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quality Low Resistance Metal Alloy Resistor TT Electronics LRMAP2512-R005FT4 with High Power Rating at 70C factory
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quality Low Resistance Metal Alloy Resistor TT Electronics LRMAP2512-R005FT4 with High Power Rating at 70C factory
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Specifications
Resistance:
5mΩ
Type:
Alloy Resistor
Tolerance:
±1%
Mfr. Part #:
LRMAP2512-R005FT4
Package:
2512
Key Attributes
Model Number: LRMAP2512-R005FT4
Product Description

Low Resistance Metal Alloy Resistor LRMA Series

The LRMA Series Low Resistance Metal Alloy Resistors are designed for high-performance current sensing applications in power electronics. They offer a wide resistance range from 0.5m to 500m, high temperature operation up to 170C, and are available in standard, power, and low thermal EMF versions. These resistors are RoHS compliant, halogen-free, and AEC-Q200 qualified, ensuring reliability and suitability for demanding automotive and industrial environments. Their construction with a low TCR resistance alloy plate and copper electrode with nickel then tin plating contributes to excellent stability and performance.

Product Attributes

  • Brand: TT Electronics (BI Technologies, IRC, Welwyn)
  • Material: Metal Alloy (Cu-Ni / Mn-Cu)
  • Certifications: RoHS compliant & halogen free, AEC-Q200 qualified
  • Color: Not specified
  • Origin: Not specified

Technical Specifications

VersionSizeResistance Range (m)Power Rating @70C (W)Overload Rating (5s) (W)Resistance Tolerance (%)TCR (25 to 125C) (ppm/C)Element Alloy
T (Standard)25121 to 100R01: 2, >R01: 1R01: 10, >R01: 50.51, 1, 5R01: 75Cu-Ni / Mn-Cu
T (Standard)20100.5 to 500R10: 3, >R10: 2R10: 15, >R10: 100.51, 1, 5>R001 & <R01: 100, R 001: 275Cu-Ni
P (Power)25121 to 100R01: 2, >R01: 1R01: 10, >R01: 50.51, 1, 5R01: 75, 100Mn-Cu
M (Low thermal EMF)12060.5 to 50150.51, 1, 5>R001 & <R01: 100, R 001: 275Mn-Cu
M (Low thermal EMF)08050.5 to 500.530.51, 1, 5<R001: 200, R001: 50Mn-Cu / Cu-Ni
M (Low thermal EMF)25121 to 502.5150.51, 1, 550Mn-Cu / Cu-Ni
M (Low thermal EMF)12253 to 302100.51, 1, 550Mn-Cu / Cu-Ni
M (Low thermal EMF)06122 to 40150.51, 1, 550Mn-Cu / Cu-Ni
N (Inverse)08151 to 10150.51, 1, 5R01: 75, 100Cu-Ni / Mn-Cu

Performance Data

ParameterConditionMax (%)Typical (%)
Load at rated power (1000 hours at 70C)R0805: 1.5 Others: 10805: 1 Others: 0.5
Short term overload (5 x rated power for 5s)R0805: 1.5 Others: 0.50805: 1 Others: 0.15
Humidity (1000 hours, 85C, 85%RH)R0.150.15
Temperature cycle (-40 to +125C, 1000 cycles)R0.150.15
Resistance to solder heat (260C for 20s)R0.50.3
Dry heat (1000 hours at 170C)R0.30.3
Low temperature storage (1000 hours at -55C)R0.50.15
Substrate bendingR0.30.3
Insulation resistance1 minute @ 100Vdc>100MN/A
Solderability (245C for 2s)>95% coverageN/AN/A

Physical Data

SizeL (mm)C (mm)t (mm)Wt (mg)
08052.0 0.11.70.20.4 0.25.0
12063.2 0.22.1 0.250.6 0.218.3
06121.25 0.10.5 0.30.5 0.212.9
08152.6 0.20.40.20.6 0.314.1
20103.2 0.20.5 0.20.7 0.235.6
25125.0 0.20.6 0.20.6 0.257 to 63
12253.2 0.30.5 0.20.65 0.2570

Packaging

SizeTape TypeA (mm)B (mm)W (mm)F (mm)E (mm)P1 (mm)P2 (mm)P0 (mm)D0 (mm)t (mm)A (mm)B (mm)C (mm)Wr (mm)Tr (mm)
0612, 1206Paper1.6 0.152.8 0.25.3 0.212 0.055.5 0.051.75 0.14.0 0.12.0 0.054.0 0.050.85 0.152.4 0.28.0 0.23.5 0.051.75 0.14.0 0.1
0805Paper2.0 0.12.8 0.25.3 0.212 0.055.5 0.051.75 0.14.0 0.12.0 0.054.0 0.050.84 0.12.4 0.28.0 0.23.5 0.051.75 0.14.0 0.1
2010Paper2.0 0.12.8 0.25.3 0.212 0.055.5 0.051.75 0.14.0 0.12.0 0.054.0 0.050.84 0.12.4 0.28.0 0.23.5 0.051.75 0.14.0 0.1
0815Emboss2.6 0.24.5 0.212 0.25.5 0.11.75 0.14.0 +-0.12.0 0.24.0 0.11.55 0.051.1 0.1N/AN/AN/AN/AN/A
2512Emboss3.6 0.26.9 0.212 0.25.5 0.051.75 0.14.0 0.12.0 0.054.0 0.051.5 +0.1/-00.85 0.15N/AN/AN/AN/AN/A
1225Emboss3.6 0.26.9 0.212 0.25.5 0.051.75 0.14.0 0.12.0 0.054.0 0.051.5 +0.1/-00.85 0.15N/AN/AN/AN/AN/A

2411272042_TT-Electronics-LRMAP2512-R005FT4_C5116461.pdf

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