Vishay BC Components 150 CRZ Aluminum Electrolytic Capacitors
The Vishay BC Components 150 CRZ series offers polarized aluminum electrolytic capacitors with a non-solid electrolyte, designed for SMD (chip) applications. These capacitors feature a self-healing mechanism and a base plate for SMD mounting, making them lead (Pb)-free reflow solderable. They are characterized by very low impedance and very high ripple current capabilities, making them suitable for demanding applications. The series is charge and discharge proof with no peak current limitation and is available in parts for advanced high-temperature reflow soldering according to JEDEC J-STD-020. Vibration-proof options are available in 4-pin and 6-pin configurations. These capacitors are AEC-Q200 qualified, offering high reliability and low ESR.
Product Attributes
- Brand: Vishay BC components
- Product Line: 150 CRZ
- Type: Aluminum Electrolytic Capacitors
- Form Factor: SMD (Chip), Very Low Z
- Electrolyte: Non-solid, self-healing
- Certifications: AEC-Q200 qualified
- Material Compliance: Lead (Pb)-free reflow solderable, Material categorization available at www.vishay.com/doc?99912
Applications
- SMD technology for high-temperature reflow soldering
- Industrial and professional applications
- Automotive, general industrial, telecom
- Smoothing, filtering, buffering
Marking
- Rated capacitance (in F)
- Rated voltage (in V)
- Date code (in accordance with IEC 60062)
- Cathode indicator: Black mark or - sign
- Group number code: (Z)
Technical Specifications
| Nominal Case Sizes (L x W x H in mm) | Rated Capacitance Range, CR | Tolerance on CR | Rated Voltage Range, UR | Category Temperature Range | Endurance Test at 105 C | Useful Life at 105 C | Useful Life at 40 C (1.8 x IR applied) | Shelf Life at 0 V, 105 C | Climatic Category IEC 60384-18 / CECC 32300 |
|---|---|---|---|---|---|---|---|---|---|
| 8 x 8 x 10 to 18 x 18 x 21 | 4.7 F to 10 000 F | 20 % | 6.3 V to 100 V | 6.3 V to 63 V: -55 C to +105 C; 80 V to 100 V: -40 C to +105 C | 2000 h to 8000 h | 2500 h to 10 000 h | 125 000 h to 500 000 h | 1000 h | 6.3 V to 63 V: 55 / 105 / 56; 80 V to 100 V: 40 / 105 / 56 |
Dimensions and Mass
| Nominal Case Size (L x W x H in mm) | Case Code | LMAX. (mm) | WMAX. (mm) | HMAX. (mm) | D (mm) | BMAX. (mm) | S (mm) | L1MAX. (mm) | Mass (g) |
|---|---|---|---|---|---|---|---|---|---|
| 8 x 8 x 10 | 0810 | 8.5 | 8.5 | 10.5 | 8.0 | 1.0 | 2.2 | 10.2 | 1.0 |
| 10 x 10 x 10 | 1010 | 10.5 | 10.5 | 10.5 | 10.0 | 1.0 | 3.5 | 12.1 | 1.3 |
| 10 x 10 x 12 | 1012 | 10.5 | 10.5 | 12.5 | 10.0 | 1.0 | 3.5 | 12.1 | 1.5 |
| 10 x 10 x 14 | 1014 | 10.5 | 10.5 | 14.3 | 10.0 | 1.0 | 3.5 | 12.1 | 1.5 |
| 12.5 x 12.5 x 13 | 1213 | 12.9 | 12.9 | 14.0 | 12.5 | 1.3 | 3.6 | 14.9 | 2.6 |
| 12.5 x 12.5 x 16 | 1216 | 12.9 | 12.9 | 16.5 | 12.5 | 1.3 | 3.6 | 14.9 | 2.8 |
| 16 x 16 x 16 | 1616 | 16.6 | 16.6 | 17.5 | 16.0 | 1.3 | 6.5 | 18.6 | 5.5 |
| 16 x 16 x 21 | 1621 | 16.6 | 16.6 | 22.0 | 16.0 | 1.3 | 6.5 | 18.6 | 6.0 |
