Product Overview
The TAI-SAW TECHNOLOGY CO., LTD. TZ0475B is a crystal unit designed for surface mount applications. It features an ultra-miniature package (3.2mm x 2.5mm) and offers excellent reliability performance with good frequency perturbation and stability over temperature. This product is ideal for wireless communications devices requiring compact solutions.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Origin: Taiwan, R.O.C.
- Certifications: RoHS Compliant, Lead-free
Technical Specifications
| Model No. | Nominal Frequency | Mode of Oscillation | Storage Temperature Range | Operating Temperature Range | Frequency Stability over Operating Temperature Range | Frequency Make Tolerance (FL) | Equivalent Series Resistance (ESR) | Nominal Drive Level | Shunt Capacitance (Co) | Load Capacitance (CL) | Insulation Resistance | Unit Weight |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TZ0475B | 40.000000 MHz | Fundamental | -40C to +85C | -20C to +85C | +/-10 ppm (referred to the value at 25C) | +/-10 ppm @ 25C +/- 3C | 25 max | 100 uW typical, 200uW max. | 5.0 pF max | 15 pF | 500 M min./DC 100V | 0.017+/-0.005 g |
Features
- Surface Mount Hermetic Package
- Excellent Reliability Performance
- Good Frequency Perturbation and Stability over temperature
- Ultra Miniature Package
Applications
Surface mount 3.2mmx2.5mm crystal unit for use in wireless communications devices, especially for a need of ultra miniature package for mobility.
Marking
Line 1: Frequency (40.00)
Line 2: TST Logo + Crystal Product Code + Date Code + Traceability code ( 1 or 2 letters)
Packing Quantity
3K pcs maximum per reel
Reflow Profile
1. Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
2. Temperature: 217+/-5 deg C; Time: 90~100 sec
Reliability Specifications
| Test Name | Test Process / Method | Reference |
|---|---|---|
| Soldering heat | (IR reflow) -300(301)M(II) | Resistance to Temp./ Duration : 265C /10sec 2 times EIAJED-4701 Total time : 4min.(IR-reflow) |
| Vibration | MIL-STD 202G method 204 | Total peak amplitude : 1.5mm Vibration frequency : 10 to 2000 Hz Sweep period : 20 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. |
| Shock | MIL-STD 202G method 213 | Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine |
| Solderability | J-STD-002 | Solder Temperature:2655C Duration time: 50.5 seconds. |
| Thermal Shock | MIL-STD 883G method 1010.8 | Heat cycle conditions -40 (30min) 85 (30min) * cycle time : 10 times |
| Humidity test | MIL-STD 202G method 103 | Temperature : 85 2 C Relative humidity : 85% Duration : 96 hours |
| Dry heat ( Aging test ) | MIL-STD 202G method 108A | Temperature : 125 2 C Duration : 168 hours |
| Cold resistance (Low Temp Storage) | IEC 60068-2-1 | Temperature : -40 2 C Duration : 96 hours |
2410121236_TST-TZ0475B_C501793.pdf
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