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Specifications
Current Rating:
3.7A
Inductance:
6.8uH
Tolerance:
±20%
DC Resistance(DCR):
90mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
5.4A
Mfr. Part #:
XRIM404020S6R8MGCA
Package:
SMD,4x4mm
Key Attributes
Model Number:
XRIM404020S6R8MGCA
Product Description
Product Overview
The XRIM404020S6R8MGCA is a miniaturized integrated inductor from Dongguan xiangru electronics co., ltd. It features a metal dust core for high performance and low loss, a closed magnetic circuit design to reduce leakage flux, and a vinyl thermal spray for improved surface compactness. This product complies with RoHS2.0 and Halogen, Reach standards, and is lead-free.
Product Attributes
- Brand: Dongguan xiangru electronics co., ltd
- Origin: China
- Material: Metal dust core
- Coating Color: Gray
- Certifications: RoHS2.0, Halogen, Reach
Technical Specifications
| P/N | L0(H) @ 1MHz | Rdc(m) Typical | Rdc(m) Max | Irms(A) Typical | Isat(A) Typical |
| XRIM404020S6R8MGCA | 8 | 90 | 105 | 5.4 | 4.5 |
Dimensions
| Series | L (mm) | W (mm) | H (mm) | Size Tolerance | Inductance Value | Tolerance |
| XRIM404020S | 4.10.2 | 4.10.2 | 2.0 Max. | S=0.2mm | 6R8=6.8uH | M=20% |
Reliability and Operating Conditions
| Item | Requirements | Test Methods and Remarks |
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 12 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553)and (1253)for (303) , different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 10% | a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 Pc-b LbLc 100% Pc-dLdLc 100% Lc Lc |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Life | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing |
| Operating Temperature Range | -55to + 125 | The part temperature (ambient +temp rise) should not exceed 125 under the worst case operating conditions. |
Applications
DC/DC converters, Pad, Smart phone, Portable gaming devices, Smart wear, Wi-Fi module, Notebooks, VR, AR, LCD displays, HDDs, DVCs, DSCs, Baseband power supply, Amplifier, Power management, Module power supply, Camera power management.
2504101957_XR-XRIM404020S6R8MGCA_C39846860.pdf
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