Product Overview
The ZEMS0420 is an integrated molding power inductor designed for high-density installation. It features low DC resistance, ultra-high current capability, and a thin design with magnetic shielding for strong anti-electromagnetic interference. Its composite structure ensures ultra-low buzz noise and high reliability with excellent vibration resistance. This inductor is suitable for various applications including PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: (ZEMS)
- Origin: Dongguan, China
- Material: Low loss alloy powder
- Certifications: RoHS, Halogen Free, REACH Compliant
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Temperature Rise Current (A) Typical |
| ZEMS0420-R10M | 0.10 | 20% | 3.50 | 25.00 | 13.00 |
| ZEMS0420-R22M | 0.22 | 20% | 6.00 | 13.00 | 9.50 |
| ZEMS0420-R33M | 0.33 | 20% | 8.00 | 12.00 | 10.00 |
| ZEMS0420-R47M | 0.47 | 20% | 12.00 | 9.50 | 8.00 |
| ZEMS0420-R56M | 0.56 | 20% | 14.00 | 9.00 | 7.00 |
| ZEMS0420-R68M | 0.68 | 20% | 18.00 | 9.00 | 7.00 |
| ZEMS0420-1R0M | 1.00 | 20% | 24.00 | 7.00 | 6.00 |
| ZEMS0420-1R2M | 1.20 | 20% | 25.00 | 6.50 | 6.00 |
| ZEMS0420-1R5M | 1.50 | 20% | 40.00 | 6.00 | 5.00 |
| ZEMS0420-2R2M | 2.20 | 20% | 52.00 | 5.00 | 4.50 |
| ZEMS0420-3R3M | 3.30 | 20% | 70.00 | 4.00 | 3.30 |
| ZEMS0420-4R7M | 4.70 | 20% | 105.00 | 3.00 | 2.80 |
| ZEMS0420-6R8M | 6.80 | 20% | 120.00 | 2.40 | 10.00 |
| ZEMS0420-100M | 10.00 | 20% | 220.00 | 1.60 | 13.00 |
Environmental & Test Conditions
| Parameter | Value | Notes |
| Operating Temperature | -55 to +125 | Including coils self-temperature rise |
| Test Equipment (Inductance) | WK3260B LCR meter or equivalent | |
| Test Equipment (Isat & Irms) | WK3260B+WK3265B | |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Reliability Data
| Test Item | Requirements | Test Methods and Remarks |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 245 5 for (51) seconds. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. |
| Low temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature -552 for total 1000hr. |
| High temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature 1252 for total 1000hr. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Subjected to (933)%RH at 40 2 for 96 h2 h. Tested after air drying for 2 hours. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | (-403 for (303) min (852) /(303) min, conversion time (2~3) min, 5 cycles. Tested after air drying for 2 hours. |
| Mechanical Shock | No evidence of terminal peel off and wire broken. | Soldered on 1.0mm PCB, fixed in a 15cm cube (1.4Kg), fallen from 0.5m height (X,Y,Z axes). |
| Adhesion of terminal electrode | Strong bond between the pad and the core, without come off. | Soldered in base with 0.3mm solder at 260 5 for 20 s5 s. Apply 10 N vertically for 10 1s. |
Storage and Handling
| Parameter | Conditions | Notes |
| Storage Period | Within 6 months from delivery | Confirm solderability if storage exceeds 6 months. |
| Storage Temperature | -10 to +40 | |
| Storage Humidity | 30% to 70% RH | |
| Storage Environment | Avoid rapid temperature/humidity changes, chemical atmospheres (sulfurous acid gas, alkaline gas), bulk packaging, humidity, dust, heat shock, vibration, and direct sunlight. Store on pallets. |
2411220032_ZE-ZEMS0420-3R3M_C41413056.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible