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quality integrated molding power inductor ZE ZEMS1040-100M with low eddy current loss and strong anti electromagnetic interference factory
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quality integrated molding power inductor ZE ZEMS1040-100M with low eddy current loss and strong anti electromagnetic interference factory
>
Specifications
Current Rating:
7.8A
Inductance:
10uH
Tolerance:
±20%
DC Resistance(DCR):
37mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
8.5A
Mfr. Part #:
ZEMS1040-100M
Package:
SMD,11.5x10mm
Key Attributes
Model Number: ZEMS1040-100M
Product Description

Product Overview

The ZEMS1040 is an integrated molding power inductor designed for high-density installations. It features low DC resistance, ultra-high current capability, magnetic shielding for strong anti-electromagnetic interference, and excellent vibration resistance due to its integral construction. This inductor offers high efficiency with low DC resistance and low eddy-current loss, making it suitable for various DC/DC converter applications.

Product Attributes

  • Brand: (Zengyi Industrial)
  • Origin: Dongguan, China
  • Certifications: RoHS, Halogen Free, REACH Compliant

Technical Specifications

Part No.Inductance (H)ToleranceTest Frequency/VoltageDCR Max (m)Saturation Current Isat (A)Temperature Rise Current Irms (A)
ZEMS1040-R015M0.1520%100kHz/1.0V0.6575.0045.00
ZEMS1040-R022M0.2220%100kHz/1.0V1.2060.0035.00
ZEMS1040-R030M0.3020%100kHz/1.0V1.2050.0035.00
ZEMS1040-R036M0.3620%100kHz/1.0V1.7050.0030.00
ZEMS1040-R047M0.4720%100kHz/1.0V1.9040.0030.00
ZEMS1040-R056M0.5620%100kHz/1.0V2.1033.0025.00
ZEMS1040-R068M0.6820%100kHz/1.0V2.3030.0023.00
ZEMS1040-R080M0.8020%100kHz/1.0V2.5029.0023.00
ZEMS1040-1R0M1.0020%100kHz/1.0V3.0028.0019.00
ZEMS1040-1R5M1.5020%100kHz/1.0V4.0026.0016.00
ZEMS1040-2R2M2.2020%100kHz/1.0V7.0018.0012.00
ZEMS1040-3R3M3.3020%100kHz/1.0V10.8016.0011.00
ZEMS1040-4R7M4.7020%100kHz/1.0V17.0015.009.00
ZEMS1040-5R6M5.6020%100kHz/1.0V20.0012.008.50
ZEMS1040-6R8M6.8020%100kHz/1.0V22.5012.008.50
ZEMS1040-8R2M8.2020%100kHz/1.0V25.509.008.00
ZEMS1040-100M10.0020%100kHz/1.0V34.008.507.80
ZEMS1040-150M15.0020%100kHz/1.0V50.007.006.50
ZEMS1040-220M22.0020%100kHz/1.0V60.006.005.00
ZEMS1040-330M33.0020%100kHz/1.0V85.005.004.40
ZEMS1040-470M47.0020%100kHz/1.0V141.004.503.30
ZEMS1040-560M56.0020%100kHz/1.0V141.003.202.80
ZEMS1040-680M68.0020%100kHz/1.0V200.003.802.50
ZEMS1040-820M82.0020%100kHz/1.0V180.002.802.30
ZEMS1040-101M100.0020%100kHz/1.0V237.002.502.00

Applications

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Environmental Data

  • Operating Temperature: -55 to +125 (Including self-temperature rise)

Test Equipment

  • Inductance (L): WK3260B LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): WK3260B+WK3265B
  • DC Resistance (DCR): Chroma 16502 or equivalent

Reliability Data

ItemRequirementsTest Methods and Remarks
Operating Temperature Range-55+125Including self-heating temperature rise.
Solderability90% or more of electrode area shall be coated by new solder.Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for (51) seconds.
Resistance to Soldering HeatNo visible mechanical damage. Inductance change: Within 10%Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds.
Low temperature storageNo visible mechanical damage. Inductance change: Within 10%Store temperature -552 for total 1000hr.
High temperature storageNo visible mechanical damage. Inductance change: Within 10%Store temperature 1252 for total 1000hr.
Static HumidityNo visible mechanical damage. Inductance change: Within 10%Inductors shall be subjected to (933)%RH at 402 for 96 h2 h. Inductors are to be tested after having air dried for 2 hours.
Thermal shockNo visible mechanical damage. Inductance change: Within 10%(-403) for (303) min (852) for (303) min, conversion time (2~3) min, cycle 5 times; tested after 2 hours air drying at room temperature.
Mechanical ShockNo evidence of terminal peel off and wire broken.Soldered on a 1.0mm thick PCB and fixed in a 15cm cube (brass, 1.4Kg), then dropped from 0.5m height (X, Y, Z axes, one time each).
Adhesion of terminal electrodeStrong bond between the pad and the core, without come off.Soldered at 2605 for 20s5s on a substrate with 0.3mm solder paste. Apply 10N force vertically to the electrode surface for 10s1s.

2410081701_ZE-ZEMS1040-100M_C41415635.pdf

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