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Specifications
Current Rating:
2.2A
Inductance:
10uH
Tolerance:
±20%
DC Resistance(DCR):
210mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
2.3A
Mfr. Part #:
XRTC322512S100MBCA
Package:
1210
Key Attributes
Model Number:
XRTC322512S100MBCA
Product Description
Product Overview
The XRTC322512S100MBCA is a Mini Molding Power Inductor designed for high current and low loss applications. It features a metal dust core for high performance (Isat), low Rdc for reduced losses, and a closed magnetic circuit to minimize leakage flux. The product offers enhanced surface compactness due to its vinyl thermal spray coating and complies with environmental regulations including RoHS2.0 and Halogen standards.
Product Attributes
- Brand: Dongguan Xiangru Electronics Co., Ltd.
- Origin: China
- Material: Metal dust core, Vinyl thermal spray coating
- Color: Black
- Certifications: RoHS2.0, Halogen, Reach, QESP-44
Technical Specifications
| P/N | L0(H) @ 1MHz | Rdc(mTypical | Rdc(mMax | Irms(A) Typical | Irms(A) Max | Isat(A) Typical | Isat(A) Max |
| XRTC322512S100MBCA | 10.0 | 2.2 | 2.3 | 1.8 | 1.9 | 2.1 | 2.3 |
Dimensions
| Series | L(mm) | W(mm) | H(mm) | Tolerance |
| XRTC322512S | 3.20.2 | 2.50.2 | 1.20Max. | S=0.2mm |
Reliability
| Item | Requirements | Test Methods and Remarks |
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 12 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553)and (1253)for (303) , different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 10% | a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 Pc-b LbLc 100% Pc-dLdLc 100% Lc Lc |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Life | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing |
Application Scenarios
- DC/DC converters.
- Pad, Smart phone.
- Portable gaming devices, Smart wear, Wi-Fi module.
- Notebooks, VR, AR.
- LCD displays, HDDs, DVCs, DSCs, etc.
- Baseband power supply, Amplifier, Power management, Module power supply, Camera power management.
2410121730_XR-XRTC322512S100MBCA_C39846661.pdf
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