| 18 x 18 x 16 | 1816 | 19.0 | 19.0 | 17.5 | 18.0 | 1.3 | 6.5 | 21.0 | 8.0 |
| 18 x 18 x 21 | 1821 | 19.0 | 19.0 | 22.0 | 18.0 | 1.3 | 6.5 | 21.0 | 8.3 |
Tape and Reel Packaging Quantities
| Nominal Case Size (L x W x H in mm) | Case Code | Pitch P1 (mm) | Tape Width W (mm) | Tape Thickness T2 (mm) | Reel Diameter (mm) | Packaging Quantity Per Reel |
|---|---|---|---|---|---|---|
| 8 x 8 x 10 | 0810 | 16 | 24 | 11.6 | 380 | 500 |
| 10 x 10 x 10 | 1010 | 16 | 24 | 11.6 | 380 | 500 |
| 10 x 10 x 12 | 1012 | 16 | 24 | 12.8 | 330 | 250 |
| 10 x 10 x 14 | 1014 | 16 | 24 | 15.4 | 330 | 250 |
| 12.5 x 12.5 x 13 | 1213 | 20 | 24 | 16.2 | 380 | 250 |
| 12.5 x 12.5 x 16 | 1216 | 24 | 32 | 18.5 | 380 | 200 |
| 16 x 16 x 16 | 1616 | 28 | 44 | 18.9 | 380 | 150 |
| 16 x 16 x 21 | 1621 | 28 | 44 | 23.4 | 380 | 100 |
| 18 x 18 x 16 | 1816 | 32 | 44 | 18.9 | 380 | 125 |
| 18 x 18 x 21 | 1821 | 32 | 44 | 23.4 | 380 | 100 |
Soldering Pad Dimensions
| Case Code | a (mm) | b (mm) | c (mm) | d (mm) | e (mm) | f (mm) |
|---|---|---|---|---|---|---|
| 0810 | 4.4 | 2.5 | 3.0 | - | - | - |
| 1010 | 4.4 | 2.5 | 4.0 | - | - | - |
| 1012 | 4.4 | 2.5 | 4.0 | - | - | - |
| 1014 | 4.4 | 2.5 | 4.0 | - | - | - |
| 1213 | 6.3 | 2.5 | 4.0 | 4.2 | 5.0 | 5.6 |
| 1216 | 6.3 | 2.5 | 4.0 | 4.2 | 5.0 | 5.6 |
| 1616 | 7.8 | 9.6 | 4.7 | - | - | - |
| 1621 | 7.8 | 9.6 | 4.7 | - | - | - |
| 1816 | 8.8 | 9.6 | 4.7 | - | - | - |
| 1821 | 8.8 | 9.6 | 4.7 | - | - | - |
Reflow Soldering Conditions (Lead-Free)
| Profile Features | Case Code 0810 to 1014 | Case Code 1213 to 1216 | Case Code 1010 to 1012 | Case Code 1213 to 1216 | Case Code 1616 to 1821 |
|---|---|---|---|---|---|
| Standard Soldering Profile (Fig. 4) | |||||
| Max. time from 25 C to Tpeak | 240 s | 200 s | - | - | - |
| Max. ramp-up rate to 150 C | 3 K/s | 3 K/s | - | - | - |
| Max. time from 150 C to 200 C (t1) | 150 s | 120 s | - | - | - |
| Ramp up rate from 200 C to Tpeak | 0.5 K/s to 3 K/s | 0.5 K/s to 3 K/s | - | - | - |
| Max. time from 200 C to 217 C (t2) | 60 s | 60 s | - | - | - |
| Max. time above TLiquidus (217 C) (t3) | 90 s | 60 s | - | - | - |
| Max. time above 230 C (t4) | 40 s | 30 s | - | - | - |
| Peak temperature Tpeak | 250 C | 240 C | - | - | - |
| Max. time above Tpeak minus 5 C | 5 s | 10 s | - | - | - |
| Max. ramp-down rate from TLiquidus | 3 K/s to 6 K/s | 3 K/s to 6 K/s | - | - | - |
| Advanced Soldering Profile (JEDEC J-STD-020, Fig. 5) | |||||
| Max. time from 25 C to TPeak | - | - | 300 s | 300 s | 300 s |
| Max. ramp-up rate to 150 C | - | - | 3 K/s | 3 K/s | 3 K/s |
| Max. time from 150 C to 200 C (t1) | - | - | 150 s | 150 s | 150 s |
| Max. time from 190 C to 200 C (t2) | - | - | 110 s | 110 s | 110 s |
| Ramp up rate from 200 C to TPeak | - | - | 0.5 K/s to 3 K/s | 0.5 K/s to 3 K/s | 0.5 K/s to 3 K/s |
| Max. time above TLiquidus (217 C) | - | - | (See Fig. 5) | (See Fig. 5) | (See Fig. 5) |
2410121605_VISHAY-MAL215097412E3_C2166329.pdf
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