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quality Surface mount crystal unit TST TZ2625BA4215 32 by 25 millimeters with stable frequency and hermetic packaging factory
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quality Surface mount crystal unit TST TZ2625BA4215 32 by 25 millimeters with stable frequency and hermetic packaging factory
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Specifications
Frequency Stability:
±10ppm
Load Capacitance:
10pF
Operating Temperature:
-40℃~+85℃
Frequency:
27.6MHz
Mfr. Part #:
TZ2625BA4215
Package:
SMD3225-4P
Key Attributes
Model Number: TZ2625BA4215
Product Description

Product Overview

The TZ2625BA4215 is a surface mount 3.2mmx2.5mm crystal unit designed for wireless communications devices, offering an ultra-miniature package for enhanced mobility. It features excellent reliability, good frequency perturbation and stability over temperature, and a hermetic package.

Product Attributes

  • Brand: TAI-SAW TECHNOLOGY CO., LTD. (TST)
  • Origin: Taiwan, R.O.C.
  • Material: Conductive Polystyrene (Tape)
  • Color: Black (Tape)
  • Certifications: EIAJED-4701, MIL-STD 202G, MIL-STD 883G, J-STD-002, IEC 60068-2-1

Technical Specifications

Model No.Nominal FrequencyMode of OscillationStorage Temperature RangeOperating Temperature RangeFrequency Stability over Operating TemperatureFrequency Make Tolerance (FL)Equivalent Series Resistance (ESR)Nominal Drive LevelShunt Capacitance (Co)Load Capacitance (CL)AgingInsulation ResistanceUnit Weight
TZ2625BA421527.600000 MHzFundamental-40C to +85C-40C to +85C+/- 20 ppm (referred to the value at 25C)+/- 10 ppm @ 25C +/- 3C50 max.50uW typical and 200uW max3.0 pF max10 pF+/-2ppm/year500 M min./DC 100V0.017+/-0.005 g
Test NameTest Process / MethodReference StandardConditions
Soldering heatIR-reflowEIAJED-4701 -300(301)M(II)265C /10sec 2 times
VibrationMIL-STD 202G method 204Total peak amplitude : 1.5mm; Vibration frequency : 10 to 2000 Hz; Sweep period : 20 minute; Vibration directions : 3 mutually perpendicular; Duration : 2 hr / direc.
ShockMIL-STD 202G method 213Acceleration : 3000g's, +20/-0 %; Duration : 0.3 ms (total 18 shocks); Waveform : Half-sine
SolderabilityJ-STD-002Solder Temperature:2655C; Duration time: 50.5 seconds.
Thermal ShockMIL-STD 883G method 1010.8-40 (30min) 85 (30min); * cycle time : 10 times
Humidity testMIL-STD 202G method 103Temperature : 85 2 C; Relative humidity : 85%; Duration : 96 hours
Dry heat ( Aging test )MIL-STD 202G method 108ATemperature : 125 2 C; Duration : 168 hours
Cold resistance (Low Temp Storage)IEC 60068-2-1Temperature : -40 2 C; Duration : 96 hours

2410121844_TST-TZ2625BA4215_C2961694.pdf

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