HFCL0603/1206-series Current Sensing Resistor
The HFCL0603/1206-series are metal foil current sensing resistors designed for precise current measurement. These components utilize a MnCu alloy resistive element and are constructed with an alumina ceramic substrate, epoxy adhesion layer, and robust terminal electrodes. The protective and marking coatings are made of flame-retardant epoxy meeting UL-94-V0 requirements.
Product Attributes
- Brand: HFCL
- Material: MnCu alloy (Resistive element)
- Substrate: Alumina Ceramic
- Protective/Marking Coating: Flame-retardant epoxy (UL-94-V0)
- Color: Green (Protective), White/Black (Marking)
Technical Specifications
| Part Number Series | Size (L x W) | Nominal Resistance Range | Power Rating (Watt) | Resistance Tolerance | TCR (ppm) | Operating Temperature Range |
|---|---|---|---|---|---|---|
| HFCL0603MW33-series | 0.800.15 x 1.600.20 mm | R001~R025 (1m~25m) | 0.33W | 1%(F) (1~4m), 50 (5~25m) | 100 (1~4m), 50 (5~25m) | -55155 |
| HFCL1206M1W0-series | 1.550.20 x 3.200.20 mm | 0M50~R025 (0.5m~25m) | 1.0W | 1%(F) (0.5~4m), 0.5%(D)/1%(F) (5~25m) | 150 (0.5~0.75m), 100 (1~4m), 50 (5~25m) | -55155 |
Product Dimensions
| Part Number Series | w (mm) | L (mm) | A (mm) | B (mm) | C (mm) | D (mm) | T (mm) |
|---|---|---|---|---|---|---|---|
| HFCL0603MW33-series | 1.600.20 | 0.800.15 | 0.180.10 | 0.230.10 | 0.400.10 | 0.930.20 | 0.550.10 |
| HFCL1206M1W0-series | 3.200.20 | 1.550.20 | 0.410.20 | 0.460.20 | 0.500.20 | 2.160.20 | 0.500.20 |
Reliability Testing
| Test | Conditions | Acceptance Criteria |
|---|---|---|
| Short Time Over Load | P= 2.5Pr ; T=252C , t = 5sec. | 1.0% |
| High Temp. Exposure | T = +1702C ; t = 1000h | 1.0% |
| Low Temp. Storage | T = -552C ; t = 1000h | 1.0% |
| Moisture Load Life | (60, 95%RH) Vtest = Vmax ; T=602C ; RH=95% ; t= 90min ON , 30min OFF , 1000h | 2.0% |
| Thermal Shock | -553C to 1253C (30 min dwell each temp, 1 min transition), 1000 cycles | 1.0% |
| Load Life at 70C | Vtest = Vmax ; T=702C ;t= 90min ON , 30min OFF,1000h | 1.0% |
| Solderability | Dip into solder at T = 2455C , t = 30.5sec. | Covered area >95% |
| Resistance to Solder Heat | One reflow cycle (JEDEC J-STD-020) followed by dip T= 260C , t =10 sec. | Part must meet initial specifications |
| Mechanical Shock | a =100G , t =11ms, 5 times shock | 1.0% |
| Substrate Bending | Span 90mm, Bend Width 2mm (Glass-Epoxy Board, 1.6mm thickness) | 1.0% |
2411221127_Walter-Elec-HFCL1206M1W00M50F_C970967.pdf
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