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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Operating Temperature:
-40℃~+125℃
Load Capacitance:
8pF
Frequency:
24MHz
Mfr. Part #:
TZ3261C
Package:
SMD2016-4P
Key Attributes
Model Number:
TZ3261C
Product Description
TAI-SAW TECHNOLOGY CO., LTD. - Crystal Unit SMD 2.0x1.6 24.0MHz
Product Description: This document details the TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 2.0x1.6 24.0MHz, model TZ3261C. Designed for wireless communications devices, this ultra-miniature, surface-mount crystal unit offers excellent reliability and good frequency stability over temperature. It is particularly suited for applications requiring compact form factors for mobility.
Features:
- Surface Mount Hermetic Package
- Excellent Reliability Performance
- Good Frequency Perturbation and Stability over temperature
- Ultra Miniature Package
- AEC-Q200 compliance
- Moisture Sensitivity Level (MSL) : Level-1
Applications: Primarily used in wireless communications devices where an ultra-miniature package is essential for mobility.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Part Number: TZ3261C
- Origin: Taiwan, R.O.C.
- Certifications: AEC-Q200 compliance, RoHS Compliant, Lead-free
- Package Type: SMD 2.0x1.6
- Marking: Laser Marking (Line 1: XX; Frequency (24); Line 2: T; Traceable Code + D; date Code of Year/Month)
- Unit Weight: 5.7mg+/-0.5mg
Technical Specifications
| Specification | Value | Notes |
|---|---|---|
| Nominal Frequency | 24.000000 MHz | |
| Mode of Oscillation | Fundamental | |
| Storage Temperature Range | -40C to +125C | |
| Operating Temperature Range | -40C to +125C | |
| Frequency Stability over Operating Temperature Range | +/-50 ppm | (referred to the value at 25C) |
| Frequency Make Tolerance (FL) | +/-10 ppm | @ 25C +/- 3C |
| Equivalent Series Resistance (ESR) | 80 max | |
| Nominal Drive Level | 50uW typical and 200uW max | |
| Shunt Capacitance (Co) | 3.0 pF max | |
| Load Capacitance (CL) | 8 pF | |
| Aging | +/-2 ppm/year | |
| Insulation Resistance | 500 M min. | /DC 100V |
| Soldering | Lead-free soldering | |
| Reflow Profile - Max Peak Temperature | 260+/-5 deg C | Time: 10+/-2 sec |
| Reflow Profile - Temperature | 217+/-5 deg C | Time: 90~100 sec |
Reliability Specifications (AEC-Q200)
| Test Name | Test Process / Method | Conditions |
|---|---|---|
| Soldering heat | EIAJ ED-4701 (IR-reflow) -300(301)M(II) | Resistance to Temp./ Duration : 265C /10sec 2 times; Total time : 4min. |
| Vibration | MIL-STD 202G method 204 | Total peak amplitude : 1.5mm; Vibration frequency : 10 to 2000 Hz; Sweep period : 20 minute; Vibration directions : 3 mutually perpendicular |
| Shock | MIL-STD 202G method 213 | Acceleration : 6000g's, +20/-0 %; Duration : 0.3 ms (total 18 shocks); Waveform : Half-sine |
| Solderability | J-STD-002 | Solder Temperature:2655C; Duration time: 50.5 seconds. |
| Thermal Shock | MIL-STD 883G method 1010.8 | -55 (30min) 125 (30min); cycle time : 1000 times |
| Humidity test | MIL-STD 202G method 103 | Temperature : 85 2 C; Relative humidity : 85%; Duration : 1000 hours |
| Dry heat (Aging test) | MIL-STD 202G method 108A | Temperature : 125 2 C; Duration : 1000 hours |
| Cold resistance (Low Temp Storage) | IEC 60068-2-1 | Temperature : -40 3 C; Duration : 1000 hours |
2410121243_TST-TZ3261C_C18221412.pdf
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