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Specifications
Frequency Stability:
±10ppm
Operating Temperature:
-40℃~+125℃
Load Capacitance:
8pF
Frequency:
16MHz
Mfr. Part #:
TZ3604A
Package:
SMD3225-4P
Key Attributes
Model Number:
TZ3604A
Product Description
Crystal Unit SMD 3.2x2.5 16.00MHz
Product Overview: This ultra-miniature, surface-mount crystal unit is designed for wireless communication devices, offering excellent reliability and stability over temperature. Its compact size makes it ideal for applications prioritizing mobility and space-saving designs. The unit is AEC-Q200 compliant and features a hermetic package for enhanced durability.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD. (TST)
- Origin: Taiwan, R.O.C.
- Model Number: TZ3604A
- Certifications: AEC-Q200 compliance, RoHS Compliant, Lead-free
- MSL: Level-1
- Material: Conductive Polystyrene (Tape)
- Color: Black (Tape)
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 16.000000 | MHz | Fundamental |
| Storage Temperature Range | -40 to +125 | C | |
| Operating Temperature Range | -40 to +125 | C | |
| Frequency Stability over Operating Temperature | +/- 30 | ppm | Referred to the value at 25C |
| Frequency Make Tolerance (FL) | +/- 10 | ppm | @ 25C +/- 3C |
| Equivalent Series Resistance (ESR) | 60 | max. | |
| Nominal Drive Level | 50 typical, 200 max | uW | |
| Shunt Capacitance (Co) | 2.0 | pF max. | |
| Load Capacitance (CL) | 8 | pF | |
| Aging | +/-2 | ppm/year | |
| Insulation Resistance | 500 min. | M | /DC 100V |
| Unit Weight | 0.017+/-0.005 | g | |
| Reflow Profile Max Peak Temp. | 260+/-5 | deg C | Time: 10+/-2 sec |
| Reflow Profile Temp. | 217+/-5 | deg C | Time: 90~100 sec |
Mechanical Dimensions
Refer to provided diagrams for Mechanical Dimensions, Land Pattern, and Marking details.
Packing
Quantity: 3K pcs maximum per reel
Reliability Specifications (AEC-Q200)
| Test Name | Test Process / Method | Conditions |
|---|---|---|
| Soldering Heat | EIAJ ED-4701 (IR reflow) -300(301)M(II) | Resistance to Temp./ Duration : 265C /10sec 2 times; Total time : 4min. |
| Vibration | MIL-STD 202G method 204 | Total peak amplitude : 1.5mm; Vibration frequency : 10 to 2000 Hz; Sweep period : 20 minute; Vibration directions : 3 mutually perpendicular |
| Shock | MIL-STD 202G method 213 | Acceleration : 6000g's, +20/-0 %; Duration : 0.3 ms (total 18 shocks); Waveform : Half-sine |
| Solderability | J-STD-002 | Solder Temperature:2655C; Duration time: 50.5 seconds. |
| Thermal Shock | MIL-STD 883G method 1010.8 | -55 (30min) 125 (30min); * cycle time : 1000 times |
| Humidity test | MIL-STD 202G method 103 | Temperature : 85 2 C; Relative humidity : 85%; Duration : 1000 hours |
| Dry heat (Aging test) | MIL-STD 202G method 108A | Temperature : 125 2 C; Duration : 1000 hours |
| Cold resistance (Low Temp Storage) | IEC 60068-2-1 | Temperature : -40 3 C; Duration : 1000 hours |
2410121236_TST-TZ3604A_C5360874.pdf
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