Product Overview
The ZEMS0530 is an integrated molding power inductor designed for high-density installation. It features a thin design with low DC resistance and ultra-high current capabilities, magnetic shielding for strong anti-electromagnetic interference, and high reliability with excellent vibration resistance due to its integral construction. This inductor offers ultra-low buzz noise and high efficiency with low eddy-current loss, making it suitable for various DC/DC converter applications.
Product Attributes
- Brand: ZEMS ()
- Origin: Dongguan, China
- Material: Low loss alloy powder, composite construction
- Certifications: RoHS, Halogen Free, REACH Compliant
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Temperature Rise Current (A) Typical | Dimensions (LWH) (mm) |
| ZEMS0530-R22M | 0.22 | 20% | 3.50 | 14.0 | 0.3 | 5.4x5.2x2.8 |
| ZEMS0530-R33M | 0.33 | 20% | 3.70 | 14.00 | 0.4 | 5.4x5.2x2.8 |
| ZEMS0530-R47M | 0.47 | 20% | 7.40 | 12.00 | 0.6 | 5.4x5.2x2.8 |
| ZEMS0530-R68M | 0.68 | 20% | 11.00 | 9.00 | 1.0 | 5.4x5.2x2.8 |
| ZEMS0530-1R0M | 1.0 | 20% | 12.00 | 8.50 | 1.2 | 5.4x5.2x2.8 |
| ZEMS0530-1R2M | 1.2 | 20% | 15.00 | 8.50 | 1.5 | 5.4x5.2x2.8 |
| ZEMS0530-1R5M | 1.5 | 20% | 20.00 | 8.20 | 2.2 | 5.4x5.2x2.8 |
| ZEMS0530-2R2M | 2.2 | 20% | 31.00 | 7.00 | 3.3 | 5.4x5.2x2.8 |
| ZEMS0530-3R3M | 3.3 | 20% | 35.00 | 5.50 | 4.7 | 5.4x5.2x2.8 |
| ZEMS0530-4R7M | 4.7 | 20% | 50.00 | 4.50 | 6.8 | 5.4x5.2x2.8 |
| ZEMS0530-6R8M | 6.8 | 20% | 102.00 | 3.50 | 10.0 | 5.4x5.2x2.8 |
| ZEMS0530-100M | 10.0 | 20% | 110.00 | 3.20 | 15.0 | 5.4x5.2x2.8 |
| ZEMS0530-150M | 15.0 | 20% | 175.00 | 2.20 | 22.0 | 5.4x5.2x2.8 |
| ZEMS0530-220M | 22.0 | 20% | 320.00 | 1.80 | 30.0 | 5.4x5.2x2.8 |
| ZEMS0530-330M | 33.00 | 20% | 350.00 | 2.00 | 33.0 | 5.4x5.2x2.8 |
Environmental and Reliability Data
| Item | Requirements | Test Methods and Remarks |
| Operating Temperature Range | -55+125 (Including coils self-temperature rise) | |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 245 5 for (51) seconds. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for (101) seconds. |
| Low temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature -552 for total 1000hr. |
| High temperature storage | No visible mechanical damage. Inductance change: Within 10%. | Store temperature 1252 for total 1000hr. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be subjected to (933)%RH at 40 2 for 96 h2 h. Inductors are to be tested after having air dried for 2 hours. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | (-403, time(303) min (852) /(303) min, conversion time (2~3) min, cycle 5 times; Tested after 2 hours at room temperature. |
| Mechanical Shock | No evidence of terminal peel off and wire broken. | Inductors shall be Soldering on the PCB with 1.0mm thick and fixed them in a 15cm big., 1.4Kg weight cube with brass base, let it nature fallen form 0.5m height (X,Y,Z three axes) |
| Adhesion of terminal electrode | Strong bond between the pad and the core, without come off PC board. | Inductors shall be Soldered in the base with 0.3mm solder at 260 5 for 20 s5 s. And then apply 10 N for 10 1s seconds in the perpendicular electrode direction. |
2411220032_ZE-ZEMS0530-6R8M_C41413110.pdf
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