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quality High Current Mini Molding Power Inductor XR XRTC303015D100MBCA with Low Loss and Metal Dust Core Design factory
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quality High Current Mini Molding Power Inductor XR XRTC303015D100MBCA with Low Loss and Metal Dust Core Design factory
>
Specifications
Current Rating:
2A
Inductance:
10uH
Tolerance:
±20%
DC Resistance(DCR):
185mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
2.8A
Mfr. Part #:
XRTC303015D100MBCA
Package:
SMD,3x3mm
Key Attributes
Model Number: XRTC303015D100MBCA
Product Description

Product Overview

The XRTC303015D100MBCA is a Mini Molding Power Inductor designed for high current and low loss applications. It features a metal dust core for high performance (Isat), low Rdc for reduced loss, and a closed magnetic circuit to minimize leakage flux. The inductor is coated with vinyl thermal spray for improved surface compactness and is compliant with RoHS2.0 and Halogen standards, being 100% lead-free.

Product Attributes

  • Brand: (Xiangru Electronics)
  • Origin: Dongguan, China
  • Material: Metal dust core
  • Color: Black
  • Certifications: RoHS2.0, Halogen, Reach

Technical Specifications

P/NL0 (H) @ 1MHzRdc (m) TypicalRdc (m) MaxIrms (A) TypicalIsat (A) TypicalIsat (A) Max
XRTC303015D100MBCA10.01852151.52.82.5
SeriesL (mm)W (mm)H (mm)Inductance ToleranceCoating ColorProduct Type
XRTC303015D3.00.13.00.11.5Max.20% (M)Black (B)Common (C)
ItemRequirementsTest Methods and Remarks
Insulation Resistance100M100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
Solderability90% or more of electrode area shall be coated by new solder.Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s.
Resistance to Soldering HeatNo visible mechanical damage. Inductance change: Within 10%.Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec.
Adhesion of teral electrodeStrong bond between the pad and the core, without come off PCB.Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 12 N for (101) seconds.
High temperatureNo case deformation or change in appearance. Inductance change: Within 10%Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Low temperatureNo visible mechanical damage. Inductance change: Within 10%Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shockNo visible mechanical damage. Inductance change: Within 10%The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing.
Temperature characteristicInductance change Pc-b,Pc-d: Within 10%a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 Pc-b LbLc 100% Pc-dLdLc 100% Lc Lc
Static HumidityNo visible mechanical damage. Inductance change: Within 10%Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing.
LifeNo visible mechanical damage. Inductance change: Within 10%Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing.

2410121730_XR-XRTC303015D100MBCA_C39846822.pdf

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