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Specifications
Mfr. Part #:
TZ2746B
Key Attributes
Model Number:
TZ2746B
Product Description
TAI-SAW TECHNOLOGY CO., LTD. - TZ2746B Crystal Unit
The TZ2746B is a surface mount 3.2mmx2.5mm crystal unit designed for wireless communications devices, particularly where an ultra-miniature package is required for mobility. It offers excellent reliability, good frequency perturbation, and stability over temperature.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Model No.: TZ2746B
- Origin: Taiwan, R.O.C.
- Certifications: RoHS Compliant, Lead-free
Technical Specifications
| Specification | Value | Notes |
|---|---|---|
| Nominal Frequency | 40.000000 MHz | Fundamental Mode of Oscillation |
| Storage Temperature Range | -40C to +105C | |
| Operating Temperature Range | -20C to +95C | |
| Frequency Stability over Operating Temperature | +/- 15 ppm | Referred to 25C (for -20C to +95C) |
| Frequency Stability over Operating Temperature | +/- 10 ppm | Referred to 25C (for -10C, @95C) |
| Frequency Make Tolerance (FL) | +/- 10 ppm | @ 25C +/- 3C |
| Equivalent Series Resistance (ESR) | 30 max. | |
| Nominal Drive Level | 100W max | |
| Shunt Capacitance (Co) | 3.0 pF max | |
| Load Capacitance (CL) | 11.5 pF | |
| Aging | +/-1ppm | |
| Insulation Resistance | 500 M min. | /DC 100V |
| Marking | Laser Marking | Line 1: Frequency (40.00), Line 2: TST Logo + Crystal Product Code + Date Code + Traceability code |
| Unit Weight | 0.017+/-0.005 g | |
| Soldering | Lead-free soldering | |
| Packing Quantity/Packing | 3K pcs maximum per reel |
Reflow Profile
| Parameter | Temperature | Time |
|---|---|---|
| Max Peak Temperature | 260+/-5 deg C | 10+/-2 sec |
| Temperature | 217+/-5 deg C | 90~100 sec |
Reliability Specifications
| Test Name | Test Process / Method | Conditions |
|---|---|---|
| Soldering heat | EIAJ ED-4701 (IR-reflow) | 260C /10sec 2 times |
| Vibration | MIL-STD 202F method 201A | Total peak amplitude: 1.5mm; Frequency: 10 to 55 Hz; Sweep period: 1.0 minute; Duration: 2 hr / direction |
| Shock | MIL-STD 202F method 213C | Acceleration: 3000g's, +20/-0 %; Duration: 0.3 ms (total 18 shocks); Waveform: Half-sine |
| Solderability | MIL-STD 883G method 2003 | Solder Temperature: 2655C; Duration time: 50.5 seconds. |
| Thermal Shock | MIL-STD 883G method 1010.7 | -55 (30min) 125 (30min); cycle time: 10 times |
| Humidity test | MIL-STD 202F method 103B | Temperature: 70 2 C; Relative humidity: 90~95%; Duration: 96 hours |
| Dry heat | MIL-STD 883G method 1008.2 condition C | Temperature: 125 2 C; Duration: 168 hours |
| PCT test | EIAJ ED-4701 B-123A | Pressure: 2.06kg/cm2 (2.03*105 pa); Temperature: 121 2 C; Relative humidity: 100%; Duration: 24 hours |
2410311145_TST-TZ2746B_C22237117.pdf
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