Product Overview
The TAI-SAW TECHNOLOGY CO., LTD. TZ3375C is a crystal unit featuring a surface mount hermetic package with excellent reliability and good frequency perturbation and stability over temperature. Its ultra-miniature package makes it ideal for mobility applications, particularly in wireless communications devices. This product is RoHS compliant and lead-free.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Part Number: TZ3375C
- Origin: Taiwan, R.O.C.
- Certifications: RoHS Compliant, Lead-free
- Moisture Sensitivity Level (MSL): Level-1
Technical Specifications
| Model No. | Nominal Frequency | Mode of Oscillation | Storage Temperature Range | Operating Temperature Range | Frequency Stability over Operating Temperature Range | Frequency Make Tolerance (FL) | Equivalent Series Resistance (ESR) | Nominal Drive Level | Shunt Capacitance (Co) | Load Capacitance (CL) | Aging | Insulation Resistance | Unit Weight |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TZ3375C | 32.000000 MHz | Fundamental | -40C to +105C | -40C to +85C | +/-15 ppm (-30C to +85C) +/-20 ppm (-40C to +85C) | +/-10 ppm @ 25C +/- 3C | 50 max | 100uW typical and 200uW max | 3.0 pF max | 6 pF | +/-2ppm/year | 500 M min./DC 100V | 5.7mg+/-0.5mg |
Mechanical Dimensions
Dimensions (mm): [Image/Diagram would be here if available in source]
Recommended Land Pattern: (unit: mm) [Image/Diagram would be here if available in source]
Marking
Line 1: XX; Frequency (32)
Line 2: T; Traceable Code + D; Date Code of Year/Month
Date Code Table
[Table data would be here if available in source]
Reel Dimensions
[Image/Diagram would be here if available in source]
Tape Dimensions
[Image/Diagram would be here if available in source]
Notes:
1. Unless otherwise specified tolerance on dimension +/-0.1 mm.
2. Material: conductive polystyrene with color black.
3. 10 pitch cumulative tolerance +/-0.2 mm.
Packing Quantity/Packing
3K pcs maximum per reel
Reflow Profile
Notes:
1. Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
2. Temperature: 217+/-5 deg C; Time: 90~100 sec
Reliability Specifications
| Test Name | Test Process / Method | Reference |
|---|---|---|
| Soldering heat | Resistance to Temp./ Duration : 265C /10sec 2 times (IR reflow) | EIAJ ED-4701 (IR-reflow) -300(301)M(II) |
| Vibration | Total peak amplitude : 1.5mm Vibration frequency : 10 to 2000 Hz Sweep period : 20 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. | MIL-STD 202G method 204 |
| Shock | Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine | MIL-STD 202G method 213 |
| Solderability | Solder Temperature:2655C Duration time: 50.5 seconds. | J-STD-002 |
| Thermal Shock | Heat cycle conditions: -40 (30min) 85 (30min) Cycle time : 10 times | MIL-STD 883G method 1010.8 |
| Humidity test | Temperature : 85 2 C Relative humidity : 85% Duration : 96 hours | MIL-STD 202G method 103 |
| Dry heat (Aging test) | Temperature : 125 2 C Duration : 168 hours | MIL-STD 202G method 108A |
| Cold resistance (Low Temp Storage) | Temperature : -40 2 C Duration : 96 hours | IEC 60068-2-1 |
2410121245_TST-TZ3375C_C5360882.pdf
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