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quality 40MHz Nominal Frequency Crystal Unit SMD 3.2x2.5 TST TZ0308D with Hermetic Surface Mount Package factory
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quality 40MHz Nominal Frequency Crystal Unit SMD 3.2x2.5 TST TZ0308D with Hermetic Surface Mount Package factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Load Capacitance:
9pF
Operating Temperature:
-30℃~+85℃
Equivalent Series Resistance(ESR):
30Ω
Frequency:
40MHz
Mfr. Part #:
TZ0308D
Package:
SMD3225-4P
Key Attributes
Model Number: TZ0308D
Product Description

Product Overview

The TZ0308D is a Crystal Unit SMD 3.2x2.5 with a nominal frequency of 40.000MHz. It features a surface mount hermetic package, excellent reliability, and good frequency stability over temperature. Its ultra-miniature package makes it ideal for mobility applications, particularly in wireless communications devices.

Product Attributes

  • Brand: TAI-SAW TECHNOLOGY CO., LTD.
  • Model No.: TZ0308D
  • Origin: Taiwan, R.O.C.
  • Certifications: RoHS Compliant, Lead-free
  • Material: Conductive Polystyrene (Tape)
  • Color: Black (Tape)

Technical Specifications

Specification Value Unit Notes
Nominal Frequency 40.000000 MHz
Mode of Oscillation Fundamental
Storage Temperature Range -40 to +105 C
Operating Temperature Range -30 to +85 C
Frequency Stability over Operating Temperature +/- 10 ppm (referred to the value at 25C)
Frequency Make Tolerance (FL) +/- 10 ppm @ 25C +/- 3C
Equivalent Series Resistance (ESR) 30 max.
Nominal Drive Level 50 typical / 100 max uW
Shunt Capacitance (Co) 3.0 pF max.
Load Capacitance (CL) 9 pF
Aging +/-2 ppm/year
Insulation Resistance 500 min. M /DC 100V
Unit Weight 0.017+/-0.005 g

Mechanical Dimensions

Refer to page 4 for Mechanical Dimensions and Recommended Land Pattern.

Marking

Line 1: Frequency (40.000)
Line 2: TST Logo + Crystal Product Code + Date Code + Traceability code (1 or 2 letters)

Packing

Maximum 3K pcs per reel.

Reflow Profile

Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
Temperature: 217+/-5 deg C; Time: 90~100 sec

Reliability Specifications

Test Name Test Process / Method
Soldering heat Resistance to Temp./ Duration : 265C /10sec 2 times (IR reflow) EIAJED-4701
Vibration Total peak amplitude : 1.5mm MIL-STD 202G Vibration frequency : 10 to 2000 Hz method 204 Sweep period : 20 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc.
Shock Acceleration : 3000g's, +20/-0 % MIL-STD 202G method 213 Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine
Solderability Solder Temperature:2655C J-STD-002 Duration time: 50.5 seconds.
Thermal Shock -40 (30min) 85 (30min) * cycle time : 10 times MIL-STD 883G method 1010.8
Humidity test Temperature : 85 2 C Relative humidity : 85% MIL-STD 202G method 103 Duration : 96 hours
Dry heat (Aging test) Temperature : 125 2 C MIL-STD 202G Duration : 168 hours method 108A
Cold resistance (Low Temp Storage) Temperature : -40 2 C IEC 60068-2-1 Duration : 96 hours

2410121234_TST-TZ0308D_C379787.pdf

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