Product Overview
This document outlines the specifications for the XRFWHP0660A-2R2M Molding Power Inductor. It details electrical characteristics, dimensions, test data, and packaging information for this component, designed for various electronic applications requiring precise inductance and current handling capabilities.
Product Attributes
- Brand: xiangru electronics
- Origin: Dongguan, China
- Product Name: Molding Power Inductors
- Our Part Number: XRFWHP0660A-2R2M
Technical Specifications
| Item | Specification | Test Conditions / Method |
| Product Name | Molding Power Inductors | - |
| Our Part No. | XRFWHP0660A-2R2M | - |
| Customer P/N | XRFWHP0660A | - |
| Description | 2.2uH 20% 7.4A | - |
| Inductance (L) | 2.2H 20% | 1MHz, 0.1V |
| DC Resistance (DCR) | 7.4A Max. / 7.0 (Typ.) | @25 |
| Saturation Current (Isat) | 15.0A Typ. | L drop approximately 30% @ IDC 15.0A (L 15A/L0A*100% 70%Internal control standards at 40% max) |
| Rated Current (Irms) | 18.1A Typ. | (T)40 |
| Use Frequency Range | 6.1 MHz (REF) | - |
| Operating Temperature Range | -55 ~ +125 | - |
| Dimensions (A) | 6.40.3 mm | - |
| Dimensions (B) | 6.60.3 mm | - |
| Dimensions (C) | 5.80.3 mm | - |
| Dimensions (D) | 5.10.5 mm | - |
| Dimensions (E) | 1.40.3 mm | - |
| Dimensions (F) | 2.60.3 mm | - |
| PCB Pattern (G) | 2.50 m/m (REF) | - |
| PCB Pattern (H) | 5.60 m/m (REF) | - |
| PCB Pattern (I) | 1.60 m/m (REF) | - |
| Rated Current Test | Inductance change < 30% of initial value and temperature rise < 40 | Applied rated DC current for 4 hours |
| Overload Test | No evidence of electrical damage | Applied 1.5 times rated DC current for 5 minutes |
| Solder Heat Resistance | No electrical/mechanical damage, Inductance change 10% | Preheat: 150 100s, Solder Temp: 2555, Dip Time: 10s Max. |
| Vibration Test | - | Amplitude: 1.5 mm, Freq: 10-55-10Hz/1min, Direction: X,Y,Z, Duration: 2 Hrs/axis |
| Shock Test | - | Dropped 10 times from 1m height onto 3cm wooden board |
| Solderability Test | >90% of terminal electrode covered with solder | Preheat: 150 120s, Solder Bath: 2555, Dip Time: 10s Max. |
| Component Adhesion (Push) | Min. 1.5Kg | Reflow soldered (2555 for 10s) to copper substrate, force applied to side |
| Component Adhesion (Pull) | Min. 1.5Kg | 10cm wire inserted into eye, bent and wound |
| Flexure Strength | No damage to dielectric | Solder to substrate, bend substrate by 2mm and return |
| Resistance to Solvent Test | No case deformation, appearance change, or marking alteration | Withstand 6 minutes of alcohol |
| Temperature Characteristic | Appearance: No damage, Inductance: Within 10% of initial value | -55 ~ +125 |
| Humidity Test | - | 602 / 962 HOURS, R.H: 90-95%RH |
| Low Temperature Storage | - | -552 for 962 HOURS |
| Thermal Shock Test | - | -555 (30 min) -> +1255 (30 min), 10 Cycles |
| High Temperature Storage | - | 1202 (with applied current) |
| Life Test (High Temp Load) | No evidence of short or open circuit | 1252, 50012 HOURS, Allowed DC Current |
| Life Test (Humidity Load) | - | 602, 90-95% RH, 50012 HOURS, Allowed DC Current |
| Iron Soldering Profile | - | Power: Max.30W, Preheat: 150/60sec, Solder Time: 3sec. Max., Max. 1 time |
| Packaging (Reel) | Reel Dimensions: 330mm (A), 21mm (B0.8), 13mm (C0.5), 16.5mm (G), 100mm (N), 21mm (T) | QTY per Reel: 800 PCS |
| Packaging (Tape) | Peel Force: 0.1N to 1.0N (8mm tape), 0.1N to 1.3N (12mm-56mm tape) | Peel Speed: 300mm/min10mm/min |
| Package Quantity (Inner Box) | 2 Reels (1600 PCS) | Inner Box Dimension: 34*34*6.5cm |
| Package Quantity (Carton) | 2 Inner Boxes (3200 PCS) | Carton Dimension: 36.5*35.5*14.5cm |
| Storage Conditions | <40 and <70% RH. Use within 6 months. Avoid chlorine/sulfur atmosphere. | - |
| Transportation | Handle with care, avoid damage/contamination. Use tweezers/vacuum pickup. Minimize abrasion/shock. | - |
2509161435_XR-XRFWHP0660A-2R2M_C51913001.pdf
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