<
>
Specifications
Frequency Stability:
-6ppm~+8ppm
Load Capacitance:
8.8pF
Operating Temperature:
-30℃~+85℃
Frequency:
48MHz
Mfr. Part #:
TZ3639A
Package:
SMD2016-4P
Key Attributes
Model Number:
TZ3639A
Product Description
TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 2.0x1.6 48.0MHz
Product Description: This is a surface mount 2.0mmx1.6mm crystal unit designed for wireless communications devices, particularly where an ultra-miniature package is required for mobility. It offers excellent reliability performance, good frequency perturbation, and stability over temperature.
Product Attributes:
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Origin: Taiwan, R.O.C.
- Product Type: Crystal Unit
- Package Type: SMD 2.0x1.6
- MSL: Level-1
Technical Specifications
| Model No. | Nominal Frequency | Mode of Oscillation | Storage Temperature Range | Operating Temperature Range | Frequency Stability over Operating Temperature Range | Frequency Make Tolerance (FL) | Equivalent Series Resistance (ESR) | Nominal Drive Level | Shunt Capacitance (Co) | Motional Capacitance (C1) | Motional Inductance (L1) | Load Capacitance (CL) | Aging | Frequency Perturbation | Frequency drift after reflow | Insulation Resistance | Marking | Unit Weight |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TZ3639A | 48.000000 MHz | Fundamental | -40C to +125C | -30C to +85C | +/-10 ppm (referred to the value at 25C) | -6 ~ +8 ppm @ 25C +/- 3C | 22 max | 0.01uW min and 100uW max | 0.5 pF min and 1.5 pF max | 2.0 pF min and 5.0 pF max | 2.0 mH min and 4.0 mH max | 8.8 pF | -2~0 ppm / 5 years | +/-1 ppm | +/-2 ppm | 500 M min./DC 100V | Laser Marking | 5.7mg+/-0.5mg |
Reflow Profile:
- Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
- Temperature: 217+/-5 deg C; Time: 90~100 sec
Reliability Specifications:
- Soldering heat (EIAJED-4701): 265C /10sec 2 times
- Vibration (MIL-STD 202G method 204): Total peak amplitude: 1.5mm, Frequency: 10 to 2000 Hz, Sweep period: 20 minute, Directions: 3 mutually perpendicular, Duration: 2 hr / direc.
- Shock (MIL-STD 202G method 213): Acceleration: 3000g's, +20/-0 %, Duration: 0.3 ms (total 18 shocks), Waveform: Half-sine
- Solderability (J-STD-002): Solder Temperature: 2655C, Duration time: 50.5 seconds.
- Thermal Shock (MIL-STD 883G method 1010.8): -40 (30min) 85 (30min), 10 cycles
- Humidity test (MIL-STD 202G method 103): Temperature: 85 2 C, Relative humidity: 85%, Duration: 96 hours
- Dry heat (MIL-STD 202G method 108A): Temperature: 125 2 C, Duration: 168 hours
- Cold resistance (IEC 60068-2-1): Temperature: -40 2 C, Duration: 96 hours
2410121247_TST-TZ3639A_C2961681.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
