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quality Surface Mount Crystal Unit TST TZ0234D 26 MHz 3.2x2.5mm Hermetic Package for Wireless Communications factory
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quality Surface Mount Crystal Unit TST TZ0234D 26 MHz 3.2x2.5mm Hermetic Package for Wireless Communications factory
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Specifications
Frequency Stability:
±10ppm
Operating Temperature:
-40℃~+85℃
Load Capacitance:
10pF
Frequency:
26MHz
Mfr. Part #:
TZ0234D
Package:
SMD3225-4P
Key Attributes
Model Number: TZ0234D
Product Description

Crystal Unit SMD 3.2x2.5 26.00MHz

This crystal unit, model TZ0234D, is a surface mount 3.2mmx2.5mm hermetic package designed for wireless communications devices. It offers excellent reliability, good frequency perturbation and stability over temperature, and an ultra-miniature package ideal for mobility applications.

Product Attributes

  • Brand: TAI-SAW TECHNOLOGY CO., LTD.
  • Part Number: TZ0234D
  • Origin: Taiwan, R.O.C.
  • Certifications: RoHS Compliant, Lead-free
  • Material: Conductive Polystyrene (for tape)
  • Color: Black (for tape)

Technical Specifications

Specification Value Unit Notes
Nominal Frequency 26.000000 MHz Fundamental
Storage Temperature Range -40 to +105 C
Operating Temperature Range -40 to +85 C
Frequency Stability over Operating Temperature +/- 20 ppm (referred to the value at 25C)
Frequency Make Tolerance (FL) +/- 10 ppm @ 25C +/- 3C
Equivalent Series Resistance (ESR) 60 max.
Nominal Drive Level 10 uW typical 100uW max
Shunt Capacitance (Co) 3.0 pF max
Load Capacitance (CL) 10 pF
Insulation Resistance 500 M min. /DC 100V
Unit Weight 0.017+/-0.005 g

Mechanical Dimensions

Refer to the provided diagrams for mechanical dimensions and recommended land patterns.

Marking

Line 1: Frequency (26.000)
Line 2: TST Logo + Crystal Product Code + Date Code + Traceability code (1 or 2 letters)

Packing and Reliability

Packing Quantity: 3K pcs maximum per reel.

Reflow Profile: Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec. Temperature: 217+/-5 deg C; Time: 90~100 sec.

Reliability Specifications: Tested according to EIAJED-4701, MIL-STD 202F, MIL-STD 883G standards for Soldering heat, Vibration, Shock, Solderability, Thermal Shock, Humidity test, Dry heat, and PCT test.


2410121231_TST-TZ0234D_C501802.pdf

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