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Specifications
Current Rating:
9.2A
Inductance:
220nH
Tolerance:
±20%
DC Resistance(DCR):
6.6mΩ
Type:
Molded Inductor
Current - Saturation(Isat):
11A
Mfr. Part #:
XRIM322512SR22MBCA
Package:
1210
Key Attributes
Model Number:
XRIM322512SR22MBCA
Product Description
Product Overview
The XRIM322512SR22MBCA is a Mini Molding Power Inductor designed for high-current, low-loss applications. It features a metal dust core for high performance (Isat), low Rdc for reduced loss, and a closed magnetic circuit to minimize leakage flux. The inductor is constructed with vinyl thermal spray for enhanced surface compactness and is environmentally compliant with RoHS2.0, Halogen, and REACH standards.
Product Attributes
- Brand: DONGGUAN XIANGRU ELECTRONICS CO.,LTD
- Product Name: Mini Molding Power Inductors
- Model: XRIM322512SR22MBCA
- Origin: China
- Color: Black
- Certifications: RoHS2.0, Halogen, REACH
Technical Specifications
| P/N | Inductance L0 (H) @ 1MHz (0A) | Rdc (m) Typical | Rdc (m) Max | Heat Rating Current Irms (A) Typical | Heat Rating Current Irms (A) Max | Saturation Current Isat (A) Typical | Saturation Current Isat (A) Max | Dimensions (LWH) mm | Tolerance |
| XRIM322512SR22MBCA | 0.22 | 6.6 | 10 | 9.2 | 8.7 | 11.5 | 11.0 | 3.22.51.2 | 20% |
Features
- Metal material for large current and low loss.
- High performance (Isat) realized by metal dust core.
- Low loss realized with low Rdc.
- Closed magnetic circuit design reduces leakage flux.
- Vinyl thermal spray, better surface compactness.
- Environmental requirements must comply with the QESP-44 document.
- 100% lead (Pb) free meet RoHS2.0 and Halogen, Reach and other legal and regulatory requirements standard.
Application
- DC/DC converters.
- Pad, Smart phone.
- Portable gaming devices, Smart wear, Wi-Fi module.
- Notebooks, VR, AR.
- LCD displays, HDDs, DVCs, DSCs, etc.
- Baseband power supply, Amplifier, Power management, Module power supply, Camera power management.
Ordering Procedure
XRIM 3225 12 S R22 M B C A
- Series Name: Mini Molding Power Inductors
- External Dimensions (LW): 3225 = 3.2*2.5 mm
- External Dimensions (H): 12 = 1.2 mm
- Size Tolerance: S = 0.2mm
- Inductance value: R22 = 0.22uH
- Tolerance: M = 20%
- Coating color: B = Black
- Product type: C = Common
- Special define: A = Routine
Shape and Dimensions
| Series | L (mm) | W (mm) | E (mm) | T (mm) | H (mm) | A (mm) | B (mm) | C (mm) |
| XRIM322512S | 3.20.2 | 2.50.2 | 1.050.2 | 1.20Max. | 1.00.2 | 3.20 | 0.90 | 2.50 |
Reliability
| Item | Requirements | Test Methods and Remarks |
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of lateral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base with 0.3mm solder. And then aplomb electrode way plus tax 12 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -552. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b, Pc-d: Within 10% | a+20 b: -40 c: +20 d: +125 e: +20 Pc-b = (Lb-Lc)/Lc 100% Pc-d=(Ld-Lc)/Lc 100% |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH at (602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Life | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be stored at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation)
Recommend Reflow Soldering Profile: (solder : Sn96.5 / Ag3 / Cu0.5)
| Profile Feature | Lead (Pb)-Free solder | Preheat: Temperature Min (Tsmin) | Preheat: Temperature Max (Tsmax) | Preheat: Time (Tsmin to Tsmax) (ts) | Average ramp-up rate: (Ts max to Tp) | Time maintained above: Temperature (TL) | Time maintained above: Time (tL) | Peak Temperature (Tp) | Time within +0 of actual peak Temperature (tp) -5 +2 | Ramp-down Rate | Time 25 to Peak Temperature | Allowed Re-flow times |
| Value | 150 | 200 | 60 -120 seconds | 3/ second max. | 217 | 60-150 seconds | 260 | 10 seconds | 6/second max. | 8 minutes max. | 2 times |
Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.
Packing
Dimension of plastic taping (Unit: mm)
| Series | W | A0 | B0 | D0 | D1 | E | Tolerance |
| 322512 | 8.00.10 | 2.90+0.10/-0.05 | 3.50+0.10/- 0.05 | 1.5 | 1.0 | 1.75 | / / / +0.1/-0 0.20 0.10 |
| Series | F | K0 | P0 | P2 | P1 | T | Package Quantity | Tolerance |
| 322512 | 3.5 | 1.350.10 | 4.0 | 2.0 | 4.0 | 0.25 | 3K | 0.10 / 0.10 0.10 0.10 0.05 |
Dimension of Reel (Unit: mm)
Note
- Recommend products store in warehouse with temperature between 15 to 35 under humidity between 25 to 75%RH. Even under storage conditions recommended above, solder ability of products will be degraded stored over 1 year old.
- Cartons must be placed in correct direction which indicated on carton, otherwise the reel or wire will be deformed.
- Storage conditions as below are inappropriate:
- a. Stored in high electrostatic environment
- b. Stored in direct sunshine, rain, snow or condensation.
- c. Exposed to sea wind or corrosive gases, such as Cl2, H2S, NH3, SO2, NO2, etc.
- The products are used in circuit board thickness greater than 1.6mm. If customers use less than the thickness of the circuit board that you should confirm with the company, in order to recommend a more suitable product.
Record
| Version | Description | Page | Date | Amended by | Checked by |
| A0 | First version | 1~5 | Nov.6.2023 | Chen.Zhang | Congdian.Lu |
2504101957_XR-XRIM322512SR22MBCA_C39846652.pdf
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