ZEMS0420 Integrated Molding Power Inductor Specification
Product Overview: The ZEMS0420 is a thin, integrated molding power inductor designed for high-density installation. It features low DC resistance, ultra-high current capability, magnetic shielding for strong anti-electromagnetic interference, and high reliability with excellent vibration resistance. Its composite structure results in ultra-low buzz noise and low impedance due to the use of low-loss alloy powder. This inductor is suitable for various applications including PDA, notebooks, servers, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: (Zhensheng Industry)
- Origin: Dongguan, China
- Material: Low-loss alloy powder
- Certifications: RoHS, Halogen Free, REACH Compliant
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Temperature Rise Current (A) Typical |
|---|---|---|---|---|---|
| ZEMS0420-R010M | 0.10 | 20% | 3.50 | 25.00 | 13.00 |
| ZEMS0420-R022M | 0.22 | 20% | 6.00 | 13.00 | 9.50 |
| ZEMS0420-R033M | 0.33 | 20% | 8.00 | 12.00 | 10.00 |
| ZEMS0420-R047M | 0.47 | 20% | 12.00 | 9.50 | 8.00 |
| ZEMS0420-R056M | 0.56 | 20% | 14.00 | 9.00 | 7.00 |
| ZEMS0420-R068M | 0.68 | 20% | 18.00 | 9.00 | 7.00 |
| ZEMS0420-1R0M | 1.00 | 20% | 24.00 | 7.00 | 6.00 |
| ZEMS0420-1R2M | 1.20 | 20% | 25.00 | 6.50 | 6.00 |
| ZEMS0420-1R5M | 1.50 | 20% | 40.00 | 6.00 | 5.00 |
| ZEMS0420-2R2M | 2.20 | 20% | 52.00 | 5.00 | 4.50 |
| ZEMS0420-3R3M | 3.30 | 20% | 70.00 | 4.00 | 3.30 |
| ZEMS0420-4R7M | 4.70 | 20% | 105.00 | 3.00 | 2.80 |
| ZEMS0420-6R8M | 6.80 | 20% | 120.00 | 2.40 | 10.00 |
| ZEMS0420-100M | 10.00 | 20% | 220.00 | 1.60 |
| Characteristic | Value | Test Method and Remarks |
|---|---|---|
| Operating Temperature Range | -55 to +125 (Including coils self-temperature rise) | |
| Absolute maximum voltage | 30VDC | |
| Frequency up to | 3MHz | |
| Dimensions (LWH) | 4.4x4.2x1.8 mm | |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 245 5 for (51) seconds. |
| Resistance to Soldering Heat | Appearance no visible mechanical damage; Inductance change: Within 10%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. |
| Low temperature storage | Appearance no visible mechanical damage; Inductance change: Within 10%. | Store temperature -552 for total 1000hr. |
| High temperature storage | Appearance no visible mechanical damage; Inductance change: Within 10%. | Store temperature 1252 for total 1000hr. |
| Static Humidity | Appearance no visible mechanical damage; Inductance change: Within 10%. | Inductors shall be subjected to (933)%RH . at 40 2 for 96 h2 h .Inductors are to be tested after having air dried for 2 hours. |
| Thermal shock | Appearance no visible mechanical damage; Inductance change: Within 10%. | (-403, time(303) min (852) /(303) min, conversion time (2~3) min, cycle 5 times; Tested after 2 hours at room temperature, within 48 hours. |
| Mechanical Shock | No evidence of terminal peel off and wire broken. | Inductors shall be Soldering on the PCB with 1.0mm thick and fixed them in a 15cm big.,1.4Kg weight cube with brass base, let it nature fallen form 0.5m height (X,Y,Z three axes) |
| Adhesion of terminal electrode | Strong bond between the pad and the core, without come off PC board. | Inductors shall be Subjected to 260 5 for 20 s5 s Soldering in the base with 0.3mm solder. And then aplomb electrode way plus tax 10 N for 10 1s seconds. |
Note: Saturated Current (Isat) is defined as the DC current that causes a 30% inductance reduction from the initial value. Temperature Rise Current (IDC) is defined as the DC current that causes the inductor surface temperature to rise by 40 (reference ambient temperature 25).
2411220032_ZE-ZEMS0420-1R0M_C41413055.pdf
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