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Specifications
Power(Watts):
1W
Resistance:
2mΩ
Voltage Rating:
-
Type:
Current Sense Resistor
Tolerance:
±1%
Mfr. Part #:
HFCL1206M1W0R002F
Package:
1206
Key Attributes
Model Number:
HFCL1206M1W0R002F
Product Description
Product Overview
The HFCL0603/1206-series are Metal Foil Current Sensing Resistors designed for accurate current measurement. These resistors utilize a MnCu alloy for the resistive element, offering stable performance. They are suitable for applications requiring precise current detection and are available in various sizes and resistance values.
Product Attributes
- Brand: HFCL
- Material: MnCu alloy (Resistive element), Alumina Ceramic (Substrate), Epoxy (Adhesion/Coating), Sn/Ni/Cu (Terminal electrode)
- Color: Green (Protective coating), White/Black (Marking coating)
- Certifications: UL-94-V0 (Flame-retardant epoxy)
Technical Specifications
| Part Number Series | Size | Nominal Resistance Value | Power Rating (Watt) | Resistance Tolerance (%) | TCR (ppm) | Dimensions (mm) W x L |
|---|---|---|---|---|---|---|
| HFCL0603MW33-series | 0603 | R001~R025 (1~4m, 5~25m) | 0.33 | 1%(F) (1~4m), 50 (5~25m) | 100 (1~4m), 50 (5~25m) | 1.600.20 x 0.800.15 |
| HFCL1206M1W0-series | 1206 | 0M50~R025 (0.5~0.75, 1~4, 5~25) | 1.0 | 1%(F) (0.5~0.75, 1~4), 0.5%(D) / 1%(F) (5~25) | 150 (0.5~0.75), 100 (1~4), 50 (5~25) | 3.200.20 x 1.550.20 |
Product Characteristics and Reliability Test Standards
| Parameter | Conditions | Acceptance Criteria | Test Method |
|---|---|---|---|
| Short Time Over Load | P=2.5Pr; T=252C, t=5sec. | 1.0% | IEC60115-1 4.13 |
| High Temp. Exposure | T=+1702C, t=1000h | 1.0% | IEC60115-1 4.25 |
| Low Temp. Storage | T=-552C, t=1000h | 1.0% | IEC60115-1 4.25 |
| Moisture Load Life (60, 95%RH) | Vtest=Vmax; T=602C; RH=95%; t=90min ON, 30min OFF, 1000h | 2.0% | IEC60115-1 4.25 |
| Thermal Shock | -553C to 1253C (30 min dwell, 1 min transition), 1000 cycles | 1.0% | JESD22-A-104 |
| Load Life at 70C | Vtest=Vmax; T=702C; t=90min ON, 30min OFF, 1000h | 1.0% | IEC60115-1 4.25 |
| Solderability | Dip into solder at T=2455C, t=30.5sec. | Covered area >95% | IEC60115-1 4.17 |
| Resistance to Solder Heat | 1 reflow cycle (JEDEC J-STD-020), then dip T=260C, t=10 sec. | Meet initial specifications | JEDEC J-STD-020 |
| Mechanical Shock | a=100G, t=11ms, 5 shocks | 1.0% | IEC60115-1 4.21 |
| Substrate Bending | Span=90mm, Bend=2mm, Board=Glass-Epoxy, Thickness=1.6mm | 1.0% | IEC60115-1 4.33 |
Environmental Characteristics
- Operating Temperature Range: -55155
- Storage Conditions: 2 years under airtight conditions (+1040, 75% RH); 30 days without dew (+1060, 95% RH)
Solder Pad Size and Welding Conditions
Recommended Solder Pad Dimensions
| Part Number | P (mm) | W (mm) | D (mm) | V (mm) | E (mm) | Loading (W) |
|---|---|---|---|---|---|---|
| HFCL0603MW33-series | 0.35 | 1.30 | 0.40 | 0.40 | 0.20 | 0.33W |
| HFCL1206M1W0-series | 0.762 | 2.29 | 1.014 | 0.762 | 0.381 | 1.00W |
Recommended Customer Soldering Parameters
- Wave Solder Temperature Profile: Preheating: 100~130 (max. 100 sec); Soldering: 250~265 (max. 10 sec); Max Temp: 2605 (max. 10 sec)
- Solder Reflow Temperature Profile: Preheating: 145 15 (max. 120 sec); Soldering: min. 220 (max. 60 sec); Max Temp: 2605 (max. 10 sec)
- Rework (Hot Air): 350, 3~5 seconds
- Recommended Reflow Methods: IR, vapor phase oven, hot air oven
Packaging Information
Quantity & Weight
| Type Number | Quantity (pcs) | Weight (g) |
|---|---|---|
| HFCL0603MW33-series | 5,000 | 13040 |
| HFCL1206M1W0-series | 5,000 | 16040 |
Reel & Tape Specifications
| Type Number | A5 (mm) | N2 (mm) | W11 (mm) |
|---|---|---|---|
| HFCL0603MW33-series | 178 | 60 | 9.0 |
| HFCL1206M1W0-series | 178 | 60 | 9.0 |
- Peeling Strength of Seal Tape: 0.1 1.0N (10 - 100gf)
2410121323_Walter-Elec-HFCL1206M1W0R002F_C970966.pdf
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