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quality Ultra Miniature Hermetic Crystal Unit 32 MHz Frequency Stability Surface Mount SMD 2.0x1.6 TST TZ3375E factory
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quality Ultra Miniature Hermetic Crystal Unit 32 MHz Frequency Stability Surface Mount SMD 2.0x1.6 TST TZ3375E factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Operating Temperature:
-40℃~+105℃
Load Capacitance:
6pF
Frequency:
32MHz
Mfr. Part #:
TZ3375E
Package:
SMD2016-4P
Key Attributes
Model Number: TZ3375E
Product Description

TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 2.0x1.6 32.0MHz

This is a surface mount 2.0mmx1.6mm crystal unit designed for wireless communications devices, particularly where an ultra-miniature package is required for mobility. It offers excellent reliability, good frequency perturbation and stability over temperature, and features a hermetic package.

Product Attributes

  • Brand: TAI-SAW TECHNOLOGY CO., LTD.
  • Model No.: TZ3375E
  • Part No.: TZ3375E
  • Origin: Taiwan, R.O.C.
  • Certifications: AEC-Q200 compliance, RoHS Compliant, Lead-free
  • MSL: Level-1
  • Package: SMD 2.0x1.6, Ultra Miniature, Hermetic

Technical Specifications

Specification Value Notes
Nominal Frequency 32.000000 MHz Fundamental
Storage Temperature Range -40C to +125C
Operating Temperature Range -40C to +105C
Frequency Stability over Operating Temperature Range +/-20 ppm (referred to the value at 25C)
Frequency Make Tolerance (FL) +/-10 ppm @ 25C +/- 3C
Equivalent Series Resistance (ESR) 20 typical and 60 max
Nominal Drive Level 50uW typical and 200uW max
Shunt Capacitance (Co) 3.0 pF max
Load Capacitance (CL) 6 pF
Variation with load 26 ppm/pF typical
Aging +/-3ppm/year
Insulation Resistance 500 M min. /DC 100V
Unit Weight 5.7mg+/-0.5mg

Reliability Specifications (AEC-Q200)

Test Name Test Process / Method Conditions
Soldering heat EIAJ ED-4701 (IR-reflow) -300(301)M(II) 265C /10sec 2 times
Vibration MIL-STD 202G method 204 Total peak amplitude : 1.5mm, Frequency : 10 to 2000 Hz, Sweep period : 20 minute, Directions : 3 mutually perpendicular
Shock MIL-STD 202G method 213 Acceleration : 6000g's, +20/-0 %, Duration : 0.3 ms (total 18 shocks), Waveform : Half-sine
Solderability J-STD-002 Solder Temperature:2655C, Duration time: 50.5 seconds.
Thermal Shock MIL-STD 883G method 1010.8 -55 (30min) 125 (30min), Cycle time : 1000 times
Humidity test MIL-STD 202G method 103 Temperature : 85 2 C, Relative humidity : 85%, Duration : 1000 hours
Dry heat (Aging test) MIL-STD 202G method 108A Temperature : 125 2 C, Duration : 1000 hours
Cold resistance (Low Temp Storage) IEC 60068-2-1 Temperature : -40 3 C, Duration : 1000 hours

2410121246_TST-TZ3375E_C18221411.pdf

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