<
>
Specifications
Current Rating:
6A
Number of Circuits:
1
DC Resistance(DCR):
15mΩ
Impedance @ Frequency:
0Ω@100MHz
Mfr. Part #:
ZECB321609A000-6A000
Package:
1206
Key Attributes
Model Number:
ZECB321609A000-6A000
Product Description
Ferrite Chip EMI Suppressors BCMS-3216 Series
This specification applies to the BCMS-3216 series Ferrite Chip EMI suppressors, designed for noise suppression applications.
Product Attributes
- Brand: (Zengyi)
- Origin: Taichung, Taiwan
- Material: Ferrite
- Type: (SMD Magnetic Beads)
Technical Specifications
| Part Number | Impedance () at 100 MHz, 500mV | DC Resistance () Max | Rated Current (mA) Max | Operating Temp. Range | Storage Temp. Range | Dimensions (L x W x T) mm |
| BCMS321609A000 | 0 25% | 0.015 | 6000 | -55 ~ +125 | -10 ~ +40 | 3.20.2 x 1.60.2 x 0.90.2 |
| BCMS321611A000 | N/A | N/A | N/A | N/A | N/A | N/A |
Soldering Conditions
| Type | Conditions |
| Reflow Soldering | Pre-heating: Temperature difference between solder and ferrite surface 150 max. Cooling into solvent 100 max. Temperature Profile: Slope of temp. rise (A, C): 1 to 5 /sec; Heat time (B): 50 to 150 sec; Heat temperature: 120 to 180 ; Time over 230 (D): 90~120 sec; Peak temperature (E): 255~260 ; Peak hold time: 10 max. sec. Number of mounting: 3 times. |
| Reworking with Soldering Iron | Preheating: 150, 1 minute. Tip temperature: 280 max. Soldering time: 3 seconds max. Soldering iron output: 30w max. End of soldering iron: 3mm max. Reworking limited to one time. |
Mechanical Characteristics
| Item | Specification | Test Conditions |
| Terminal Strength | Without deformation cases, impedance shall be satisfied 30% for 10 sec | Solder chip on PCB and applied 10N (1.02Kgf) |
| Substrate Bending | Without deformation cases, impedance shall be satisfied 30% | After soldering a chip to a test substrate, bend the substrate by 3mm hold for 10s and then return. |
| Resistance to Solder Heat | No visible damage, Electrical characteristics and mechanical characteristics shall be satisfied. | Solder Temp.: 2653; Immersion time: 61 sec; Preheating: 100 to 150, 1 minute. Measurement after 242 hrs at room temp. |
| Solderability | 95% min. coverage of all metabolised area | Solder temp.: 2405; Immersion time: 31 sec. Solder: Sn-3Ag-0.5Cu. |
Reliability and Test Conditions
| Test | Performance Specification | Test Condition |
| High Temperature Resistance | Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied. | Temperature: 1252. Applied current: Rated current. Testing time: 100812hrs. Measurement after 24 hours minimum at room ambient temperature. |
| Humidity Resistance | Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied. | Humidity: 90 to 95% RH. Temperature: 602. Applied current: Rated current. Testing time: 100812hours. Measurement after 24 hours minimum at room ambient temperature. |
| Temperature Cycle | Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied. | -55,+125 stabilized for 30 minutes each. 100 cycles. Measurement after 24 hours minimum at room ambient temperature. Steps: -55 (303 min), Standard atmospheric (5s), +125 (303 min), Standard atmospheric (5s). |
| Low Temperature Storage Life Test | Appearance: no mechanical damage. Impedance: 30% of initial value. DC resistance: satisfied. | Temperature: -552. Testing time: 100812hours. Measurement after 24 hours minimum at room ambient temperature. |
| Thermal Shock | Appearance: no mechanical damage. Impedance: 30% of initial value. | -55,+125 stabilized for 30 minutes each. 100 cycles. Measurement after 24 hours minimum at room ambient temperature. |
| Vibration Test | Appearance: no mechanical damage. Impedance: 30% of initial value. | Waveform: Sine wave. Frequency: 10~55~10 Hz. Sweep time: 1min. Amplitude: 1.5mm(peak-peak). Direction: X,Y,Z (3 axes). Duration: 2 hrs./axis, total 6 hrs. |
Embossed Carrier Tape Packaging
| Dimension | A0 | B0 | W | F | E | P1 | P2 | P0 | D0 | D1 | K | T | T2 |
| Value (mm) | 1.88 0.1 | 3.5 0.1 | 8.0 0.2 | 3.5 0.05 | 1.75 0.1 | 4.0 0.1 | 2.00 0.05 | 4.0 0.1 | 1.55 0.05 | 1.0 0.1 | 1.27 0.1 | 0.23 0.1 | 1.27 0.1 |
- Reel Packing Qty: 3,000 PCS/REEL
- Cover Tape Peeling Strength: 10g~100g (Peel angle: 165~180, Peel speed: 300mm/min)
Packaging
- Tape & Reel packaging in composite specification 6/8
- Reel and a bag of desiccant packed in Nylon or plastic bag
- Maximum of 5 bags in an inner box
- Maximum of 6 inner boxes in an outer box
- Reel Label: Must indicate (1) Pb Free (2) RoHS Compliant
Storage
- Store at 40 or less and 70% RH or less to prevent solderability deterioration.
- Avoid storage in dusty or harmful gas environments.
- Protect from heat and direct sunlight to prevent packaging deformation.
- Minimum packages should not be opened until just before use. Use opened reels as soon as possible.
- Solderability is guaranteed for 6 months from the date of delivery under specified storage conditions. Parts exceeding 6 months should be checked for solderability before use.
2504101957_ZE-ZECB321609A000-6A000_C18734488.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
