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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Load Capacitance:
12pF
Operating Temperature:
-30℃~+85℃
Equivalent Series Resistance(ESR):
50Ω
Frequency:
32MHz
Mfr. Part #:
TZ0375B
Package:
SMD3225-4P
Key Attributes
Model Number:
TZ0375B
Product Description
TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 3.2x2.5 32.0MHz
Product Overview: A surface mount 3.2mmx2.5mm crystal unit designed for wireless communications devices requiring an ultra-miniature package for mobility. It offers excellent reliability, good frequency perturbation, and stability over temperature.
Product Attributes:
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Model No.: TZ0375B
- Certifications: RoHS Compliant, Lead-free
- Soldering: Lead-free soldering
Technical Specifications:
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 32.000000 | MHz | Fundamental |
| Storage Temperature Range | -40 to +85 | ||
| Operating Temperature Range | -30 to +85 | ||
| Frequency Stability over Operating Temperature | +/- 10 | ppm | (referred to the value at 25C) |
| Frequency Make Tolerance (FL) | +/- 10 | ppm | @ 25C +/- 3C |
| Equivalent Series Resistance (ESR) | 50 | max. | |
| Nominal Drive Level | 10 | uW | |
| Shunt Capacitance (Co) | 3.0 | pF max | |
| Load Capacitance (CL) | 12 pF | ||
| Insulation Resistance | 500 | M min. | /DC 100V |
| Aging | +/-1 | ppm/year | |
| Unit Weight | 0.017+/-0.005 | g | |
Mechanical Dimensions:
Refer to Base 1 and Base 2 drawings for detailed dimensions.
Recommended Land Pattern:
(unit: mm)
Marking:
- Line 1: Frequency (32.00)
- Line 2: TST Logo + Crystal Product Code + Date Code + Traceability code (1 or 2 letters)
The inner vision of Pin#1, Pin#4 side is XTAL blank mounting pad.
Reel Dimensions:
Refer to the provided table for reel dimensions (WK01-WK52).
Tape Dimensions:
Refer to the provided diagram for tape dimensions.
Notes:
- UNIT: mm.
- TOLERANCE ON DIM.: +/-0.1mm.
- MATERIAL: CONDUCTIVE POLYSTYRENE.
- COLOR: BLACK.
- 10 PITCHES CUMULATIVE TOLERANCE: +/-0.2mm.
Packing Quantity/Packing:
3K pcs maximum per reel.
Reflow Profile:
- Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
- Temperature: 217+/-5 deg C; Time: 90~100 sec
Reliability Specifications:
| Test Name | Test Process / Method | Conditions |
|---|---|---|
| Soldering heat (IR reflow) | Resistance to Temp./ Duration : 260C /10sec 2 times | EIAJED-4701 -300(301)M(II) Total time : 4min. |
| Vibration | Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. | MIL-STD 202F method 201A |
| Shock | Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine | MIL-STD 202F method 213C |
| Solderability | Solder Temperature:2655C Duration time: 50.5 seconds. | MIL-STD 883G method 2003 |
| Thermal Shock | Heat cycle conditions -55 (30min) 125 (30min) * cycle time : 10 times | MIL-STD 883G method 1010.7 |
| Humidity test | Temperature : 70 2 C Relative humidity : 90~95% Duration : 96 hours | MIL-STD 202F method 103B |
| Dry heat (Aging test) | Temperature : 125 2 C Duration : 168 hours | MIL-STD 883G method 1008.2 condition C |
| PCT test | Pressure: 2.06kg/cm2 (2.03*105 pa) Temperature : 121 2 C Relative humidity : 100% Duration : 24 hours | EIAJED-4701 B-123A |
2410121245_TST-TZ0375B_C498199.pdf
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