMS0420-R47M0.4720%12.009.508.00
ZEMS0420-R56M0.5620%14.009.007.00
ZEMS0420-R68M0.6820%18.009.007.00
ZEMS0420-1R0M1.0020%24.007.006.00
ZEMS0420-1R2M1.2020%25.006.506.00
ZEMS0420-1R5M1.5020%40.006.005.00
ZEMS0420-2R2M2.2020%52.005.004.50
ZEMS0420-3R3M3.3020%70.004.003.30
ZEMS0420-4R7M4.7020%105.003.002.80
ZEMS0420-6R8M6.8020%120.002.4010.00
ZEMS0420-100M10.0020%220.001.6013.00

Applications

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Environmental Data

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance: WK3260B LCR meter or equivalent
  • Saturation & Temperature Rise Current: WK3260B+WK3265B
  • DCR: Chroma 16502 or equivalent

Product Identification

  • Product Symbol: ZEMS
  • Dimensions (LWH): 4.4x4.2x1.8 mm
  • Inductance Tolerance: M (20%)

Reliability Data

ItemRequirementsTest Methods and Remarks
Operating Temperature Range-55+125 (Including self-heating temperature rise)
Solderability90% or more of electrode area shall be coated by new solder.Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 245 5 for (51) seconds.
Resistance to Soldering HeatAppearance no visible mechanical damage; Inductance change: Within 10%.Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds.
Low temperature storageAppearance no visible mechanical damage; Inductance change: Within 10%.Store temperature -552 for total 1000hr.
High temperature storageAppearance no visible mechanical damage; Inductance change: Within 10%.Store temperature 1252 for total 1000hr.
Static HumidityAppearance no visible mechanical damage; Inductance change: Within 10%.Inductors shall be subjected to (933)%RH at 40 2 for 96 h2 h. Inductors are to be tested after having air dried for 2 hours.
Thermal shockAppearance no visible mechanical damage; Inductance change: Within 10%.(-403 for (303) min (852) /(303) min, conversion time (2~3) min, 5 cycles; Tested after 2 hours at room temperature within 48 hours.
Mechanical ShockNo evidence of terminal peel off and wire broken.Soldered on PCB (1.0mm thick), fixed in a brass cube (15cm, 1.4Kg), natural fall from 0.5m height (X,Y,Z axes, once each).
Adhesion of terminal electrodeStrong bond between the pad and the core, without come off.Soldered at 260 5 for 20 s5 s on a base with 0.3mm solder paste. Apply 10 N perpendicular to the electrode surface for 101 s.

Packaging

Tape and Reel Specifications: Dimensions are in mm. Cover tape peel force: 10 to 120g. Noodle strip peeling angle: 165 to 180.

Part No.REEL (PCS)Inside Box (PCS)Outside Carton (PCS)
ZEMS0420300012,00036,000
ZEMS05203000600018,000
ZEMS05302000600018,000
ZEMS06242000400012,000
ZEMS06301000300012,000
ZEMS06501000300012,000
ZEMS1040100020006000
ZEMS105080016003600
ZEMS135050010003000
ZEMS136050010003000

Recommended Soldering Profile

Reflow soldering is recommended. Solder: Sn-3.0Ag-0.5Cu. Flux: Rosin-based, avoid strongly acidic or water-soluble flux.

Inspection Rules

Inspection Standard: GB/T2828.1-2003. Appearance and dimensions: Level II, AQL=0.4. L0A and L30DC: S-4, AQL=0.15. Customer must complete inspection and notify supplier in writing within one month of receipt, otherwise it will be considered approved.

Storage Methods

Storage Period: Use within 6 months from delivery to maintain solderability. Check solderability if stored over 6 months.Storage Conditions: Warehouse temperature: -10 to +40, Relative humidity: 30-70%RH. Avoid rapid temperature/humidity changes, chemical atmospheres, bulk storage, direct sunlight, heat shock, and vibration.

Notes

  1. Any revision to this specification requires confirmation from both parties.
  2. The manufacturer is not liable for equipment failure when the product is used outside of general electronics applications.
  3. This specification guarantees the quality of the component as a single unit. Customers must evaluate the product's performance in their application circuit.
  4. This specification approval must be returned with customer's chop within 7 days of receipt, or it will be considered approved.

2411220032_ZE-ZEMS0420-2R2M_C41413051.pdf

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