Product Overview
The TZ0308D is a Crystal Unit SMD 3.2x2.5 with a nominal frequency of 40.000MHz. It features a surface mount hermetic package, excellent reliability, and good frequency stability over temperature. Its ultra-miniature package makes it ideal for mobility applications, particularly in wireless communications devices.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Model No.: TZ0308D
- Origin: Taiwan, R.O.C.
- Certifications: RoHS Compliant, Lead-free
- Material: Conductive Polystyrene (Tape)
- Color: Black (Tape)
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 40.000000 | MHz | |
| Mode of Oscillation | Fundamental | ||
| Storage Temperature Range | -40 to +105 | C | |
| Operating Temperature Range | -30 to +85 | C | |
| Frequency Stability over Operating Temperature | +/- 10 | ppm | (referred to the value at 25C) |
| Frequency Make Tolerance (FL) | +/- 10 | ppm | @ 25C +/- 3C |
| Equivalent Series Resistance (ESR) | 30 | max. | |
| Nominal Drive Level | 50 typical / 100 max | uW | |
| Shunt Capacitance (Co) | 3.0 | pF | max. |
| Load Capacitance (CL) | 9 | pF | |
| Aging | +/-2 | ppm/year | |
| Insulation Resistance | 500 min. | M | /DC 100V |
| Unit Weight | 0.017+/-0.005 | g | |
Mechanical Dimensions
Refer to page 4 for Mechanical Dimensions and Recommended Land Pattern.
Marking
Line 1: Frequency (40.000)
Line 2: TST Logo + Crystal Product Code + Date Code + Traceability code (1 or 2 letters)
Packing
Maximum 3K pcs per reel.
Reflow Profile
Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
Temperature: 217+/-5 deg C; Time: 90~100 sec
Reliability Specifications
| Test Name | Test Process / Method |
|---|---|
| Soldering heat | Resistance to Temp./ Duration : 265C /10sec 2 times (IR reflow) EIAJED-4701 |
| Vibration | Total peak amplitude : 1.5mm MIL-STD 202G Vibration frequency : 10 to 2000 Hz method 204 Sweep period : 20 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. |
| Shock | Acceleration : 3000g's, +20/-0 % MIL-STD 202G method 213 Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine |
| Solderability | Solder Temperature:2655C J-STD-002 Duration time: 50.5 seconds. |
| Thermal Shock | -40 (30min) 85 (30min) * cycle time : 10 times MIL-STD 883G method 1010.8 |
| Humidity test | Temperature : 85 2 C Relative humidity : 85% MIL-STD 202G method 103 Duration : 96 hours |
| Dry heat (Aging test) | Temperature : 125 2 C MIL-STD 202G Duration : 168 hours method 108A |
| Cold resistance (Low Temp Storage) | Temperature : -40 2 C IEC 60068-2-1 Duration : 96 hours |
2410121234_TST-TZ0308D_C379787.pdf
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