Product Overview
The STE series offers Metal Foil Current Sensing Resistors designed for precise current measurement. These resistors are available in various sizes (0603, 0805, 1206, 2010, 2512, 3921, 4527) and are constructed with a metal foil resistive element on an alumina ceramic substrate. They are suitable for applications requiring accurate current sensing with excellent stability and reliability.
Product Attributes
- Brand: STE Series
- Material: MnCu alloy, Alloy, Special
- Substrate: Alumina Ceramic
- Protective Coating Color: Green (UL-94-V0)
- Marking Coating Color: Black (UL-94-V0)
Technical Specifications
| Part Number Series | Resistance Value (m) | Power Rating (Watt) | Resistance Tolerance (%) | TCR (ppm) | Dimensions (W x L x T, mm) | Terminal Electrode Material |
| STE0603*W50-series | R005~R60 | 0.5 | 0.5%(D) / 1%(F) | 50 / 100 | 0.900.20 x 1.700.20 x 0.650.20 | Sn, Ni, Cu |
| STE0805*W75-series | R003~R200 | 0.75 | 0.5%(D) / 1%(F) | 50 / 100 | 1.350.20 x 2.100.20 x 0.650.20 | Sn, Ni, Cu |
| STE1206*1W0-series | R003~R400 | 1.0 | 0.5%(D) / 1%(F) | 50 / 100 | 1.700.20 x 3.300.20 x 0.650.20 | Sn, Ni, Cu |
| STE2010*1W5-series | R002~R400 | 1.5 | 0.5%(D) / 1%(F) | 50 / 100 | 2.600.20 x 5.100.20 x 0.650.20 | Sn, Ni, Cu |
| STE2512*2W0-series | R002~R400 | 2.0 | 0.5%(D) / 1%(F) | 50 / 100 | 3.200.30 x 6.400.30 x 0.650.20 | Sn, Ni, Cu |
| STE3921*3W0-series | R002~R100 | 3.0 | 0.5%(D) / 1%(F) | 50 / 100 | 5.100.30 x 11.100.30 x 0.650.20 | Sn, Ni, Cu |
| STE4527*4W0-series | R002~R100 | 4.0 | 0.5%(D) / 1%(F) | 50 / 100 | 7.101.0 x 11.601.0 x 0.650.30 | Sn, Ni, Cu |
Reliability Test Standards
| Parameter | Conditions | Requirements | Standard |
| Short Time Over Load | P= 2.5Pr ; T=252C , t = 5sec. | (1.0%+0.5m) | IEC60115-1 4.13 |
| High Temp. Exposure | T = +1702C ; t = 1000h | (1.0%+0.5m) | IEC60115-1 4.25 |
| Low Temp. Storage | T = -552C ; t = 1000h | (1.0%+0.5m) | IEC60115-1 4.25 |
| Moisture Load Life | 6095RH Vtest = Vmax ; T=602C ; RH=95% ; t= 90min ON , 30min OFF , 1000h | (2.0%+0.5m) | IEC60115-1 4.25 |
| Thermal Shock | [-55C 30min. R.T. 3min. +155C 30min. R.T. 3min ], 100 Cycles | (1.0%+0.5m) | IEC60115-1 4.19 |
| Load Life at 70C | Vtest = Vmax ; T=702C ;t= 90min ON , 30min OFF,1000h | (2%+0.5m) | IEC60115-1 4.25 |
| Solderability | Dip into solder at T = 2455C , t = 30.5sec. | The covered area >95% | IEC60115-1 4.17 |
| Resistance to Solder Heat | Through Reflow T= 2755C , t =201sec. | (1.0%+0.5m) | IEC60115-1 4.18 |
| Mechanical Shock | a =100G , t =11ms, 5 times shock | (1.0%+0.5m) | IEC60115-1 4.21 |
| Substrate Bending | Span:90mm ; Bend Width:2mm ; Test board: Glass-Epoxy Board ; Thickness =1.6mm | (1.0%+0.5m) | IEC60115-1 4.33 |
Environmental Characteristics
- Operating Temperature: -55155
- Storage Conditions: Under airtight in temperature+1040, relative humidity 75% for 2 years. Without dew in temperature+1060, relative humidity 95% for 30 days.
Recommended Soldering Parameters
Wave Solder Temperature Profile
Preheating: 100~130, max.100 sec.
Soldering: 250~265 max. 10 sec.
Maximum temperature: 2605, max. 10sec.
Solder Reflow Temperature Profile
Preheating: 145 15, max.120 sec.
Soldering: min. 220, max. 60 sec.
Maximum temperature: 2605, max. 10sec.
2410121318_Walter-Elec-STE2512S2W0R200F_C201330.pdf
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