<
>
Specifications
Current Rating:
4A
Number of Circuits:
1
DC Resistance(DCR):
25mΩ
Tolerance:
±25%
Impedance @ Frequency:
40Ω@100MHz
Mfr. Part #:
ZECB321609A400-4A000
Package:
1206
Key Attributes
Model Number:
ZECB321609A400-4A000
Product Description
Ferrite Chip EMI Suppressors - BCMS3216 Series
This specification applies to the BCMS3216 series Ferrite Chip EMI suppressors. These components are designed to suppress electromagnetic interference (EMI) in electronic circuits.
Product Attributes
- Brand: (Zengyi)
- Origin: Taichung, Taiwan
- Material: Ferrite
- Type: (SMD Chip Beads)
- Certifications: RoHS Compliant, Pb Free
Technical Specifications
| Part Number | Impedance () at 100 MHz, 500mV | DC Resistance () Max | Rated Current (mA) Max | Operating Temp. Range | Storage Temp. Range | Dimensions (L x W x T) (mm) |
| BCMS321609A400 | 4025% | 0.006 | 6000 | -55 ~ +125 | -10 ~ +40 | 3.20.2 x 1.60.2 x 0.90.2 |
Reflow Soldering Conditions
Pre-heating: Temperature difference between solder and ferrite surface limited to 150 max. Cooling into solvent after soldering limited to 100 max.
Temperature Profile:
- Slope of temp. rise: 1 to 5 /sec
- Heat time: 50 to 150 sec
- Heat temperature: 120 to 180
- Time over 230: 90~120 sec
- Peak temperature: 255~260
- Peak hold time: 10 max. sec
- No. of mounting: 3 times
Reworking with soldering iron: Preheating 150, 1 minute; Tip temperature 280 max; Soldering time 3 seconds max; Soldering iron output 30w max; End of soldering iron 3mm max. Reworking limited to one time.
Equipment for Measurement
- Impedance: HP-4286A impedance analyzer or equivalent
- DC Resistance: HP 4338 digital mili-ohm meter with 4 terminal method
Mechanical Characteristics
| Item | Specification | Test Conditions |
| Terminal Strength | Impedance shall be satisfied 30% for 10 sec. DC resistance shall be satisfied. | Solder chip on PCB and applied 10N (1.02Kgf) |
| Substrate Bending | Impedance shall be satisfied 30%. DC resistance shall be satisfied. | After soldering a chip to a test substrate, bend the substrate by 3mm hold for 10s and then return. Soldering in accordance with recommended PC board pattern and reflow soldering. |
| Resistance to Solder Heat | No visible damage. Electrical characteristics and mechanical characteristics shall be satisfied. | Solder Temp.: 2653; Immersion time: 61 sec; Preheating: 100 to 150, 1 minute. Measurement after keeping at room temp for 242 hrs. |
| Solderability | 95% min. coverage of all metallised area. | Solder temp.: 2405; Immersion time: 31 sec. Consult standard J-STD-002. |
Reliability and Test Conditions
| Test Item | Performance Specification | Test Condition |
| High Temperature Resistance | Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied. | Temperature: 1252; Applied current: Rated current; Testing time: 100812hrs; Measurement: After 24 hours at room ambient temp. |
| Humidity Resistance | Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied. | Humidity: 90 to 95% RH; Temperature: 602; Applied current: Rated current; Testing time: 100812hours; Measurement: After 24 hours at room ambient temp. |
| Temperature Cycle | Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied. | -55,+125 stabilized for 30 min each; 100 cycles. Measurement: After 24 hours at room ambient temp. Steps: -55 (303 min), Standard conditions (5s), +125 (303 min), Standard conditions (5s). |
| Low Temperature Storage Life Test | Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied. | Temperature: -552; Testing time: 100812hours; Measurement: After 24 hours at room ambient temp. |
| Thermal Shock | Appearance: no mechanical damage. Impedance: 30% of initial value. | -55,+125 stabilized for 30 min each; 100 cycles. Measurement: After 24 hours at room ambient temp. |
| Vibration Test | Appearance: no mechanical damage. Impedance: 30% of initial value. | Waveform: Sine wave; Frequency: 10~55~10 Hz; Sweep time: 1min; Amplitude: 1.5mm(peak-peak); Direction: X,Y,Z (3 axes); Duration: 2 hrs./axis, total 6 hrs. |
Embossed Carrier Tape Packaging
| Dimension | A0 | B0 | W | F | E | P1 | P2 | P0 | D0 | D1 | K | T | T2 |
| Value (mm) | 1.880.1 | 3.50.1 | 8.00.2 | 3.50.05 | 1.750.1 | 4.00.1 | 2.000.05 | 4.00.1 | 1.550.05 | 1.00.1 | 1.270.1 | 0.230.1 | 1.270.1 |
Leader and Trailer Tape: Specified.
Reels Packing Qty: 4,000 PCS/REEL
Peeling Strength of Cover Tape: 10g~100g (Test condition: peel angle 165~180, peel speed 300mm/min)
Packaging
- Tape & Reel packaging
- Reel and a bag of desiccant in a Nylon or plastic bag
- Max. 5 bags per inner box
- Max. 6 inner boxes per outer box
Storage
- Store at 40 or less and 70% RH or less.
- Avoid dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide).
- Avoid heat or direct sunlight.
- Minimum packages shall not be opened until just before use.
- Solderability is guaranteed for 6 months from the date of delivery under specified storage conditions.
2504101957_ZE-ZECB321609A400-4A000_C18734487.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
